201123564 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種半導體封裝結構，尤指一種包含發光二極體 (light emitting diode，以下簡稱為LED)之半導體封裝結構。 【先前技術】 隨著發光二極體(LED)的發展，LED越來越廣泛地應用於顯示器 背光源、汽車燈源以及照明領域中。由於LED是個光電元件，接受 電力後係將電能轉換為光能與熱能，然而在操作過程中僅有15〜25 %的電能轉換成光能，其餘的電能幾乎都轉換成熱能。若這些熱能 無法及時地排除’將使led晶片的界面溫度(juncti〇ntemperature) 在操作時持續升高，導致LED晶片發光效率下降、LED封裝結構 本體甚至封裝材料的劣化加速以及使用壽命衰減。因此，LED晶片 的熱管理問題一直都受到業界的重視。 請參閱第1圖’第1圖係-習知表面黏著元件(surfaeem_ted device，以下簡稱為SMD)型LED封裝結構之刮面圖。如第i圖所 示’驾知SMD-LED封裝結構1〇〇係包含—引腳1〇2，引腳1〇2則 包含一承載部l〇2a與延伸部102b。承載部1〇2a之表面係設置有一 L一ED晶片110。咖晶片11〇包含有一正電極與一負電極（圖未 示），並分別利用一導線112a、112b與引腳1〇2電性連接。 請繼續參閱第1圖。SMD-LED封裝結構100更包含一封裝外殼 120 ’其包含聚碳酸酯樹脂(p〇lycarb〇nate，pCresin)與二氧化欽 3 201123564 (Ti〇2)，並利用射出成型製程而形成一自色杯殼。引腳⑴2係利用 埋入成型(insert molding)製程埋設於封裝外殼12〇内；其延伸部1〇2b 則延伸而外露出封裝外殼120，用以作為電性接點。之後，利用一 環氧樹脂(epoxy)、-石夕膠、或一可透光材料填入封裳外殼12〇中， 再使其固化形成具有保護功能的封膠122。 -般來說，SMD-LED封裝結構！⑻的熱傳導途經係由引腳ι〇2 傳導至外界，因此在封裝設計上，業界常以增加引聊1〇2的延伸部 難或整贿裝絲_料法增加絲面躺枝以大幅降低 延伸部獅與外部的熱阻值。或者，以改變引腳ι〇 加 的熱傳導速率。然而，隨著咖細封裝結構卿功率 ^要t.T"嶋散熱面積以降低熱阻抗的方式已不敷現今 直接採 在操作時產生的高熱ZLED封裝結_ 具有優良散熱效率的SMD_LE 堂如何能提供一種 疇。 裝、，、°構仍為業界致力研究的範 【發明内容】 因此’本發明之一目的係為提 封裝結構。 一有優良散熱功能的半導體 根據本翻顺供之㈣相 構，該铸體封裝結構包 输仏—種半導體封裝結 部之引腳、—具有 川时顺有-延伸部與一連接 表面與一下表面之散熱平板、至少一設置於 201123564 該散熱平板之該上表面的晶片、至少—用以電性連接該晶片與該等 •弓I腳之導線、以及-封裝膠體。該封褒膠體係包覆該等引腳、該散 熱平板、該3與轉線，_散熱平板之該下表面與鮮引腳之 該延伸部係暴露於該封裝膠體之外。 根據本發明所提供之申請專利範圍，另提供一種LED封裝結 構。該LED封裝結構包含有至少一具有一延伸部之引腳、一具有一 上表面與-下表面之散鮮板、至少_設置於雜鮮板之該上表 #面上之LED晶片、至少一用以電性連接該咖晶片與該引腳之導 線、以及·封裝膠體。該封裝膠體更包含—包覆該晶片與該導 線之透光部，以及-外殼，而該外殼包含—第—凹杯與—第二凹杯， 且該引腳係設置於該第一凹杯之底部，而該散熱平板係設置於該第 一凹杯之底部。 ^根據本㈣職供之半導體封裝結構與led封裝結構，係利用 政..、、平板作為-熱電分離的管道：晶片的電連接路徑由導線與引腳 •建構’邮熱料路酬由散鮮板提供。因此可避免封裝结構產 =高熱鱗其紐纽，同時彻雜伟賴财而有效地傳 、出去此外’利用具有第一凹杯與第二凹杯的封裝膠體外殼，可 =加led _結構的發光效率，並可增加其職膠體與㈣的密A 度0 ϋ 【實施方式】 半導L參閱第211至第4圖’第2圖與第4圖分別為本發明所提供之 封裝結構之一第一較佳實施例之俯視厨與仰示圖；第3圖則 201123564 為忒半導體封裝結構之剖面圓。 未二二。引腳2〇2更可包含-習知之反射層(圖 2〇Γ其ΐΓ-1反射效率。咖職職更包含—散熱平板 心一上表面2〇如與一下表面鳩。散熱平板204包含金 屬材料或非金屬材料，金屬材料可為之金、銀、銅、域上述材料 之組合，而非金屬材料則可為石墨、_、_或上述材料之組合。 在散熱平板204的上表面2〇4a上，係設置有一咖晶片施。 值得注意的是，本㈣職供之半導體封裝結構細咖晶片為例 不說明’因此町係將半賴封裝結構直接以咖封裝結構稱之。 但熟知該概藝之人士應知，該半導體難結構可包含各型晶片， 而不限於LED晶片。本第一較佳實施例所提供的led晶片2〇6至 少包含-半導體複合層、一正電極與一負電極（圖皆未示），半導體 複合層包含-η型蟲晶層…p型蠢晶層，以及設置於㈣蟲晶層 與Ρ型磊晶層之活性層，上述膜層與正負電極皆為熟習該技藝之人 士所知者，故於此係不再贅述^ LED封裝結構2〇〇尚包含至少一導 線208，用以電性連接LED晶片206與引腳202的連接部202b。此 外，LED封裝結構200更包含一封裝膠體21〇，其包覆引腳202、 散熱平板204、LED晶片206與導線208。但引腳202之延伸部202a 與散熱平板204之下表面204b係暴露於封裝膠體210之外。 凊繼續參閱第2圖至第4圖。詳細地說，封裝膠體210更包含一 外设212與一透光部214。外殼212可包含聚碳酸g旨(polycarbonate， PC)、改性聚苯醚(noryl)、聚丁婦對苯二曱酸醋(p〇iybutylene 201123564 terephthalate，ΡΒΤ)、聚鄰苯二曱醢胺(p〇iyphthalamide，PPA)、聚丙 "稀(P〇l^ProPylene ’ PP)、聚甲基丙稀酸甲醋(polymethylmethacrylate， -PMMA)、玻璃纖維、氧化鈦、氧化辦或上述材料之組合；而透光部 214則包含環氧樹脂(epoxy)或矽膠(smc〇ne)等可透光材料。此外， 根據LED封裝結構2〇〇所欲發出的顏色光種類，LED透光部214 亦可包含黃光螢光粉體、紅光螢光粉體或綠光螢光粉體等、其他不 同顏色螢光粉體或其組合。如第2圖與第3圖所示，外殼212係包 φ 覆引腳202的連接部202b與部分散熱平板204之上表面204a。換 句活說’引腳202之延伸部202a係延伸且外露於外殼212之外，用 以作為電性接點；散熱平板204之下表面2〇4b則暴露於外殼212 之底部。 由於LED晶片206的熱傳導途徑由散熱平板204提供，而其電 連接路徑由導線208與引腳204建構，因此可在避免led晶片206 在操作時產生的高熱影響元件的電性表現。更由於此一熱電分離的 概念，散熱平板204可免除電性考量，逕選擇任何高導熱的材料， 如銅（其熱傳導係數(thermal conductivity)為 401 W/m · K)、石夕(170 W/m · K)、金（318 W/m · K)、銀（429 W/m . K)、或鋁（237 W/m · K)’散熱平板204甚至可為導熱比金屬還好的石墨或陶瓷(其熱傳導 係數為500〜900 W/m · Κ)。由於LED晶片206係直接設置於此一 熱傳導功能優良的散熱平板2〇4的上表面2〇4a上，而散熱平板2〇4 •之下表面204b係直接暴露於外殼212之底部，因此LED晶片2〇6 -所產生的熱係可藉由散熱平板204直接排出LED封裝結構2〇〇,有 效地增加半導體封裝結構/LED封裝結構2〇〇的散熱效率。 7 201123564 凊重新參閱第2圖至第4圖。封裝膠體21〇之外殼212更包含一 第凹杯212a與-第一凹杯212b。詳細地說，第二凹杯212b係如 第2圖與第3圖所示，設置於第一凹杯助之中央，且低於第一凹 杯212a。散熱平板2〇4係設置於第二凹杯襲的底部，而引腳观 係設置於[凹杯212a之底部，其延伸部施魏伸外露於外殼 210之外’且可如第4圖所示，依外殼21〇的外型設計向下弯折而 嵌設於第二凹杯212b之底部，使得LED封裝結構大致上具有 -立方體的形狀。此外，由於引腳2G2與散熱平板綱設置於不同 的平面’因此散熱平板204的設置不會佔用到引腳2〇2的空間。且 利用雙凹陷部212a/212b的設置’可更提升封裝膠體21〇與引腳2〇2 的密合度。 另外請參閱第5圖，第5 ®係為本第-較佳實關之—變化型之 剖面示意目。如前所述，由於散熱平板204係設置於第二凹杯職 的底部’而引腳202係設置於第一凹杯⑽之底部，即散熱平板 204與引腳2〇2設置於不同的平面，故散熱平板綱與引腳⑽的 設置不會佔用彼此的空間。也因此LED封裝結構朋之散熱平板 204可延伸至引腳202之連接部聽的下方，喊連接部雇重 疊’但不接觸連接部鳩與延伸部耻。如第5圖所示，藉此， 咖封裝結構可獲得-具有更大面_散齡板可以增加散 熱面積的方式來更提升其散熱效率。 更值得注意的是，第-凹杯212a具有一第一斜面-;而第二 凹杯⑽具有一第二斜面222，第一斜面220與第二斜面222斜率 並不相同’較佳為第-斜面22G之斜率大於第二斜面您之斜率。 201123564 利用此-具不同斜率之雙斜面的設計，可更聚斂咖晶片挪所發 射的光線’提升LED封裝結構200的發光效率。 另外’請參閱第6圖’第6圖本發明所提供之半導體封裝結構之 -第-較佳實施例之剖面示意圖。請注意第6圖中與前述第一較佳 實施例相同之元件係沿_同之元件符號制，不_元件另用其 他的元件符號綱。如第6晒示，本第二較佳實施機提供一半 導體封裝結構2GGa，與第-較佳實施例不同岐，在第二較佳實施 例中’散熱平板204上係設㈣數個晶片2〇6a、獅、2%c，且連 接晶片206a、206b、206c與引腳202之導線係於第6圖中省略。由 於料體封裝結構2〇_用散熱效率甚佳的散熱平板2(h提供導熱 途徑’因此本發明所提供之半導體封裝結構200a更可作為一多晶片 半導體封裝結構，而無須擔减等晶#在運作過程巾產生的熱能無 法及時排出。此外’熟習該項技藝之人士應知，第6 ®中所^之晶 片2〇6a、206b、206c僅為示意所用’即散熱平板2〇4上所承載之晶 片數里係可依產品需求所定，並不限於第6圖所繪示者。 請參閱第7圖’第7圖係為第二較佳實施例之一變化型之剖面示 意圖。在本變化型中，晶片施、遍、施可分別為紅色、綠色、 藍色LED晶片，輔α包含於透光部叫内的螢光粉體，半導體封裝 結構施可依產品需求作為—具有獅“的錢長咖 、 構或或白光LED封裝結構。 、。 綜上所述，根據本發明所提供之半導體封裝結構，係利用散熱平 板作為-熱電分離的管道：晶片的電連接路徑轉線朗腳建構， 而其熱傳導路觸由散鮮減供。因此可避免轉體封裝結構產 9 201123564 生的高熱影響其電性表現，同時 導出去，而提升半導體封裝結構二:=速而有效地傳 此外，利用具有第-凹杯賴_ 革M而增加元件壽命。 封裝結構的發歧率，対=杯的封裝膠體外殼，可增加led 地說，本發_触〇^；;；1^^5丨_於度。簡單 的散_恤率,嫌好 圍 所/上所碰為本發明之錄實_，凡依本發明巾請專利矿 之均等變化與修飾’皆應屬本發明之涵蓋範圍。 巳 【圖式簡單說明】 ^圖係-習知表面封裝型LED封裝結構之剖面圖； ⑽神峨料输獅叙十聽實施例 第3圖為該半導體封裝結構之一剖面示意圖； 第4圖為該半導體封裝結構之一仰視圖； 第5圖為第-較佳實施例之—變化型之剖面示意圖； =6圖為本發明所提供之轉體封裝結構之—第二較佳實施例 面示意圖； 第7圖為第二較佳實施例之-變化型之剖面示意圖。 100 1〇2 【主要元件符號說明】 表面黏著型發光二極體封裝結構 引腳 102a 承載部 201123564 102b 延伸部 110 LED晶片 112a、112b 導線 120 封裝外殼 122 封膠 200、200a 半導體封裝結構/發光二極體封裝結構 202 引腳 202a 延伸部 202b 連接部 204 散熱平板 204a 上表面 204b 下表面 206 LED晶片 206a 晶片 206b 晶片 206c 晶片 208 導線 210 封裝膠體 212 外殼 214 透光部 212a 第一凹杯 212b 第二凹杯 220 第一斜面 222 第二斜面 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package structure, and more particularly to a semiconductor package structure including a light emitting diode (LED). [Prior Art] With the development of light-emitting diodes (LEDs), LEDs are increasingly used in display backlights, automotive light sources, and lighting fields. Since the LED is a photoelectric component, after receiving electricity, the electrical energy is converted into light energy and thermal energy. However, only 15 to 25% of the electrical energy is converted into light energy during the operation, and the remaining electrical energy is almost converted into thermal energy. If these thermal energy cannot be eliminated in time, the interface temperature of the LED wafer will continue to rise during operation, resulting in a decrease in the luminous efficiency of the LED wafer, an acceleration of degradation of the LED package structure body and even the packaging material, and a decay in service life. Therefore, the thermal management of LED chips has always been valued by the industry. Please refer to Fig. 1 'Fig. 1 - a scraped surface view of a conventional surface mount component (surfaleem_ted device, hereinafter referred to as SMD) type LED package structure. As shown in Fig. i, the driver SMD-LED package structure 1 includes a pin 1〇2, and the pin 1〇2 includes a carrier portion 102a and an extension portion 102b. The surface of the carrying portion 1 2a is provided with an L-ED wafer 110. The coffee chip 11A includes a positive electrode and a negative electrode (not shown), and is electrically connected to the pin 1〇2 by a wire 112a, 112b, respectively. Please continue to see Figure 1. The SMD-LED package structure 100 further includes a package housing 120' which comprises a polycarbonate resin (p〇lycarb〇nate, pCresin) and a dioxide oxide 3 201123564 (Ti〇2), and forms a self-color by an injection molding process. Cup shell. The lead (1) 2 is embedded in the package housing 12 by an insert molding process; the extension 1 2b extends to expose the package housing 120 for use as an electrical contact. Thereafter, an epoxy resin, a ligament, or a light transmissive material is used to fill the casing 12 and then cured to form a sealant 122 having a protective function. - Generally speaking, SMD-LED package structure! (8) The heat conduction path is transmitted to the outside by the pin ι〇2, so in the package design, the industry often increases the difficulty of the extension of the 1〇2 or the whole bribe wire to increase the silk surface lying to greatly reduce Extend the heat resistance of the lion and the outside. Or, to change the heat transfer rate of the pin 〇. However, with the coffee-package structure, the power of the package is required to reduce the thermal impedance. The high-heat ZLED package that is directly produced during operation is available. How can SMD_LE with excellent heat dissipation efficiency be provided? A domain. The assembly, the structure, and the structure are still in the industry for research. [Invention] Therefore, one of the objects of the present invention is to provide a package structure. A semiconductor having excellent heat dissipation function according to the (four) phase structure of the turn-on, the cast package structure of the package is a pin of a semiconductor package, and has a connection between the extension and the connection surface. a heat dissipating plate on the surface, at least one wafer disposed on the upper surface of the heat dissipating plate of 201123564, at least a wire for electrically connecting the wafer and the pins, and an encapsulant. The sealant system covers the pins, the heat sink plate, the 3 and the transition wires, and the extension of the lower surface and the fresh pin of the heat dissipation plate is exposed to the package body. In accordance with the scope of the patent application provided by the present invention, an LED package structure is also provided. The LED package structure includes at least one lead having an extension, a slab having an upper surface and a lower surface, and at least one LED chip disposed on the upper surface of the slab The wire for electrically connecting the coffee chip and the pin, and the encapsulant. The encapsulant further includes a light transmissive portion covering the wafer and the wire, and a casing, and the casing includes a first concave cup and a second concave cup, and the pin is disposed on the first concave cup The bottom of the first concave cup is disposed at the bottom of the first concave cup. ^ According to the (four) job of the semiconductor package structure and led package structure, the use of the government.., plate as a thermoelectric separation of the pipeline: the electrical connection path of the wafer by the wire and the pin • construction of the postal hot material Fresh plates are available. Therefore, it is possible to avoid the package structure production = high heat scales and its new button, and at the same time, it can be effectively transmitted and removed through the use of the package, and the packaged colloidal shell having the first concave cup and the second concave cup can be used. Luminous efficiency, and can increase the density of the colloid and (4). [Embodiment] Semi-conductor L refers to Figures 211 to 4'. Figures 2 and 4 are respectively one of the package structures provided by the present invention. The top-facing kitchen and the elevation view of the first preferred embodiment; and the third figure 201123564 are the cross-sectional circles of the semiconductor package structure. Not two or two. Pin 2〇2 can also contain the well-known reflective layer (Fig. 2 〇Γ ΐΓ 反射 反射 反射 。 。 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热 散热The material or the non-metal material, the metal material may be a combination of gold, silver, copper, and the above materials, and the non-metal material may be graphite, _, _ or a combination of the above materials. On the 4a, there is a coffee chip application. It is worth noting that the semiconductor package structure of the semiconductor package is not described as an example. Therefore, the town system will refer to the package structure directly in the coffee package structure. It should be noted that the semiconductor difficult structure may include various types of wafers, and is not limited to LED chips. The LED chip 2〇6 provided in the first preferred embodiment includes at least a semiconductor composite layer, a positive electrode and a a negative electrode (not shown), the semiconductor composite layer comprises a -n type insect layer...p type stray layer, and an active layer disposed on the (4) insect layer and the germanium type epitaxial layer, wherein the film layer and the positive and negative electrodes are Known to those skilled in the art Therefore, the LED package structure 2 further includes at least one wire 208 for electrically connecting the connection portion 202b of the LED chip 206 and the pin 202. In addition, the LED package structure 200 further includes an encapsulant 21 That is, it covers the pin 202, the heat sink plate 204, the LED chip 206 and the wire 208. However, the extension 202a of the pin 202 and the lower surface 204b of the heat sink plate 204 are exposed outside the encapsulant 210. 凊 Continue to refer to the second 4 to 4. In detail, the encapsulant 210 further includes a peripheral portion 212 and a light transmitting portion 214. The outer casing 212 may comprise a polycarbonate (PC), a modified polyphenyl (noryl), a poly Dibutyl phthalate (p〇iybutylene 201123564 terephthalate, ΡΒΤ), poly(p-iyphthalamide, PPA), polypropyl (P〇l^ProPylene 'PP), polymethyl Polymethylmethacrylate (PMMA), glass fiber, titanium oxide, oxidation, or a combination of the above materials; and the light transmissive portion 214 contains epoxide or smc〇ne. In addition, according to the LED package structure 2 The LED light transmitting portion 214 may also include a yellow light phosphor powder, a red light phosphor powder or a green light phosphor powder, and other different color phosphor powders or a combination thereof, as shown in FIGS. 2 and 3. The outer casing 212 is a portion φ covering the connecting portion 202b of the pin 202 and the upper surface 204a of the partial heat radiating plate 204. In other words, the extending portion 202a of the pin 202 extends and is exposed outside the outer casing 212 for use as an electric The contact surface; the lower surface 2〇4b of the heat dissipation plate 204 is exposed to the bottom of the outer casing 212. Since the thermal conduction path of the LED wafer 206 is provided by the heat sink plate 204, and its electrical connection path is constructed by the wires 208 and the leads 204, the electrical performance of the high heat-affecting elements that the LED wafer 206 is generated during operation can be avoided. Moreover, due to the concept of thermoelectric separation, the heat dissipation plate 204 can be exempted from electrical considerations, and any material with high thermal conductivity such as copper (thermal conductivity of 401 W/m · K) and Shi Xi (170 W) can be selected. /m · K), gold (318 W/m · K), silver (429 W / m · K), or aluminum (237 W / m · K) 'heat sink plate 204 can even be better than the metal heat transfer graphite Or ceramic (its heat transfer coefficient is 500~900 W/m · Κ). Since the LED chip 206 is directly disposed on the upper surface 2〇4a of the heat dissipation plate 2〇4 excellent in heat conduction function, and the heat dissipation plate 2〇4 • the lower surface 204b is directly exposed to the bottom of the case 212, the LED chip 2〇6 - The generated heat system can be directly discharged from the LED package structure 2 by the heat dissipation plate 204, effectively increasing the heat dissipation efficiency of the semiconductor package structure/LED package structure 2〇〇. 7 201123564 凊Review Figures 2 to 4 again. The outer casing 212 of the encapsulant 21 includes a first concave cup 212a and a first concave cup 212b. In detail, the second concave cup 212b is disposed at the center of the first concave cup and is lower than the first concave cup 212a as shown in Figs. 2 and 3. The heat dissipating plate 2〇4 is disposed at the bottom of the second concave cup, and the pin view is disposed at the bottom of the [concave cup 212a, and the extension portion thereof is exposed outside the outer casing 210] and can be as shown in FIG. 4 It is shown that the outer shape of the outer casing 21 向下 is bent downward and is embedded at the bottom of the second concave cup 212b, so that the LED package structure has a substantially-cube shape. In addition, since the pin 2G2 and the heat sink plate are disposed in different planes, the arrangement of the heat sink plate 204 does not occupy the space of the pin 2〇2. Moreover, the degree of adhesion between the encapsulant 21 〇 and the pin 2 〇 2 can be further improved by the arrangement of the double recesses 212a/212b. In addition, please refer to Figure 5, which is a cross-sectional illustration of the variation of the first-best implementation. As described above, since the heat dissipation plate 204 is disposed at the bottom of the second concave cup and the pin 202 is disposed at the bottom of the first concave cup (10), the heat dissipation plate 204 and the pin 2〇2 are disposed on different planes. Therefore, the arrangement of the heat sink plate and the pin (10) does not occupy each other's space. Therefore, the heat sink plate 204 of the LED package structure can be extended to the lower portion of the connection portion of the pin 202, and the connection portion is overlapped and the contact portion and the extension portion are not touched. As shown in Fig. 5, by this way, the coffee package structure can be obtained - with a larger surface - the slab can increase the heat dissipation area to further improve its heat dissipation efficiency. More preferably, the first concave cup 212a has a first inclined surface - and the second concave surface (10) has a second inclined surface 222. The first inclined surface 220 and the second inclined surface 222 have different slopes. The slope of the slope 22G is greater than the slope of the second slope. 201123564 This design with double slopes with different slopes can more converge the light emitted by the coffee chip' to improve the luminous efficiency of the LED package structure 200. Further, please refer to FIG. 6 and FIG. 6 is a cross-sectional view showing a first preferred embodiment of the semiconductor package structure provided by the present invention. Note that the same elements in Fig. 6 as those of the first preferred embodiment described above are based on the same component symbol, and the other components are used in other components. As shown in FIG. 6, the second preferred embodiment provides a semiconductor package structure 2GGa, which is different from the first preferred embodiment. In the second preferred embodiment, (four) a plurality of wafers 2 are disposed on the heat dissipation plate 204. 〇6a, lion, 2%c, and the wires connecting the wafers 206a, 206b, 206c and the leads 202 are omitted in Fig. 6. The semiconductor package structure 200a provided by the present invention can be used as a multi-chip semiconductor package structure, and the semiconductor package structure 200a can be used as a multi-chip semiconductor package structure, because the material package structure 2〇 uses a heat dissipation plate 2 with excellent heat dissipation efficiency (h provides a heat conduction path). The heat generated by the process towel cannot be discharged in time. In addition, people familiar with the art should know that the wafers 2〇6a, 206b, and 206c in the 6th ® are only used for the illustrations. The number of wafers to be carried can be determined according to product requirements, and is not limited to those shown in Fig. 6. Please refer to Fig. 7 'Fig. 7 is a schematic cross-sectional view showing a variation of the second preferred embodiment. In the variant, the wafer can be applied, red, and blue, respectively. The auxiliary alpha is contained in the phosphor powder in the light-transmitting portion. The semiconductor package structure can be used as the product. The invention relates to a semiconductor package structure according to the present invention, which utilizes a heat dissipation plate as a conduit for thermoelectric separation: the electrical connection path of the wafer is changed. build Structure, and its heat conduction path touches the dissipation and supply reduction. Therefore, it can avoid the high heat effect of the rotating package structure, and the electrical performance of the semiconductor package is also exported, and the semiconductor package structure is improved. The use of the first-concave cup _ leather M to increase the life of the component. The disproportion of the package structure, 対 = cup of the package of the colloidal shell, can increase led said, this hair _ touch 〇 ^;;; 1 ^ ^ 5丨_于度.Simple _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _巳 [Simple diagram of the diagram] ^Graphic-section of the conventional surface-mount LED package structure; (10) The sacred lion-speaking embodiment of the syllabus is shown in Fig. 3 is a schematic cross-sectional view of the semiconductor package structure; The figure is a bottom view of the semiconductor package structure; FIG. 5 is a schematic cross-sectional view of the first preferred embodiment; the figure 6 is the swivel package structure provided by the present invention - the second preferred embodiment Figure 7 is a cross-sectional view of the second preferred embodiment Fig. 100 1〇2 [Description of main component symbols] Surface mount type LED package structure pin 102a Bearing part 201123564 102b Extension part 110 LED chip 112a, 112b Wire 120 Package case 122 Sealant 200, 200a Semiconductor package structure / LED package structure 202 pin 202a extension 202b connection portion 204 heat dissipation plate 204a upper surface 204b lower surface 206 LED wafer 206a wafer 206b wafer 206c wafer 208 wire 210 encapsulant 212 housing 214 light transmitting portion 212a first concave cup 212b Second concave cup 220 first inclined surface 222 second inclined surface 11