1286389 九、發明說明： 【發明所屬之技術領域】 本發明關於發光二極體之封裝，尤指一種需要有較佳的 散熱效率之發光二極體產品的封裝。 【先前技術】 發光二極體的光量強度一直是被研究人員所追求的，其 光里強度愈南則釋放出來的熱量就愈多，這些熱量若是不能 有效地發散出去，便會聚集持續增高發光二極體產品的溫 度，終至燒毀整個產品。習知技藝便遭遇到此一問題，所以 一直無法將發光二極體的亮度提高。習知技藝如圖丨所示， 金屬基材ίο具有-個平面區域而用以承紐光二極體晶片 12 ’發光二極體晶片12以底面電極搞合至金屬基材;第一 金屬基材ίο具有-個金屬延伸端1G2作為發光二極體晶片 的底面電極之延伸電極。第二金屬基卵平行於前述之金屬 延伸端=，且㈣打線14電_合至晶片12的表面電極， 如此，第二金屬基材11作為晶片12的表面電極之延伸電極· 〇 屬延伸端H)2與第二金屬基㈣，構成產 供 產品以插収絲於外部倾。 域腳’ &供 ^了提高整個產品的散熱效果，本案首 出 金屬基材的方式，提高熱容量，可叫效散埶折 高發光二歸的I作電壓叹亮度。 卩而可以提 1286389 緣是，本發明人有感上述缺 並配合學理之運用，終於提、可改善，乃特潛心研究 缺失之本發明 種故計合理且有效改善上述 【發明内容】 本發明的目的之一為開發 二極體封裝。 裡/、有較佳散熱效率之發光 本發明的目的之二為開發— 二極體封裝。 ，、有芳折金屬基材之發光 本發明的目的之三為開發 黏著式所需的發光二極體元件。σ:二兼=件式以及表面 便可以量產插件核是表面㈣單處理 ’了達成上述之目的，本發明係提供心 备先-極體封裝，包含：發 ？弓㈣屬基材 具有平面㈤u〜、 體日日片；第—金屬基材， 光— =之發光二晶片、且電絲合於前述之發 域安iV;:曰J ;該平面區具有至少-彎折向上之彎折區 延伸端電=之散熱面… 平行於前、Μ 紐之延伸電極；第二金屬基材， 極，作為之伸端’且電性耦合於前述之晶片第二電 件整:ί:::弟一?極之延伸電極;以及膠體，將前述元 、-、-，且提供保護前述之晶片等元件。 發光為;^成上述之目的’本發明係提供—種f折金屬基材 毛先-極體封裝方法，包含:準備發光二極體晶片；準備第 1286389 一金屬基材，具有平面承麵述 於前述之發光二晶片之第 、且電性耦合 上之彎折區域安置於前述之晶片，=面區具有至少—彎折向 積；具有金屬延伸端 θθ、周邊，提供較大之散熱面 備第二金屬基材，平行 弟電極之延伸電極；準 前述之晶片^Κ之孟屬延伸端，且電性耦合於 及，準備脒體一：、:：為前述之第二電極之延伸電極；以 之晶片述元件整合成為-體，且提供保護前述 術、=力進二瞭解本創作為達成預定目的所採取之技 圖，相二二：閱:下有關本創作 具體之_，_所w '了㈣# —冰入且 對本創作加以限制者。私供辦與說明用，並非用來 【實施方式】 且有請ΪΪΓ卿’為本制之第―實_，金屬基材2〇 ，、有二邊精向上的區域，也具有_個平面區域2 ==體發先二極體晶片22以底面電極耦合至 ，第—金屬基材2G具有"'個金屬延伸端202作為 體晶片22的底面電極之延伸電極。第二金屬基抑 述之金屬延伸端搬，且縣打線24電⑽合至晶 二的表面電極’如此’第二金屬基_作為晶⑽的表面 “亟之延伸電極，賴23將前述元件縣整合成為一體。第 一金屬基材2G的金屬_端搬與第二金屬基材21，構成產 1286389 ⑽的長條腳，提供產品以插件式安裝於外部母板。也可以如 圖6所示將長條腳彎曲成為表面黏著式接腳。 請參閱圖3所示，為本發明之第二實施例，金屬基材4〇 二有兩k弯折向上的區域，也具有一個平面區域4〇1用以承 載發光二極體晶片42，發光二極體晶片42以底面電_合至 =屬基材4〇,第-金屬基材4〇具有—個金屬延伸端搬作為 發光二極體晶片42的底面電極之延伸電極。第二金屬基材“ =了於前述之金屬延伸端4〇2，位於晶片42的另外一邊，且 藉著打線44電性耦合至晶片42的表面電極，如此，第二金屬 基材31作為晶片32的表面電極之延伸電極；膠體珊前述元 =封衣成為一體。第一金屬基材3〇的金屬延伸端與 第二金屬基材3卜構成產品的長條腳，提供產品以插件式^ 裝於外部母板。也可以如圖6所示將長_彎曲成為表 著式接腳。 睛麥閱圖4所示，為本發明之第三實施例，金屬基材仞 具有兩邊’彎折向上的區域’也具有—個平面區域彻用以承 $發光二極體晶片42，發光二極體晶片42以底面電極耦合至 ^屬基材40;第—金屬基材⑽有—個金屬延相術作為 ^光二極體晶片42的底面電極之延伸電極。第二金屬基材41 於前述之金屬延伸端4〇2，位於晶片c的另外_邊，且 藉著打線44電性耦合至晶片42的表面電極之延 4墙前述元件封裝整合絲—體。第-金屬基㈣的金^ 伸端402與第二金屬基材4卜構成產品的長條聊，提供 以插件式钱於外部母板。也可以如圖7或圖8所示將長條腳 1286389 彎曲成為表面黏著式接腳。 請參閱圖5所示，為本發明之第四實施例，金屬基材％ 具有兩邊彎折向上的區域且再彎折成—平面狀，更增加散熱 面積’其餘原理相同，重複說明如下：金屬基材5()也具有一 個平面區域5G1用以承载發光二極體晶片52，發光二極體晶 片52以底面電極輕合至金屬基材％;第—金屬基材狐有一 個金屬延伸端5G2作為發光二極體晶片52的底面電極之延伸 電極。第二金屬基材51平行於前述之金屬延伸端逝，位於 晶片52的另外-邊，且藉著打線54電性輕合至晶⑽的表面 電極，如此’第二金屬基材51作為晶㈣的表面電極之延伸 電極；膠體53將前述元件封裝整合成為—體。第—金屬基材 5〇的金屬延伸端搬與第二金屬基材5卜構成產品的長條 腳’提供產品以插件式安裝於外部母板。也可❹圖7或是 圖8所示將長條腳彎曲成為表面黏著式接腳。請參閱圖6所 為本U之第五貝施例，顯示圖2的長條腳可以彎曲成 為表面黏著式接腳2G2A、21A。請參_7所示，為本發明 =六實施例’顯示圖5的長條腳可以向内彎曲成為表 =式接腳。請相圖8料，為本發明之第七實施例，顯示 圖5的長&、腳可以向外f曲成為表面黏著式接腳。 ^惟’以上所述，僅為本發明最佳之—的具體實施例之詳 2明與圖式’惟本創作之特徵並不侷限於此，並非用以限 ^本發本發明之所有範圍應以下述之申請專利範圍為 你丨^ 口於本^明申请專利範圍之精神與其類似變化之實施 ’卜^應包含於本發明之料中，任何熟悉該項技藝者在本 1286389 發明之領域内，可輕易思及之變化或修飾皆可涵蓋在以下本 案之專利範圍。 【圖式簡單說明】 圖1係為習知技藝。 圖2係為本發明第一實施例。 圖3係為本發明第二實施例。 圖4係為本發明第三實施例。 圖5係為本發明第四實施例。 圖6係為本發明第五實施例。 圖7係為本發明第六實施例。 圖8係為本發明第七實施例。 【主要元件符號說明】 第一金屬基材10、20、30、40、501286389 IX. Description of the Invention: [Technical Field] The present invention relates to a package for a light-emitting diode, and more particularly to a package for a light-emitting diode product requiring better heat dissipation efficiency. [Prior Art] The light intensity of the light-emitting diode has been pursued by the researchers. The more the light intensity is, the more heat is released. If the heat is not effectively dissipated, it will accumulate and increase the light. The temperature of the polar product ends up burning the entire product. The conventional technique has encountered this problem, so it has been impossible to increase the brightness of the light-emitting diode. As shown in the prior art, the metal substrate ίο has a planar region for the light-emitting diode wafer 12' the light-emitting diode wafer 12 is bonded to the metal substrate by the bottom electrode; the first metal substrate Ίο has a metal extension end 1G2 as an extension electrode of the bottom electrode of the light-emitting diode wafer. The second metal-based egg is parallel to the aforementioned metal extension end =, and (4) the wire 14 is electrically coupled to the surface electrode of the wafer 12, such that the second metal substrate 11 serves as an extension electrode of the surface electrode of the wafer 12 H) 2 and the second metal base (4) constitute a product for the production of the product to be externally inclined. The field foot ' & for ^ to improve the heat dissipation effect of the entire product, the first method of the metal substrate in this case, improve the heat capacity, can be called the effect of the divergence of high-light two return I for the voltage sigh brightness.卩 卩 1 286 286 286 286 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 One of the purposes is to develop a diode package. Light/light with better heat dissipation efficiency The second object of the present invention is to develop a diode package. Light-emitting of a metal substrate having an aromatic fold The third object of the present invention is to develop a light-emitting diode element required for an adhesive type. σ: two and the part and the surface can mass-produce the plug-in core is the surface (four) single processing ‘to achieve the above purpose, the present invention provides a ready-to-pole package, including: hair? The substrate of the bow (4) has a plane (5) u~, a body day sheet; a first metal substrate, a light-emitting light-emitting two-chip, and the wire is combined with the aforementioned hair-domain iV;: 曰J; the plane area has at least - bending the upward bending portion to extend the end of the electricity = the heat dissipating surface... parallel to the front, the extension electrode of the neon; the second metal substrate, the pole, as the extension end' and electrically coupled to the aforementioned wafer second electric Piece of the whole: ί::: Brother's extreme electrode; and the colloid, the aforementioned elements, -, -, and provide protection for the aforementioned wafer and other components. The present invention provides a method for encapsulating a f-shaped metal substrate by first-polar body, comprising: preparing a light-emitting diode wafer; preparing a 1286389 metal substrate having a planar bearing surface The bending region on the first and the electrical coupling of the foregoing two light-emitting diodes is disposed on the wafer, and the surface region has at least a bending product; the metal extending end θθ and the periphery provide a larger heat dissipation surface. a second metal substrate, an extension electrode of the parallel electrode; a front end of the wafer of the genus, and electrically coupled to the body, the precursor: a: the electrode of the second electrode; In this way, the components of the wafer are integrated into a body, and the protection of the aforementioned technology is provided, and the force is taken to understand the technical map taken by the author for the purpose of achieving the intended purpose, and the second: reading: the specific _, _ '了(四)# —Ice the ice and limit the creation. For private provisioning and explanation, it is not used for [Implementation] and there is a ΪΪΓ ' 为本 为本 为本 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属2 == The body-first diode wafer 22 is coupled to the bottom electrode, and the first metal substrate 2G has a metal extension end 202 as an extension electrode of the bottom electrode of the body wafer 22. The second metal base suppresses the metal extension end, and the county line 24 electricity (10) is bonded to the surface electrode of the crystal two 'so' the second metal base _ as the surface of the crystal (10) "the extension electrode of the crucible, Lai 23 will be the aforementioned element county The integration is integrated into one. The metal-end of the first metal substrate 2G and the second metal substrate 21 constitute a long leg of the 1286389 (10), and the product is plug-mounted to the external motherboard. The long leg is bent into a surface-adhesive pin. Referring to FIG. 3, in the second embodiment of the present invention, the metal substrate 4 has two k-folded upward regions and also has a planar region. 1 for carrying the LED chip 42, the LED substrate 42 is electrically connected to the substrate 4, and the metal substrate 4 has a metal extension to be used as the LED chip. An extension electrode of the bottom electrode of 42. The second metal substrate "= is on the other metal extension end 4"2, is located on the other side of the wafer 42, and is electrically coupled to the surface electrode of the wafer 42 by the wire 44, thus, The second metal substrate 31 serves as an extension of the surface electrode of the wafer 32 Electrode; Shan colloid coating the sealing element = integral. The metal extending end of the first metal substrate 3〇 and the second metal substrate 3 constitute a long leg of the product, and the product is provided in a plug-in type on the outer mother board. It is also possible to bend the long _ into an apparent pin as shown in FIG. As shown in FIG. 4, in the third embodiment of the present invention, the metal substrate 仞 has a 'bending upward direction' on both sides, and has a planar area for carrying the light-emitting diode wafer 42 and the light-emitting diode. The polar body wafer 42 is coupled to the base substrate 40 by a bottom electrode; the first metal substrate (10) has a metal phase extension as an extension electrode of the bottom electrode of the photodiode wafer 42. The second metal substrate 41 is disposed on the other side of the wafer c at the metal extension end 4〇2, and is electrically coupled to the surface electrode of the wafer 42 by the bonding wire 44. The gold-extension end 402 of the first metal base (4) and the second metal substrate 4 constitute a long chat with the product, and the plug-in money is provided to the external mother board. It is also possible to bend the long leg 1286389 into a surface-adhesive pin as shown in Fig. 7 or Fig. 8. Referring to FIG. 5, in the fourth embodiment of the present invention, the metal substrate has a region with two sides bent upward and is bent into a flat shape, and the heat dissipation area is increased. The remaining principles are the same, and the repeated description is as follows: The substrate 5 () also has a planar region 5G1 for carrying the LED array 52, and the LED substrate 52 is lightly bonded to the metal substrate by the bottom electrode; the first metal substrate fox has a metal extension 5G2 As an extension electrode of the bottom electrode of the light-emitting diode wafer 52. The second metal substrate 51 extends parallel to the metal extending end, is located on the other side of the wafer 52, and is electrically coupled to the surface electrode of the crystal (10) by the wire 54 so that the second metal substrate 51 acts as a crystal (four) The extended electrode of the surface electrode; the colloid 53 integrates the aforementioned component package into a body. The metal-extending end of the first metal substrate and the second metal substrate 5 constitute a long leg of the product, and the product is plug-mounted to the outer mother board. It is also possible to bend the long legs into surface-adhesive pins as shown in Fig. 7 or Fig. 8. Referring to Fig. 6, the fifth embodiment of U is shown, and the long legs of Fig. 2 can be bent into surface-adhesive pins 2G2A, 21A. Referring to Figure 7, the present invention shows that the long legs of Figure 5 can be bent inwardly into a table-type pin. Referring to Figure 8, the seventh embodiment of the present invention shows that the length & feet of Figure 5 can be bent outward to become a surface-adhesive pin. The above description of the specific embodiments of the present invention is not limited to the details of the present invention, and is not intended to limit the scope of the present invention. The following claims should be made in the spirit of the patent application and the implementation of the similar changes in the scope of the invention, and should be included in the material of the present invention. Anyone familiar with the art in the field of the invention of 1286389 Changes or modifications that can be easily considered are within the scope of the patents in this case below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a prior art. Figure 2 is a first embodiment of the present invention. Figure 3 is a second embodiment of the present invention. Figure 4 is a third embodiment of the present invention. Fig. 5 is a fourth embodiment of the present invention. Figure 6 is a fifth embodiment of the present invention. Figure 7 is a sixth embodiment of the present invention. Figure 8 is a seventh embodiment of the present invention. [Main component symbol description] First metal substrate 10, 20, 30, 40, 50
第二金屬基材 11、21、31、41、51、21A、51ASecond metal substrate 11, 21, 31, 41, 51, 21A, 51A
金屬延伸端 102、202、302、402、502、202A、502A 發光二極體晶片12、22、32、42、52 膠體 13、23、33、43、53 打線 14、24、34、44、54 平面區域 101、201、301、401、501Metal Extension Ends 102, 202, 302, 402, 502, 202A, 502A Light Emitting Diode Wafers 12, 22, 32, 42, 52 Colloids 13, 23, 33, 43, 53 Wires 14, 24, 34, 44, 54 Plane areas 101, 201, 301, 401, 501