201013969 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體封裝結構，特別是有關於一 種藉由改良導電端子之結構及設置以強化散熱效果之發光二極體 封裝結構。 【先前技術】 請參閱第1圖，其係為習知技藝之發光二極體封裝結構之立 G體圖。發光二極體封裝結構包含一封裝體11，一發光二極體12及 複數導電端子13。 封裝體11具有一容置空間m，發光二極體12係設置於容置 空間111内。導電端子13係設置於發光二極體12之兩侧並電性 連接發光二極體12，以供應電能至發光二極體12。因導電端子13 係由金屬材質(銅、銀或金)所製成，所以具有料祕數。因此，201013969 IX. Description of the Invention: [Technical Field] The present invention relates to a light emitting diode package structure, and more particularly to a light emitting diode package with improved heat dissipation effect by improving the structure and arrangement of conductive terminals structure. [Prior Art] Please refer to Fig. 1, which is a perspective view of a light-emitting diode package structure of the prior art. The LED package structure comprises a package body 11, a light-emitting diode 12 and a plurality of conductive terminals 13. The package body 11 has an accommodating space m, and the light-emitting diodes 12 are disposed in the accommodating space 111. The conductive terminals 13 are disposed on both sides of the LED 12 and electrically connected to the LEDs 12 to supply electric energy to the LEDs 12. Since the conductive terminal 13 is made of a metal material (copper, silver or gold), it has a material number. therefore,
發光二極體I2所產生之難可#由導電端子13傳遞至發光二極 體封襞結構外部，以降低發光二極體12之溫度。 然而 省知技藝之發光一極體封裝結構之缺點在於當用以封 f較高發光辨之發光二極體時，如⑼〜細微麵ma)輸入功 率之發光二赌，其所產生之熱能规之提高。因為習知技敲之 發先二極體_結構，僅終電端子13之端部部分 12 ^^t^electrically conduct)^ r藉m此鋪面魏蝴_二極12體職生之熱能無 於至發光二極體封裝結構之外部而累積 於&先-極體12内，造成於長時間操作此發光二極體12時，將 201013969 使其溫度過高’造成降低發光二極體12之使用壽命。 【發明内容】 有鑑於上述習知技藝之問題，本發明之目的就是在提供一種 發光二極體封裝結構，以解決習知技藝之發光二極體封裝結構散 熱效果不佳之問題。 根據本發明之目的，提出一種發光二極體封裝結構，其包含 一封裝體、一第一導電端子、一第二導電端子及一發光二極體。 封裝體具有一底部。第一導電端子係設置於底部之一側。第二導 Φ電端子係設置於底部之另一侧。發光二極體設置於第一導電端子 上方’係電性連接第—導電端子與第二導電端子。 其中’第-導電端子及第二導電端子係呈薄板狀。 承上所述，依本發明之發光二極賊裝結構，可藉由發光二 部接觸第—導電端子，以增加接觸面積，並藉由薄板狀 t第-導電端子將熱能由發光二極體傳遞至呈薄板狀之第一導電 端子，因而增加導熱面積，而達成強化散熱能力之功效。 ®【實施方式】 體封2圖、第3圖及第4 ®，其係為本發明之發光二相 =圖、俯視圖及仰視圖。圖中，發光二極細 導電端子之第二導電端子23 Β、^電端子22複數個對應第 光二極體24。化子23及複數個對應第一導電端子22之潑 201013969 •狀侧有^數自兩側向外延伸之散熱鰭# 221，其係呈長條板 1：端子22更具有由其—端向封裝體21外側彎曲延伸 ^域曲邓222 ’其係貼設於封裝體21之外侧。第二導電端子23 ϋ板狀’間隔嵌設於封裝體21底部之另一側並具有複數由 兩侧向外延伸之散熱鰭片231，其係呈長條板狀 。第二導電端子 八由/、 ^向封裝體21外側彎曲延伸之一彎曲部232，其 係貼設於雖體21之外侧m導電端子22及第二導電 端子係為金屬材質(銅、銀或金)所製成，因此具有高導熱能力。 ❿ 發光二極體24係呈立方體，其底部係固設於第一導電端子22 上方並電性連接第一導電端子Μ及第二導電端子23,使的發光二 極體24位於容置空間211内。第一導電端子22及第二導電端子 23係電性連接一電源(圖未示）。 •當電源供應電能至發光二極體24時，則驅動發光二極體24 發光。發光二極體24發光時同時產生熱能，因發光二極體之底部 係接觸於第一導電端子’因此熱能可藉由第-導電端子22及散熱 鰭片221散逸出去’而不致累積於發光二極體24内而縮短發光 參一極體24之使用壽命。 熱能更可藉由·彎曲部222傳導至封裝體21之外部，近一步 減少累積於發光二極體24之熱能，藉以降低發光二極體24之溫 度。 ，、中上述之封裝體21係為聚駄酸醋(p〇iyphthalamide，ΡΡΑ) 之材質所製成’且發光二極體封裝結構係以歸導線晶片載體 (Plastic Leaded Chip Carrier，PLCC)之方式封裝發光二極體。 縱上所述，本發明之發光二極體封裝結構之功效在於藉由將 201013969 封裝較南功_ 15G〜·ma)之發光二嫌。 a而了 本發明之發光二極_裝結構之另—功效在婦 ==㈣—導術，鳴熱編積，躺有效 降贴先二極體溫度’而可封裝較高功率之發光二極體。 ❹ 鰭片封再了在於_數散熱 較高功率之料二鋪導料子，績升散熱鮮而可封裝 之糖僅為舉例性’而非為限制性者。任何未脫離本發明 【圖式簡單說明】 第1圖係為習知技藝之發光二極體封裝結構之立體圖； 第2圖係為本發明之發光二極體封裝結構之立體圖； 第3圖係為本發曰月之發力二極體封装結構之俯棚；以及 第4圖係為本發明之發光二極體封魏構之仰視圖； 【主要元件符號說明】 U:封裝體； 111 :容置空間； 12、24 :發光二極體； 13 '·導電端子； 8 201013969 21 :封裝體； 211 :容置空間； 212 :底部； 22 :第一導電端子； 221、 231 :散熱鰭片； 222、 232 :彎曲部；以及 23 :第二導電端子。The difficulty generated by the light-emitting diode I2 is transmitted from the conductive terminal 13 to the outside of the light-emitting diode sealing structure to lower the temperature of the light-emitting diode 12. However, the shortcoming of the light-emitting one-pole package structure of the prior art is that when used to seal the light-emitting diode of higher light-emitting, such as (9) to fine-faced ma), the thermal energy generated by the input power is gambled. Improve. Because the conventional technology knocks the first diode _ structure, only the end portion of the final electrical terminal 13 12 ^^t^electrically conduct) ^ r borrowed this pavement Wei _ _ 12 pole 12 body health heat is not The outside of the light-emitting diode package is accumulated in the & precursor-pole 12, causing the temperature of the 201013969 to be too high when the LED 12 is operated for a long time, resulting in a decrease in the use of the LED 12 life. SUMMARY OF THE INVENTION In view of the above problems of the prior art, it is an object of the present invention to provide a light emitting diode package structure to solve the problem of poor heat dissipation effect of the light emitting diode package structure of the prior art. According to the purpose of the present invention, a light emitting diode package structure includes a package body, a first conductive terminal, a second conductive terminal, and a light emitting diode. The package has a bottom. The first conductive terminal is disposed on one side of the bottom. The second conductive Φ electrical terminal is disposed on the other side of the bottom. The light emitting diode is disposed above the first conductive terminal to electrically connect the first conductive terminal and the second conductive terminal. The 'first conductive terminal and the second conductive terminal are in a thin plate shape. According to the invention, the light-emitting diode thief-mounted structure according to the present invention can contact the first conductive terminal by the light-emitting two portion to increase the contact area, and the thermal energy is made of the light-emitting diode by the thin-plate-shaped t-conductive terminal. It is transmitted to the first conductive terminal in the form of a thin plate, thereby increasing the heat transfer area, thereby achieving the effect of enhancing the heat dissipation capability. ® [Embodiment] The body seal 2, 3, and 4 are the light-emitting two-phase = map, top view, and bottom view of the present invention. In the figure, the second conductive terminals 23 of the light-emitting diode-shaped conductive terminals and the plurality of electrical terminals 22 correspond to the second light-emitting diodes 24. The chemical element 23 and the plurality of corresponding first conductive terminals 22 are splashed on the surface of the first conductive terminal 22, and the heat-dissipating fins 221 extending outward from both sides are formed as long strips 1: the terminal 22 has its end-direction The outside of the package body 21 is bent and extended to the outside of the package body 21 . The second conductive terminal 23 is embedded in the other side of the bottom of the package body 21 and has a plurality of heat dissipation fins 231 extending outward from both sides, which are elongated. The second conductive terminal 8 is bent from the outside of the package 21 by a curved portion 232, which is attached to the outer side of the body 21, and the second conductive terminal 22 and the second conductive terminal are made of metal (copper, silver or Made of gold) and therefore has high thermal conductivity. The illuminating diodes 24 are in the form of a cube, and the bottom portion thereof is fixed on the first conductive terminal 22 and electrically connected to the first conductive terminal Μ and the second conductive terminal 23, so that the illuminating diode 24 is located in the accommodating space 211. Inside. The first conductive terminal 22 and the second conductive terminal 23 are electrically connected to a power source (not shown). • When the power supply is supplied to the light-emitting diode 24, the light-emitting diode 24 is driven to emit light. When the light-emitting diode 24 emits light, heat is generated at the same time, because the bottom of the light-emitting diode contacts the first conductive terminal 'so the thermal energy can be dissipated through the first-conductive terminal 22 and the heat-dissipating fin 221' without accumulating in the light-emitting diode The life of the light-emitting reference body 24 is shortened within the polar body 24. The heat energy is further transmitted to the outside of the package body 21 by the bent portion 222, and the heat energy accumulated in the light-emitting diode 24 is further reduced, thereby lowering the temperature of the light-emitting diode 24. The package 21 described above is made of a material of a polyphthalic acid vinegar, and the LED package structure is a method of a Leaded Chip Carrier (PLCC). Encapsulating the light-emitting diode. In the above, the luminous diode package structure of the present invention has the effect of illuminating the light of 201013969 by Nangong _ 15G~·ma. a light-emitting diode of the present invention _ other structure of the structure - in the woman == (four) - guidance, sound heat accumulation, lying effective lowering the first diode temperature 'can encapsulate higher power of the light dipole body. ❹ Fin seals are based on the _ number of heat dissipation, the higher power of the material, the second layer of the material, the performance of the heat and the packaged sugar is only an example 'not a limitation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light-emitting diode package structure of the prior art; FIG. 2 is a perspective view of a light-emitting diode package structure of the present invention; The bottom view of the LED package structure of the present invention; and the fourth figure is the bottom view of the light-emitting diode package of the present invention; [Major component symbol description] U: package; 111: Included space; 12, 24: light-emitting diode; 13 '·conductive terminal; 8 201013969 21 : package; 211: accommodating space; 212: bottom; 22: first conductive terminal; 221, 231: heat sink fin ; 222, 232: bent portion; and 23: second conductive terminal.