TWI380468B - Solid-state lighting element and light source module - Google Patents

Description

1380468, [0001] [0002] [0003] December 09, 100, revised & page. Invention: [Technical Field] The present invention relates to a solid state light emitting device and a plurality of such solid state light emitting devices Light source module. [Prior Art] As a solid-state light-emitting element, Light Emitting Diode (LED) has its electrical, first-class characteristics and lifetime sensitive to temperature. Here, a stable light intensity can be maintained during temperature changes. A novel light-emitting diode can be found in Yukino Tanaka et al., IEEE Transactions On Electron Devices, Vol. 41, No. 7, 1997 July A Novel Temperature-Stable Light-Emitting Diode. In general, higher temperatures result in low internal quantum effects and a much shorter lifetime; on the other hand, the resistance of the semiconductor decreases as the temperature rises, and the slip resistance causes a larger current and more. The heat is generated, causing heat accumulation to occur; this thermal destruction cycle tends to accelerate the destruction of the working efficiency of the light-emitting diode. As shown in FIG. 1, a typical solid state light emitting device 1A includes a pedestal 101' a first electrode 102' and a second electrode 103, a light emitting diode wafer 104 and a package body 〇5. The first electrode 1 〇 2 and the second electrode 103 are arranged side by side on the pedestal 1 〇 1 , and the illuminating diode chip 1 〇 4 is disposed on the first electrode 102 and is connected to the first electrode 1 〇 2 The second electrode 103 is wire-bonded. The package body 105 is disposed on the susceptor 1 〇 1 for encapsulating the light-emitting diode wafer 1 〇 4. The heat generated by the light-emitting diode wafer 104 is mostly emitted through the package 1〇5 and the first electrode 1〇2, but 097109094 Form No. A0101 Page 4/20 pages 1003455872-0 1380468. * 100 years. December 09, the replacement of the page 105, the thermal conductivity of the package 105 is not good, especially the heat dissipation efficiency of the first electrode 102 is not high, so that the heat generated by the LED wafer 104 cannot be dissipated in time. The heat dissipation performance of the solid state light emitting device 100 is poor. Therefore, it is necessary to provide a solid-state light-emitting element and a light source module with good heat dissipation performance. SUMMARY OF THE INVENTION [0004] A solid state light emitting device and a light source module having good heat dissipation performance will be described below by way of embodiments.

[0005] A solid state light emitting device includes a substrate and a solid state light emitting chip, the substrate having a first surface and a second surface opposite thereto, the solid state light emitting chip being disposed on the first surface and having a first An electrode and a second electrode. The solid state light emitting device further includes a first electrical conductor and a second electrical conductor. The first electrical conductor is disposed on a side of the substrate adjacent to the second surface and electrically connected to the first electrode of the solid state light emitting chip. The second electrical conductor is disposed in the first electrical conductor and insulated from each other, and the second electrical conductor is electrically connected to the second electrode of the solid state light emitting chip.

[0006] A light source module includes a heat sink and at least one solid state light emitting device, the solid state light emitting device comprising a substrate, a solid state light emitting chip, a first electrical conductor and a second electrical conductor, the substrate having a first a solid-state light-emitting chip disposed on the first surface of the substrate and having a first electrode and a second electrode, the first conductive body being disposed adjacent to the second substrate One side of the surface is electrically connected to the first electrode of the solid state light emitting chip, the second conductive body is disposed in the first conductive body and insulated from each other, and the second conductive body and the second electrode of the solid state light emitting chip Electrical connection, the heat sink includes two opposite 097109094 Form No. A0101 Page 5 / Total 20 pages 1003455872-0 1380468 100 years. December 09 revised replacement page third surface and fourth surface, and located on the third surface The heat dissipation plate is provided with at least one third through hole penetrating through the third surface and the fourth surface of the heat dissipation plate, and the at least one solid state light emitting element is held at the side Less than one third through hole.

[0007] With respect to the prior art, the solid state light emitting device and the light source module each include a first electrical conductor and a second electrical conductor, and the first electrical conductor and the second electrical conductor respectively form a first electrode and a first electrode of the solid state light emitting chip. The two electrodes are electrically connected, and the heat generated when the solid-state light-emitting chip emits light can be diffused to the outside of the solid-state light-emitting element via the first conductive body or the second conductive body, or further diffused to the outside air via the heat dissipation plate, thereby effectively improving the The heat dissipation efficiency of the solid state light emitting element or the light source module. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. [0009] Referring to FIG. 2, a first embodiment of the present invention provides a solid state light emitting device 10 having good heat dissipation performance, comprising: a substrate 11, a solid state light emitting chip 12, a conductive pillar 13, a conductive rod 14 and a package. Body 15. [0010] The substrate 11 includes a first surface 110, a second surface 112 opposite the first surface 110. The substrate 11 has a first through hole 113 and a second through hole 115. The first through hole 113 and the second through hole 115 extend through the first surface 110 and the second surface 112 of the substrate 11. The shape of the substrate 11 may be a polygon such as a quadrangle, a pentagon or a hexagon. The substrate 11 may be an insulating substrate made of an electrically insulating thermally conductive material such as glass fiber or ceramic, or may be made of a metal such as copper or aluminum. In the present embodiment, the substrate 11 is made of a ceramic insulating substrate. 097109094 Form No. A0101 Page 6 / Total 20 Page 1003455872-0 1380468 _ - 1100. December 09, Junzheng & Page [0011] The solid state light emitting chip 12 is disposed on the first surface 基板 of the substrate 11, the package 15 is disposed on the first surface 110 of the substrate 11 for covering the solid-state light-emitting chip 12 ° [0012] The conductive pillar 13 is disposed on one side of the substrate 1 1 adjacent to the second surface 112, and the conductive rod 14 is disposed through In the conductive column 13. One end of the conductive post 13 is in close contact with the second surface 112 of the substrate 11. In this embodiment, the solid-state light-emitting chip 12 is a light-emitting diode wafer having a top electrode 121 and a bottom electrode 122, and the top electrode 121 and the bottom The electrode 122 is disposed on opposite sides of the solid-state light-emitting chip 12, and the top electrode 21 is electrically connected to the conductive pillar 13 through a metal wire ,6. Here, one end of the metal wire 16 is connected to the top electrode 121, and the other One end is connected to the conductive post 13 through the first through hole 113. The bottom electrode 122 is electrically connected to the conductive bar 14, wherein the solid-state light-emitting chip 12 is disposed above the second through-hole 115, and one end of the conductive bar 14 passes through the second through-hole 115 of the substrate 11 to form a charge with the bottom electrode 122. connection. [0013]

The conductive post 13 and the conductive bar 14 are electrically connected to an external power source (not shown). The conductive post 13 and the conductive bar 14 are insulated from each other, for example, by being separated from each other via air or an insulating layer. In the present embodiment, an insulating layer 17 is disposed between the conductive pillars 13 and the conductive bars 14, and one end of the conductive bars 14 away from the solid-state light-emitting wafer 12 extends beyond the conductive pillars 13. In addition, the insulating layer 17 is sleeved on the conductive bar 14, and one end of the insulating layer 17 also passes through the second through hole 115 of the substrate 11 and is connected to the bottom electrode 122 of the solid-state light-emitting chip 12, thereby electrically electrifying the conductive bar 14 and the substrate 11. isolation. The outer surface of the conductive post 13 is provided with external threads (Outer Threads) 132 to facilitate the solid state light emitting element 10 to be coupled to other devices by screw engagement. It should be noted that if the substrate 11 is a metal substrate, the solid-state light-emitting chip 丨2 097109094 Form No. A0101 Page 7 / Total 20 pages 1003455872-0 1380468 100. December 09 nuclear replacement page bottom electrode 122 and substrate An insulating layer (not shown) is also required between the first surfaces 110 of the 11 to electrically insulate the solid state light emitting wafer 12 from the substrate 11. When the solid-state light-emitting chip 12 is in the on state, the heat generated by the substrate 11 and the conductive pillars 13 can be diffused away from the solid-state light-emitting chip 12, thereby effectively improving the heat-dissipating efficiency of the solid-state light-emitting device. [0015] Referring to FIG. 3, a solid-state light-emitting element 2A according to a second embodiment of the present invention is substantially the same as the solid-state light-emitting element 1〇 provided by the first embodiment, except that:

[0016] The positive electrode 221 of the solid-state light-emitting chip 22 and the negative electrode 222 are disposed on one side of the solid-state light-emitting chip 2 2; [0017] The conductive post 23 has a protrusion 231, and the protrusion 231 extends into the first through hole of the substrate 21. 213 and extending to the first surface 210 of the substrate 21, the positive electrode 221 of the solid-state light-emitting chip 22 is electrically connected to the protrusion 231 by the metal wire 26; [0018] The conductive bar 24 is disposed under the solid-state light-emitting chip 22, and solid-state light is emitted The wafer 22 covers only a portion of the end face of the conductive bar 24, and the negative electrode 222 of the solid state light emitting chip 22 is electrically connected to the end face of the conductive bar 24 that is not covered by the solid state light emitting chip 22 by the metal wire 27. In the present embodiment, the conductive turns 23 and the conductive bars 24 are electrically connected to an external power source (not shown). When the solid-state light-emitting chip 22 is in an on state, the heat generated by the solid-state light-emitting element 20 is diffused in the direction away from the solid-state light-emitting chip 22 by the substrate 21, the conductive post 23, and the conductive bar 24, thereby effectively improving the heat-dissipating efficiency of the solid-state light-emitting element 20. [0020] Referring to FIG. 4, a light source module 3A according to a third embodiment of the present invention includes 097109094 Form No. A0101 Page 8 of 20 1003455872-0 1380468 *

100 years. December 09 nuclear replacement page A heat sink 31, a plurality of solid state light emitting elements 32, an inner insulating film 33, a conductive film 34, an outer insulating film 35 and a heat sink fin 36. [0021] The heat dissipation plate 31 has a third surface 310, a fourth surface 311 opposite to the third surface 310, and a side surface 312 between the third surface 310 and the fourth surface 311. The heat dissipation plate 31 is provided with a plurality of parallel third through holes 313. The plurality of third through holes 31 3 respectively penetrate the third surface 310 and the fourth surface 311 of the heat dissipation plate 31. The inner wall of the third through hole 313 is provided with internal threads 3130 that mesh with the external threads 332 of the conductive post 323. The plurality of third through holes 313 respectively correspond to the plurality of solid state light emitting elements 32, that is, the conductive pillars 323 of the plurality of solid state light emitting elements 32 are respectively held in the plurality of third through holes 313 and form an electrical connection. The solid-state light-emitting element 32 can be the solid-state light-emitting element 10 provided in the first embodiment, or the solid-state light-emitting element 20 provided in the second embodiment described above. [0023] The inner insulating film 33, the conductive film 34 The outer insulating film 35 is sequentially disposed on the fourth surface 311 side of the heat dissipation plate 31. The inner insulating film 33 is adjacent to the fourth surface 311 of the heat dissipation plate 31, and the inner insulating film 33 is provided with a plurality of fourth through holes 331. The plurality of fourth through holes 331 respectively correspond to the plurality of third through holes 313 and communicate with the third through holes 313. [0024] One end of the conductive bar 324 of the solid-state light-emitting element 32 is electrically connected to the conductive film 34 through one end of the substrate 321 through the fourth through hole 331. It is to be understood that the outer insulating film 35 may be disposed not only on one side of the conductive film 34 away from the inner insulating film 33 but also on the side surface 312 of the heat dissipation plate 31. [0026] The heat dissipation fins 36 are disposed on one side of the conductive film 34 away from the inner insulation film 33 and 097109094. Form No. A0101 Page 9 of 20 Page 1003455872-0 1380468 __ 100 years. December 09 Shuttle replacement page· It is connected to the outer insulating film 35. In the present embodiment, the heat dissipation plate 31 and the conductive phosphine 34 are electrically connected to an external power source (not shown), respectively, to the plurality of solid state light emitting elements 32 respectively disposed in the plurality of third through holes 313. Provide electrical energy. When the solid-state light-emitting chip 322 of the solid-state light-emitting element 32 is in an on state, the heat generated by the solid-state light-emitting element 32 can be diffused to the heat dissipation plate 31 by the substrate 321 and the conductive pillar 323, and the heat dissipation plate 31 has a large contact area with air, thereby facilitating heat dissipation. The heat in the panel 31 is diffused to the outside air, which effectively improves the heat dissipation efficiency of the light source module 3. A part of the heat in the heat dissipation plate 31 is diffused away from the solid-state light-emitting chip 322 φ, thereby further improving the heat dissipation efficiency of the light source module 30. [0028] Referring to FIG. 5, the shape of the substrate 321 of the plurality of solid-state light-emitting elements 32 is The quadrilateral, the pentagon, and the hexagon help to apply a torque to the substrate 321 of the solid-state light-emitting element 32 by using a Screw Driver to screw the conductive post 323 of the solid-state light-emitting element 32 into the third through hole 31 3 of the heat dissipation plate 31. The solid state light emitting element 32 has a conductive post 323 threadedly engaged with the third through hole 313 of the heat sink 31. It can be understood that the shape of the substrate 321 of the plurality of solid-state light-emitting elements 32 can also be elliptical, rounded with a convex structure, etc., as long as it helps to apply a torque to the wrench. [0029] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of patent application in this case. . Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. [Simple description of the drawing] '1003455872-0 097109094 Form No. A0101 笫 page/Total 20 pages 1380468 ♦ 100 years. December 09 correction page change [0030] FIG. 1 is a schematic cross-sectional view of a solid state light-emitting element of the prior art. [0031] FIG. 2 is a schematic cross-sectional view showing a solid state light emitting device according to a first embodiment of the present invention. 3 is a schematic cross-sectional view showing a solid state light emitting device according to a second embodiment of the present invention. 4 is a partial cross-sectional view showing a light source module according to a third embodiment of the present invention. 5 is a partial top plan view of the light source module shown in FIG. 4. [Description of main component symbols] Solid-state light-emitting element: 100, 10, 20, 32 φ [0036] pedestal: 101 [0037] First electrode: 102 [0038] Second electrode: 103 [0039] Light-emitting diode Bulk wafer: 104 [0040] Package: 105, 15 [0041] Substrate: 11, 21, 321 φ [0042] Solid-state light-emitting wafer: 12, 22, 322 [0043] Conductive column: 13, 23, 323 [0044] Conductive rods: 14, 24, 324 [0045] First surface: 110, 210 [0046] Second surface: 112 [0047] First pass: 113, 213 [0048] Second pass: 115 097109094 Form number A0101 Page 11 of 20 1003455872-0 1380468 [0049] Top electrode: 121 [0050] Bottom electrode: 122 [0051] Metal wire: 16, 26, [0052] Insulation: 17 [0053] Positive electrode: 221 [0054 Negative electrode: 222 [0055] Bump: 231 [0056] Light source module: 30 [0057] Heat sink: 31 [0058] Inner insulating film: 33 [0059] Conductive film: 34 [0060] Outer insulating film: 35 [ 0061] Heat sink fin: 36 [0062] Third surface: 310 [0063] Fourth surface: 311 [0064] Side: 312 [0065] Third through hole: 313 [0066] External thread: 132 332 [0067] internal thread: 3130097109094 Form Number A0101 Page 12 / Total 20 100 On December 9 page 1003455872-0 shuttle being replaced.

1380468 . · 100 years. December 09 shuttle replacement page [0068] Fourth connection: 331 • 097109094 Form number A0101 Page 13 of 20 1003455872-0

Claims (1)

1380468 100 years. December 09 shuttle replacement page VII. Patent application scope: 1. A solid-state light-emitting element, comprising a substrate and a solid-state light-emitting chip, the base The solid-state light-emitting chip is disposed on the first surface and has a first electrode and a second electrode. The improvement is that the solid-state light-emitting element further includes a first surface and a second surface. a first electrical conductor and a second electrical conductor, the first electrical conductor is disposed on a side of the substrate adjacent to the second surface and electrically connected to the first electrode of the solid state light emitting chip, wherein the second electrical conductor is disposed through And electrically insulated from the first electrical conductor, the second electrical conductor is electrically connected to the second electrode of the solid state light emitting crystal, the outer surface of the first electrical conductor is provided with an external thread, and the outer periphery of the first electrical conductor The size is smaller than the outer dimensions of the substrate. 2. The solid state light emitting device of claim 1, wherein the first electrical conductor and the second electrical conductor are insulated from each other by an insulating layer. 3. The solid state light-emitting device of claim 1, wherein the base The first through hole and the second through hole extend through the first surface and the second surface of the substrate, and the first electrode and the second electrode of the solid state light emitting chip are located The solid-state light-emitting device further includes a first metal wire, one end of the first metal wire is connected to the first electrode of the solid-state light-emitting chip, and the other end of the first metal wire is passed through The first through-connect is connected to the first conductive body, and one end of the second conductive body passes through the second through hole of the substrate to form an electrical connection with the second electrode of the solid-state light-emitting chip. The solid-state light-emitting device of claim 1, wherein the first electrode and the second electrode of the solid-state light-emitting chip are disposed in parallel with one side of the solid-state light-emitting chip, and the first electrode of the solid-state light-emitting crystal moon and the first conductive body 097109094 Form No. A0101 Page 14 of 20 1003455872-0 1380468 On December 09, 100, the first electrode of the solid-state light-emitting chip is connected to the second conductor by wire bonding. The solid-state light-emitting element according to claim 1, wherein the substrate has a polygonal shape. A light source module includes a heat sink and at least one solid state light emitting device, wherein the solid state light emitting device comprises a substrate, a solid state light emitting chip, a first electrical conductor and a second electrical conductor, the substrate having a first a solid-state light-emitting chip disposed on the first surface of the substrate and having a first electrode and a second electrode, the first conductive body being disposed adjacent to the second substrate One side of the surface is electrically connected to the first electrode of the solid state light emitting chip, the second conductive body is disposed in the first conductive body and insulated from each other, and the second conductive body and the second electrode of the solid state light emitting chip Electrically connecting, the outer diameter of the first electrical conductor is smaller than the outer dimension of the substrate, the heat dissipation plate includes two opposite third and fourth surfaces, and a side surface between the third surface and the fourth surface, the heat dissipation The plate is provided with at least one third through hole extending through the third surface and the fourth surface of the heat dissipation plate, and the at least one solid state light emitting element is retained in the at least one third through hole, the at least The light source module of the sixth aspect of the present invention, wherein the light source module further comprises a fourth surface of the heat dissipation plate. An inner insulating film, a conductive film and an outer insulating film are disposed adjacent to the fourth surface of the heat dissipation plate, and the conductive film is electrically connected to the second conductive body of the solid state light emitting device. The light source module of claim 6, wherein the light source module further comprises a heat dissipation fin, the heat dissipation fin being disposed adjacent to the outer insulation film. 097109094 Form No. A0101 Page 15 of 20 1003455872-0