JP5214121B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5214121B2
JP5214121B2 JP2006214700A JP2006214700A JP5214121B2 JP 5214121 B2 JP5214121 B2 JP 5214121B2 JP 2006214700 A JP2006214700 A JP 2006214700A JP 2006214700 A JP2006214700 A JP 2006214700A JP 5214121 B2 JP5214121 B2 JP 5214121B2
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JP
Japan
Prior art keywords
light emitting
emitting element
emitting device
substrate body
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006214700A
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English (en)
Japanese (ja)
Other versions
JP2008041953A5 (enExample
JP2008041953A (ja
Inventor
晶紀 白石
裕一 田口
啓 村山
昌宏 春原
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006214700A priority Critical patent/JP5214121B2/ja
Priority to US11/882,812 priority patent/US7816690B2/en
Priority to EP07015539.5A priority patent/EP1887635B1/en
Priority to TW096128945A priority patent/TW200810160A/zh
Publication of JP2008041953A publication Critical patent/JP2008041953A/ja
Publication of JP2008041953A5 publication Critical patent/JP2008041953A5/ja
Application granted granted Critical
Publication of JP5214121B2 publication Critical patent/JP5214121B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Led Device Packages (AREA)
JP2006214700A 2006-08-07 2006-08-07 発光装置 Active JP5214121B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006214700A JP5214121B2 (ja) 2006-08-07 2006-08-07 発光装置
US11/882,812 US7816690B2 (en) 2006-08-07 2007-08-06 Light-emitting device
EP07015539.5A EP1887635B1 (en) 2006-08-07 2007-08-07 Light-emitting device
TW096128945A TW200810160A (en) 2006-08-07 2007-08-07 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214700A JP5214121B2 (ja) 2006-08-07 2006-08-07 発光装置

Publications (3)

Publication Number Publication Date
JP2008041953A JP2008041953A (ja) 2008-02-21
JP2008041953A5 JP2008041953A5 (enExample) 2009-08-13
JP5214121B2 true JP5214121B2 (ja) 2013-06-19

Family

ID=38657872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006214700A Active JP5214121B2 (ja) 2006-08-07 2006-08-07 発光装置

Country Status (4)

Country Link
US (1) US7816690B2 (enExample)
EP (1) EP1887635B1 (enExample)
JP (1) JP5214121B2 (enExample)
TW (1) TW200810160A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI353657B (en) * 2007-09-28 2011-12-01 Ind Tech Res Inst An island submount
CN102881812B (zh) * 2011-07-15 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 发光二极管封装结构的制造方法
JP6006525B2 (ja) * 2012-05-15 2016-10-12 スタンレー電気株式会社 半導体発光装置及びそれを用いた灯具
KR101978941B1 (ko) * 2013-01-28 2019-05-15 엘지이노텍 주식회사 발광소자 패키지
KR102153041B1 (ko) * 2013-12-04 2020-09-07 삼성전자주식회사 반도체소자 패키지 및 그 제조방법
WO2020250667A1 (ja) * 2019-06-11 2020-12-17 京セラ株式会社 発光素子基板および表示装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54389B2 (enExample) * 1975-05-06 1979-01-10
JPH0513820A (ja) * 1991-07-02 1993-01-22 Omron Corp 半導体装置
DE4242842C2 (de) * 1992-02-14 1999-11-04 Sharp Kk Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung
DE10006738C2 (de) * 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
US6600231B2 (en) * 2000-05-11 2003-07-29 Mitutoyo Corporation Functional device unit and method of producing the same
DE10163799B4 (de) * 2000-12-28 2006-11-23 Matsushita Electric Works, Ltd., Kadoma Halbleiterchip-Aufbausubstrat und Verfahren zum Herstellen eines solchen Aufbausubstrates
DE10105802A1 (de) * 2001-02-07 2002-08-08 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Reflektorbehaftetes Halbleiterbauelement
JP2003031895A (ja) * 2001-07-13 2003-01-31 Sharp Corp 半導体発光装置およびその製造方法
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
DE10148227B4 (de) * 2001-09-28 2015-03-05 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
JP3912607B2 (ja) * 2002-06-19 2007-05-09 サンケン電気株式会社 半導体発光装置の製法
JP3993475B2 (ja) * 2002-06-20 2007-10-17 ローム株式会社 Ｌｅｄチップの実装構造、およびこれを備えた画像読み取り装置
US7579629B2 (en) * 2003-04-01 2009-08-25 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
JP4192742B2 (ja) * 2003-09-30 2008-12-10 豊田合成株式会社 発光装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
TWI227570B (en) * 2003-12-11 2005-02-01 South Epitaxy Corp Light-emitting diode packaging structure
JP2005203448A (ja) 2004-01-13 2005-07-28 Toyoda Gosei Co Ltd 発光装置
JP4614679B2 (ja) 2004-01-29 2011-01-19 京セラ株式会社 発光装置およびその製造方法ならびに照明装置
JP2006135276A (ja) * 2004-10-04 2006-05-25 Hitachi Ltd 半導体発光素子搭載用パッケージ及びその製造方法
JP2006324324A (ja) * 2005-05-17 2006-11-30 Sumitomo Electric Ind Ltd 発光装置、発光装置の製造方法および窒化物半導体基板

Also Published As

Publication number Publication date
TW200810160A (en) 2008-02-16
EP1887635A3 (en) 2012-12-26
US20080030139A1 (en) 2008-02-07
EP1887635B1 (en) 2017-05-10
US7816690B2 (en) 2010-10-19
JP2008041953A (ja) 2008-02-21
EP1887635A2 (en) 2008-02-13

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