JPS494573U - - Google Patents
Info
- Publication number
- JPS494573U JPS494573U JP1972045420U JP4542072U JPS494573U JP S494573 U JPS494573 U JP S494573U JP 1972045420 U JP1972045420 U JP 1972045420U JP 4542072 U JP4542072 U JP 4542072U JP S494573 U JPS494573 U JP S494573U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1972045420U JPS5315268Y2 (ja) | 1972-04-17 | 1972-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1972045420U JPS5315268Y2 (ja) | 1972-04-17 | 1972-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS494573U true JPS494573U (ja) | 1974-01-16 |
JPS5315268Y2 JPS5315268Y2 (ja) | 1978-04-21 |
Family
ID=27920857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1972045420U Expired JPS5315268Y2 (ja) | 1972-04-17 | 1972-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5315268Y2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005317977A (ja) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Ledランプユニット |
-
1972
- 1972-04-17 JP JP1972045420U patent/JPS5315268Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005317977A (ja) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Ledランプユニット |
JP4579761B2 (ja) * | 2004-04-29 | 2010-11-10 | エルジー ディスプレイ カンパニー リミテッド | Ledランプユニット |
Also Published As
Publication number | Publication date |
---|---|
JPS5315268Y2 (ja) | 1978-04-21 |