TW200810160A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
TW200810160A
TW200810160A TW096128945A TW96128945A TW200810160A TW 200810160 A TW200810160 A TW 200810160A TW 096128945 A TW096128945 A TW 096128945A TW 96128945 A TW96128945 A TW 96128945A TW 200810160 A TW200810160 A TW 200810160A
Authority
TW
Taiwan
Prior art keywords
light
substrate
emitting element
disposed
substrate body
Prior art date
Application number
TW096128945A
Other languages
English (en)
Chinese (zh)
Inventor
Akinori Shiraishi
Yuichi Taguchi
Kei Murayama
Masahiro Sunohara
Mitsutoshi Higashi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200810160A publication Critical patent/TW200810160A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Led Device Packages (AREA)
TW096128945A 2006-08-07 2007-08-07 Light-emitting device TW200810160A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214700A JP5214121B2 (ja) 2006-08-07 2006-08-07 発光装置

Publications (1)

Publication Number Publication Date
TW200810160A true TW200810160A (en) 2008-02-16

Family

ID=38657872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128945A TW200810160A (en) 2006-08-07 2007-08-07 Light-emitting device

Country Status (4)

Country Link
US (1) US7816690B2 (enExample)
EP (1) EP1887635B1 (enExample)
JP (1) JP5214121B2 (enExample)
TW (1) TW200810160A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI353657B (en) * 2007-09-28 2011-12-01 Ind Tech Res Inst An island submount
CN102881812B (zh) * 2011-07-15 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 发光二极管封装结构的制造方法
JP6006525B2 (ja) * 2012-05-15 2016-10-12 スタンレー電気株式会社 半導体発光装置及びそれを用いた灯具
KR101978941B1 (ko) * 2013-01-28 2019-05-15 엘지이노텍 주식회사 발광소자 패키지
KR102153041B1 (ko) * 2013-12-04 2020-09-07 삼성전자주식회사 반도체소자 패키지 및 그 제조방법
JP7311595B2 (ja) * 2019-06-11 2023-07-19 京セラ株式会社 発光素子基板および表示装置、ならびに表示装置の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54389B2 (enExample) * 1975-05-06 1979-01-10
JPH0513820A (ja) * 1991-07-02 1993-01-22 Omron Corp 半導体装置
DE4242842C2 (de) * 1992-02-14 1999-11-04 Sharp Kk Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung
DE10006738C2 (de) * 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
US6600231B2 (en) * 2000-05-11 2003-07-29 Mitutoyo Corporation Functional device unit and method of producing the same
DE10163799B4 (de) * 2000-12-28 2006-11-23 Matsushita Electric Works, Ltd., Kadoma Halbleiterchip-Aufbausubstrat und Verfahren zum Herstellen eines solchen Aufbausubstrates
DE10105802A1 (de) * 2001-02-07 2002-08-08 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Reflektorbehaftetes Halbleiterbauelement
JP2003031895A (ja) * 2001-07-13 2003-01-31 Sharp Corp 半導体発光装置およびその製造方法
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
DE10148227B4 (de) * 2001-09-28 2015-03-05 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
JP3993475B2 (ja) * 2002-06-20 2007-10-17 ローム株式会社 Ｌｅｄチップの実装構造、およびこれを備えた画像読み取り装置
CN100587560C (zh) * 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
JP4192742B2 (ja) * 2003-09-30 2008-12-10 豊田合成株式会社 発光装置
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
TWI227570B (en) * 2003-12-11 2005-02-01 South Epitaxy Corp Light-emitting diode packaging structure
JP2005203448A (ja) 2004-01-13 2005-07-28 Toyoda Gosei Co Ltd 発光装置
JP4614679B2 (ja) 2004-01-29 2011-01-19 京セラ株式会社 発光装置およびその製造方法ならびに照明装置
JP2006135276A (ja) * 2004-10-04 2006-05-25 Hitachi Ltd 半導体発光素子搭載用パッケージ及びその製造方法
JP2006324324A (ja) * 2005-05-17 2006-11-30 Sumitomo Electric Ind Ltd 発光装置、発光装置の製造方法および窒化物半導体基板

Also Published As

Publication number Publication date
EP1887635A3 (en) 2012-12-26
US7816690B2 (en) 2010-10-19
EP1887635A2 (en) 2008-02-13
EP1887635B1 (en) 2017-05-10
JP5214121B2 (ja) 2013-06-19
JP2008041953A (ja) 2008-02-21
US20080030139A1 (en) 2008-02-07

Similar Documents

Publication Publication Date Title
TW554553B (en) Sub-mount for high power light emitting diode
US7569420B2 (en) Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer
TW200807774A (en) Cooling device for light emitting diode (LED) module and method for fabricating the same
JP4507358B2 (ja) 光半導体素子
CN101621101A (zh) 发光二极管及其制造方法
JP2007528588A (ja) Ｌｅｄ照明光源およびｌｅｄ照明装置
US20110272731A1 (en) Substrate for light emitting element package, and light emitting element package
TW200810160A (en) Light-emitting device
TWM344575U (en) No-wire-bond package structure of LED
CN103579480A (zh) 热电分离的半导体装置与其制造方法
TWI262608B (en) Light emitting device
TW201208108A (en) Chip-type LED package and light emitting apparatus having the same
TW201013969A (en) Package structure of light-emitting diode
TW201023402A (en) A flip-chip light-emitting diode
TW201019496A (en) Substrate for packaging light-emitting device and light-emitting device package body
TWI354383B (en) Light diode package structure
TW201006000A (en) Light emitting diode and method of making the same
TWI313072B (en) Light emitting diode package
TWM436224U (enExample)
TW201013976A (en) Light emitting diode chip
TW200945619A (en) Light source device
TW201347616A (zh) 發光二極體封裝及所使用之ｐｃｂ式散熱基板與其製法
TWI317162B (enExample)
TW200935621A (en) Light emitting diode package structure and light emitting diode packaging method
TWI258871B (en) Improved structure for LED package