TWI380468B - Solid-state lighting element and light source module - Google Patents
Solid-state lighting element and light source module Download PDFInfo
- Publication number
- TWI380468B TWI380468B TW97109094A TW97109094A TWI380468B TW I380468 B TWI380468 B TW I380468B TW 97109094 A TW97109094 A TW 97109094A TW 97109094 A TW97109094 A TW 97109094A TW I380468 B TWI380468 B TW I380468B
- Authority
- TW
- Taiwan
- Prior art keywords
- state light
- solid
- electrode
- substrate
- electrical conductor
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Description
1380468 、 [0001] [0002] [0003] 100年12月09日修正番&頁.發明說明: 【發明所屬之技術領域】 本發明涉及一種固態發光元件及一種具有複數個該固態 發光元件之光源模組。 【先前技術】 發光二極體(Light Emitting Di〇de,LED)作為一種 固態發光元件,其電、先特性及壽命對溫度敏感,於此 ,一種於溫度變化過程中還能保持穩定光強之新型發光 二極體可參見Yukio Tanaka等人於文獻IEEE Transactions On Electron Devices, Vol. 41, No. 7, · July 1994 中之 A Novel Temperature-Stable Light-Emitting Diode—文。一般而言,較高之溫度 會導致低落之内部量子效應並且壽命亦會明顯縮短;另 一方面,半導體之電阻隨著溫度地升高而降低,滑落地 電阻會帶來較大電流及更多熱產生,造成熱累積現象地 發生;此一熱破壞循環往往會加速破壞發光二極體之工 作效能。 如圖1所示,一種典型之固態發光元件1〇〇包括:一基座 101 ’ 一第一電極102 ’ 一第二電極103,一發光二極體 晶片104及一封裝體1〇5。該第一電極1〇2與第二電極103 並列設置於該基座1〇1上,該發光二極體晶片1〇4設置於 該第一電極102上且與該第一電極1〇2及第二電極103打 線連接。該封裝體105設置於該基座1〇1上用於封裝該發 光二極體晶片1〇4。該發光二極體晶片104發光時所產生 得熱量大部分經由該封裝體1〇5及第一電極1〇2散出,但 097109094 表單編號A0101 第4頁/共20頁 1003455872-0 1380468 . ·* 100年.12月09日核正替換頁 該封裝體105之導熱性能不佳,尤其係該第一電極102之 散熱效率不高,導致該發光二極體晶片104所產生得熱量 不能及時散出,致使該固態發光元件100之散熱性能不佳 。因此,有必要提供一種散熱性能良好之固態發光元件 與光源模組。 【發明内容】 [0004] 下面將以實施例說明一種具有良好散熱性能之固態發光 元件與光源模組。1380468, [0001] [0002] [0003] December 09, 100, revised & page. Invention: [Technical Field] The present invention relates to a solid state light emitting device and a plurality of such solid state light emitting devices Light source module. [Prior Art] As a solid-state light-emitting element, Light Emitting Diode (LED) has its electrical, first-class characteristics and lifetime sensitive to temperature. Here, a stable light intensity can be maintained during temperature changes. A novel light-emitting diode can be found in Yukino Tanaka et al., IEEE Transactions On Electron Devices, Vol. 41, No. 7, 1997 July A Novel Temperature-Stable Light-Emitting Diode. In general, higher temperatures result in low internal quantum effects and a much shorter lifetime; on the other hand, the resistance of the semiconductor decreases as the temperature rises, and the slip resistance causes a larger current and more. The heat is generated, causing heat accumulation to occur; this thermal destruction cycle tends to accelerate the destruction of the working efficiency of the light-emitting diode. As shown in FIG. 1, a typical solid state light emitting device 1A includes a pedestal 101' a first electrode 102' and a second electrode 103, a light emitting diode wafer 104 and a package body 〇5. The first electrode 1 〇 2 and the second electrode 103 are arranged side by side on the pedestal 1 〇 1 , and the illuminating diode chip 1 〇 4 is disposed on the first electrode 102 and is connected to the first electrode 1 〇 2 The second electrode 103 is wire-bonded. The package body 105 is disposed on the susceptor 1 〇 1 for encapsulating the light-emitting diode wafer 1 〇 4. The heat generated by the light-emitting diode wafer 104 is mostly emitted through the package 1〇5 and the first electrode 1〇2, but 097109094 Form No. A0101 Page 4/20 pages 1003455872-0 1380468. * 100 years. December 09, the replacement of the page 105, the thermal conductivity of the package 105 is not good, especially the heat dissipation efficiency of the first electrode 102 is not high, so that the heat generated by the LED wafer 104 cannot be dissipated in time. The heat dissipation performance of the solid state light emitting device 100 is poor. Therefore, it is necessary to provide a solid-state light-emitting element and a light source module with good heat dissipation performance. SUMMARY OF THE INVENTION [0004] A solid state light emitting device and a light source module having good heat dissipation performance will be described below by way of embodiments.
[0005] 一種固態發光元件,包括一基板及一固態發光晶片,該 基板具有一第一表面及一與其相對之第二表面,該固態 發光晶片設置於該第一表面上且其具有一第一電極及一 第二電極。該固態發光元件還包括一第一導電體及一第 二導電體,該第一導電體設置於該基板之鄰近該第二表 面之一侧並與該固態發光晶片之第一電極電連接,該第 二導電體貫穿設置於該第一導電體中且與其相互絕緣, 該第二導電體與該固態發光晶片之第二電極電連接。[0005] A solid state light emitting device includes a substrate and a solid state light emitting chip, the substrate having a first surface and a second surface opposite thereto, the solid state light emitting chip being disposed on the first surface and having a first An electrode and a second electrode. The solid state light emitting device further includes a first electrical conductor and a second electrical conductor. The first electrical conductor is disposed on a side of the substrate adjacent to the second surface and electrically connected to the first electrode of the solid state light emitting chip. The second electrical conductor is disposed in the first electrical conductor and insulated from each other, and the second electrical conductor is electrically connected to the second electrode of the solid state light emitting chip.
[0006] 一種光源模組,包括一散熱板及至少一固態發光元件, 該固態發光元件包括一基板,一固態發光晶片,一第一 導電體及一第二導電體,該基板具有一第一表面及一與 其相對之第二表面,該固態發光晶片設置於該基板之第 一表面上且其具有一第一電極及一第二電極,該第一導 電體設置於該基板之鄰近該第二表面之一侧並與該固態 發光晶片之第一電極電連接,該第二導電體貫穿設置於 該第一導電體中且與其相互絕緣,該第二導電體與該固 態發光晶片之第二電極電連接,.該散熱板包括兩相對之 097109094 表單編號A0101 第5頁/共20頁 1003455872-0 1380468 100年.12月09日修正替换頁 第三表面與第四表面,以及位於該第三表面與第四表面 之間之側面,該散熱板設置有至少一貫穿該散熱板之第 . 三表面及第四表面之第三通孔,該至少一固態發光元件 固持於該至少一第三通孔中。[0006] A light source module includes a heat sink and at least one solid state light emitting device, the solid state light emitting device comprising a substrate, a solid state light emitting chip, a first electrical conductor and a second electrical conductor, the substrate having a first a solid-state light-emitting chip disposed on the first surface of the substrate and having a first electrode and a second electrode, the first conductive body being disposed adjacent to the second substrate One side of the surface is electrically connected to the first electrode of the solid state light emitting chip, the second conductive body is disposed in the first conductive body and insulated from each other, and the second conductive body and the second electrode of the solid state light emitting chip Electrical connection, the heat sink includes two opposite 097109094 Form No. A0101 Page 5 / Total 20 pages 1003455872-0 1380468 100 years. December 09 revised replacement page third surface and fourth surface, and located on the third surface The heat dissipation plate is provided with at least one third through hole penetrating through the third surface and the fourth surface of the heat dissipation plate, and the at least one solid state light emitting element is held at the side Less than one third through hole.
[0007] 相對於先前技術,該固態發光元件及光源模組均包括一 第一導電體及一第二導電體,第一導電體、第二導電體 分別與固態發光晶片之第一電極、第二電極電連接,固 態發光晶片發光時所發出得熱量可經由該第一導電體、 第二導電體擴散至該固態發光元件之外,或進一步經由 散熱板擴散至外部空氣,有效地提高了該固態發光元件 或光源模組之散熱效率。 【實施方式】 [0008] 下面將結合附圖對本發明實施例作進一步地詳細說明。 [0009] 參見圖2,本發明第一實施例提供得具良好散熱性能之固 態發光元件10,其包括:一基板11、一固態發光晶片12 、一導電柱13, 一導電棒14及一封裝體15。 [0010] 基板11包括一第一表面110,一與第一表面110相對之第 二表面112。基板11具有一第一通孔113及一第二通孔 115,第一通孔113與第二通孔115貫穿基板11之第一表 面110及第二表面112。基板11之形狀可為四邊形、五角 形、六角形等多邊形。基板11可為玻璃纖維或陶瓷等電 絕緣導熱材料製成得絕緣基板,亦可為銅、鋁等金屬製 成得金屬基板。於本實施例中,基板11為陶瓷製成得絕 緣基板。 097109094 表單編號A0101 第6頁/共20頁 1003455872-0 1380468 _ - 1100年.12月09日俊正替&頁 [0011] 固態發光晶片12設置於基板11之第一表面Η 〇上,封裝體 15設置於基板11之第一表面110上用以覆蓋固態發光晶片 12 ° [0012] 導電柱1 3設置於基板1 1之鄰近該第二表面1 1 2之一側,導 電棒14貫穿設置於導電柱13中。導電柱13之一端與基板 11之第二表面112緊密接觸》於本實施例中,固態發光晶 片12為發光二極體晶片,其具有一頂部電極121及一底部 電極122,頂部電極121與底部電極122設置於該固態發 光晶片1 2之相對之兩側,頂部電極丨21通過一金屬線丨6與 導電柱13形成電連接,於此,金屬線16之一端連接於頂 部電極121,其另一端穿過第一通孔113連接於導電柱13 。底部電極122與導電棒14形成電連接,於此,固態發光 晶片12設置於第二通孔115之上方,導電棒14之一端穿過 基板11之第二通孔115以與底部電極122形成電連接。 [0013][0007] With respect to the prior art, the solid state light emitting device and the light source module each include a first electrical conductor and a second electrical conductor, and the first electrical conductor and the second electrical conductor respectively form a first electrode and a first electrode of the solid state light emitting chip. The two electrodes are electrically connected, and the heat generated when the solid-state light-emitting chip emits light can be diffused to the outside of the solid-state light-emitting element via the first conductive body or the second conductive body, or further diffused to the outside air via the heat dissipation plate, thereby effectively improving the The heat dissipation efficiency of the solid state light emitting element or the light source module. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. [0009] Referring to FIG. 2, a first embodiment of the present invention provides a solid state light emitting device 10 having good heat dissipation performance, comprising: a substrate 11, a solid state light emitting chip 12, a conductive pillar 13, a conductive rod 14 and a package. Body 15. [0010] The substrate 11 includes a first surface 110, a second surface 112 opposite the first surface 110. The substrate 11 has a first through hole 113 and a second through hole 115. The first through hole 113 and the second through hole 115 extend through the first surface 110 and the second surface 112 of the substrate 11. The shape of the substrate 11 may be a polygon such as a quadrangle, a pentagon or a hexagon. The substrate 11 may be an insulating substrate made of an electrically insulating thermally conductive material such as glass fiber or ceramic, or may be made of a metal such as copper or aluminum. In the present embodiment, the substrate 11 is made of a ceramic insulating substrate. 097109094 Form No. A0101 Page 6 / Total 20 Page 1003455872-0 1380468 _ - 1100. December 09, Junzheng & Page [0011] The solid state light emitting chip 12 is disposed on the first surface 基板 of the substrate 11, the package 15 is disposed on the first surface 110 of the substrate 11 for covering the solid-state light-emitting chip 12 ° [0012] The conductive pillar 13 is disposed on one side of the substrate 1 1 adjacent to the second surface 112, and the conductive rod 14 is disposed through In the conductive column 13. One end of the conductive post 13 is in close contact with the second surface 112 of the substrate 11. In this embodiment, the solid-state light-emitting chip 12 is a light-emitting diode wafer having a top electrode 121 and a bottom electrode 122, and the top electrode 121 and the bottom The electrode 122 is disposed on opposite sides of the solid-state light-emitting chip 12, and the top electrode 21 is electrically connected to the conductive pillar 13 through a metal wire ,6. Here, one end of the metal wire 16 is connected to the top electrode 121, and the other One end is connected to the conductive post 13 through the first through hole 113. The bottom electrode 122 is electrically connected to the conductive bar 14, wherein the solid-state light-emitting chip 12 is disposed above the second through-hole 115, and one end of the conductive bar 14 passes through the second through-hole 115 of the substrate 11 to form a charge with the bottom electrode 122. connection. [0013]
導電柱1 3及導電棒14分別與外部電源(圖未示)形成電連 接。導電柱13與導電棒14之間相互絕緣,例如:二者之 間經由空氣或絕緣層相互隔離。於本實施例中,導電柱 13與導電棒14之間設置有一絕緣層17,導電棒14之遠離 固態發光晶片12之一端延伸至導電柱13之外。另,絕緣 層17套設於導電棒14上,絕緣層17之一端亦穿過基板11 之第二通孔115並與固態發光晶片12之底部電極122相連 ’從而使得導電棒14與基板11電隔離。導電柱13之外表 面設置有外螺紋(Outer Threads) 132,從而便於固態 發光元件10與其他裝置藉由螺紋嚙合連接於一起。值得 注意的是,若基板11為金屬基板,則固態發光晶片丨2之 097109094 表單編號A0101 第7頁/共20頁 1003455872-0 1380468 100年.12月09日核正替換頁 底部電極122與基板11之第一表面110之間亦需要設置絕 緣層(圖未示),使固態發光晶片12與基板11電絕緣。 [00M]當固態發光晶片12處於導通狀態時,其發出得熱量可藉 由基板11及導電柱13向遠離固態發光晶片12之方向擴散 ,從而有效地提高了固態發光元件丨〇之散熱效率。 [0015] 參見圖3,本發明第二實施例提供之固態發光元件2〇,其 與上述第一實施例所提供之固態發光元件1〇基本相同, 不同之處在於:The conductive post 13 and the conductive bar 14 are electrically connected to an external power source (not shown). The conductive post 13 and the conductive bar 14 are insulated from each other, for example, by being separated from each other via air or an insulating layer. In the present embodiment, an insulating layer 17 is disposed between the conductive pillars 13 and the conductive bars 14, and one end of the conductive bars 14 away from the solid-state light-emitting wafer 12 extends beyond the conductive pillars 13. In addition, the insulating layer 17 is sleeved on the conductive bar 14, and one end of the insulating layer 17 also passes through the second through hole 115 of the substrate 11 and is connected to the bottom electrode 122 of the solid-state light-emitting chip 12, thereby electrically electrifying the conductive bar 14 and the substrate 11. isolation. The outer surface of the conductive post 13 is provided with external threads (Outer Threads) 132 to facilitate the solid state light emitting element 10 to be coupled to other devices by screw engagement. It should be noted that if the substrate 11 is a metal substrate, the solid-state light-emitting chip 丨2 097109094 Form No. A0101 Page 7 / Total 20 pages 1003455872-0 1380468 100. December 09 nuclear replacement page bottom electrode 122 and substrate An insulating layer (not shown) is also required between the first surfaces 110 of the 11 to electrically insulate the solid state light emitting wafer 12 from the substrate 11. When the solid-state light-emitting chip 12 is in the on state, the heat generated by the substrate 11 and the conductive pillars 13 can be diffused away from the solid-state light-emitting chip 12, thereby effectively improving the heat-dissipating efficiency of the solid-state light-emitting device. [0015] Referring to FIG. 3, a solid-state light-emitting element 2A according to a second embodiment of the present invention is substantially the same as the solid-state light-emitting element 1〇 provided by the first embodiment, except that:
[0016] 固態發光晶片22之正極221與負極222並行設置於該固態 發光晶片2 2之一侧; [0017] 導電柱23具有一凸起231,凸起231伸入基板21之第一通 孔213並延伸至基板21之第一表面210,固態發光晶片22 之正極221藉由金屬線26與凸起231形成電連接; [0018] 導電棒24設置於固態發光晶片22之下方,且固態發光晶 片22僅覆蓋導電棒24之部分端面,固態發光晶片22之負 極222藉由金屬線27與導電棒24之未被固態發光晶片22 覆蓋之端面電連接。 [0019] 於本實施例中,導電枉23及導電棒24分別與外部電源(圖 未示)形成電連接。當固態發光晶片22處於導通狀態時, 其發出得熱量可藉由基板21、導電柱23及導電棒24向遠 離固態發光晶片22之方向擴散,從而有效地提高了固態 發光元件20之散熱效率。 [0020] 參見圖4,本發明第三實施例提供之光源模組3〇,其包括 097109094 表單编號A0101 第8頁/共20頁 1003455872-0 1380468 *[0016] The positive electrode 221 of the solid-state light-emitting chip 22 and the negative electrode 222 are disposed on one side of the solid-state light-emitting chip 2 2; [0017] The conductive post 23 has a protrusion 231, and the protrusion 231 extends into the first through hole of the substrate 21. 213 and extending to the first surface 210 of the substrate 21, the positive electrode 221 of the solid-state light-emitting chip 22 is electrically connected to the protrusion 231 by the metal wire 26; [0018] The conductive bar 24 is disposed under the solid-state light-emitting chip 22, and solid-state light is emitted The wafer 22 covers only a portion of the end face of the conductive bar 24, and the negative electrode 222 of the solid state light emitting chip 22 is electrically connected to the end face of the conductive bar 24 that is not covered by the solid state light emitting chip 22 by the metal wire 27. In the present embodiment, the conductive turns 23 and the conductive bars 24 are electrically connected to an external power source (not shown). When the solid-state light-emitting chip 22 is in an on state, the heat generated by the solid-state light-emitting element 20 is diffused in the direction away from the solid-state light-emitting chip 22 by the substrate 21, the conductive post 23, and the conductive bar 24, thereby effectively improving the heat-dissipating efficiency of the solid-state light-emitting element 20. [0020] Referring to FIG. 4, a light source module 3A according to a third embodiment of the present invention includes 097109094 Form No. A0101 Page 8 of 20 1003455872-0 1380468 *
100年.12月09日核正替換頁 一散熱板31,複數個固態發光元件32,一層内絕緣膜33 ,一層導電膜34,一層外絕緣膜35及一散熱鰭片36。 [0021] 散熱板31具有一第三表面310,一與第三表面310相對之 第四表面311及位於第三表面310與第四表面311之間之 側面312。散熱板31設置有複數個並行之第三通孔313。 複數個第三通孔31 3分別貫穿散熱板31之第三表面310及 第四表面311,第三通孔313之内壁設置有與導電柱323 之外螺紋332相嚙合之内螺紋3130。複數個第三通孔313 與複數個固態發光元件32分別對應,即該複數個固態發 光元件32之導電柱323可分別固持於該複數個第三通孔 313中並形成電連接。 [0022] 固態發光元件32可/為上述第一實施例所提供之固態發光 元件10,亦可為上述第二實施例所提供之固態發光元件 20 » [0023] 内絕緣膜33,導電膜34及外絕緣膜35依次設置於散熱板 31之第四表面311—側。内絕緣膜33與散熱板31之第四 表面311相鄰,内絕緣膜33設置有複數個第四通孔331。 複數個第四通孔331分別與複數個第三通孔313相對應且 與第三通孔313相連通。 [0024] 固態發光元件32之導電棒324之遠離基板321之一端穿過 第四通孔331與導電膜34電連接。 [0025] 可理解的是,外絕緣膜35不僅可設置於導電膜34之遠離 内絕緣膜33之一側,亦可設置於散熱板31之側面312上。 [0026] 散熱鰭片36設置於導電膜34之遠離内絕緣膜33之一側且 097109094 表單編號 A0101 第 9 頁/共 20 頁 1003455872-0 1380468 __ 100年.12月09日梭正替換頁· 與外絕緣膜35相連。 [0027]於本實施例中,散熱板31及導電膦34分別與外部電源(圖 - 未示)形成電連接,從而對分別設置於複數個第三通孔 313中之複數個固態發光元件32提供電能。當固態發光元 件32之固態發光晶片322處於導通狀態時,其發出得熱量 可藉由基板321、導電柱323擴散至散熱板31,由於散熱 板31與空氣具有較大之接觸面積從而有利於散熱板31中 之熱量擴散至外部空氣,有效地提高了光源模組3〇之散 熱效率。散熱板31中之部分熱量向遠離固態發光晶片322 φ 之方向擴散,從而進一步提高了光源模組30之散熱效率 [0028] 請參見圖5,該複數個固態發光元件32之基板321之形狀 為四邊形、五角形、六角形,有助於利用扳手(Screw Driver)對固態發光元件32之基板321施加扭力,以將固 態發光元件32之導電柱323旋入散熱板31之第三通孔31 3 使該固態發光元件32導電柱323與散熱板31之第三通孔 313螺紋嚙合。可理解的是,該複數個固態發光元件32之 基板321之形狀亦可為橢圓形,具有凸起結構之圓形等, 只要有助於利用扳手對其施加扭力即可。 [0029] 綜上所述,本發明確已符合發明專利之要件,遂依法提 出專利申請》惟,以上所述者僅為本發明之較佳實施方 式,自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ,皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】' 1003455872-0 097109094 表單编號A0101 笫頁/共20頁 1380468 ♦ 100年.12月09日修正番換頁 [0030] 圖1係先前技術之一種固態發光元件之截面示意圖。 • [0031] 圖2係本發明第一實施例之固態發光元件之截面示意圖。 [0032] 圖3係本發明第二實施例之固態發光元件之截面示意圖。 [0033] 圖4係本發明第三實施例之光源模組之局部截面示意圖。 [0034] 圖5係圖4所示光源模組之局部俯視示意圖。 [0035] 【主要元件符號說明】 固態發光元件:100、10、20、32 φ [0036] 基座:101 [0037] 第一電極:102 [0038] 第二電極:103 [0039] 發光二極體晶片:104 [0040] 封裝體:105、15 [0041] 基板:11、21、321 φ [0042] 固態發光晶片:12、22、322 [0043] 導電柱:13、23、323 [0044] 導電棒:14、24、324 [0045] 第一表面:110、210 [0046] 第二表面:112 [0047] 第一通扎:113、213 [0048] 第二通扎:115 097109094 表單編號A0101 第11頁/共20頁 1003455872-0 1380468 [0049] 頂部電極:121 [0050] 底部電極:122 [0051] 金屬線:16、26、 [0052] 絕緣層:17 [0053] 正極:221 [0054] 負極:222 [0055] 凸起:231 [0056] 光源模組:30 [0057] 散熱板:31 [0058] 内絕緣膜:33 [0059] 導電膜:34 [0060] 外絕緣膜:35 [0061] 散熱鰭片:36 [0062] 第三表面:310 [0063] 第四表面:311 [0064] 側面:312 [0065] 第三通孔:313 [0066] 外螺紋:132,332 [0067] 内螺紋:3130 097109094 表單編號A0101 第12頁/共20頁 100年.12月09日梭正替換頁 1003455872-0100 years. December 09 nuclear replacement page A heat sink 31, a plurality of solid state light emitting elements 32, an inner insulating film 33, a conductive film 34, an outer insulating film 35 and a heat sink fin 36. [0021] The heat dissipation plate 31 has a third surface 310, a fourth surface 311 opposite to the third surface 310, and a side surface 312 between the third surface 310 and the fourth surface 311. The heat dissipation plate 31 is provided with a plurality of parallel third through holes 313. The plurality of third through holes 31 3 respectively penetrate the third surface 310 and the fourth surface 311 of the heat dissipation plate 31. The inner wall of the third through hole 313 is provided with internal threads 3130 that mesh with the external threads 332 of the conductive post 323. The plurality of third through holes 313 respectively correspond to the plurality of solid state light emitting elements 32, that is, the conductive pillars 323 of the plurality of solid state light emitting elements 32 are respectively held in the plurality of third through holes 313 and form an electrical connection. The solid-state light-emitting element 32 can be the solid-state light-emitting element 10 provided in the first embodiment, or the solid-state light-emitting element 20 provided in the second embodiment described above. [0023] The inner insulating film 33, the conductive film 34 The outer insulating film 35 is sequentially disposed on the fourth surface 311 side of the heat dissipation plate 31. The inner insulating film 33 is adjacent to the fourth surface 311 of the heat dissipation plate 31, and the inner insulating film 33 is provided with a plurality of fourth through holes 331. The plurality of fourth through holes 331 respectively correspond to the plurality of third through holes 313 and communicate with the third through holes 313. [0024] One end of the conductive bar 324 of the solid-state light-emitting element 32 is electrically connected to the conductive film 34 through one end of the substrate 321 through the fourth through hole 331. It is to be understood that the outer insulating film 35 may be disposed not only on one side of the conductive film 34 away from the inner insulating film 33 but also on the side surface 312 of the heat dissipation plate 31. [0026] The heat dissipation fins 36 are disposed on one side of the conductive film 34 away from the inner insulation film 33 and 097109094. Form No. A0101 Page 9 of 20 Page 1003455872-0 1380468 __ 100 years. December 09 Shuttle replacement page· It is connected to the outer insulating film 35. In the present embodiment, the heat dissipation plate 31 and the conductive phosphine 34 are electrically connected to an external power source (not shown), respectively, to the plurality of solid state light emitting elements 32 respectively disposed in the plurality of third through holes 313. Provide electrical energy. When the solid-state light-emitting chip 322 of the solid-state light-emitting element 32 is in an on state, the heat generated by the solid-state light-emitting element 32 can be diffused to the heat dissipation plate 31 by the substrate 321 and the conductive pillar 323, and the heat dissipation plate 31 has a large contact area with air, thereby facilitating heat dissipation. The heat in the panel 31 is diffused to the outside air, which effectively improves the heat dissipation efficiency of the light source module 3. A part of the heat in the heat dissipation plate 31 is diffused away from the solid-state light-emitting chip 322 φ, thereby further improving the heat dissipation efficiency of the light source module 30. [0028] Referring to FIG. 5, the shape of the substrate 321 of the plurality of solid-state light-emitting elements 32 is The quadrilateral, the pentagon, and the hexagon help to apply a torque to the substrate 321 of the solid-state light-emitting element 32 by using a Screw Driver to screw the conductive post 323 of the solid-state light-emitting element 32 into the third through hole 31 3 of the heat dissipation plate 31. The solid state light emitting element 32 has a conductive post 323 threadedly engaged with the third through hole 313 of the heat sink 31. It can be understood that the shape of the substrate 321 of the plurality of solid-state light-emitting elements 32 can also be elliptical, rounded with a convex structure, etc., as long as it helps to apply a torque to the wrench. [0029] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of patent application in this case. . Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. [Simple description of the drawing] '1003455872-0 097109094 Form No. A0101 笫 page/Total 20 pages 1380468 ♦ 100 years. December 09 correction page change [0030] FIG. 1 is a schematic cross-sectional view of a solid state light-emitting element of the prior art. [0031] FIG. 2 is a schematic cross-sectional view showing a solid state light emitting device according to a first embodiment of the present invention. 3 is a schematic cross-sectional view showing a solid state light emitting device according to a second embodiment of the present invention. 4 is a partial cross-sectional view showing a light source module according to a third embodiment of the present invention. 5 is a partial top plan view of the light source module shown in FIG. 4. [Description of main component symbols] Solid-state light-emitting element: 100, 10, 20, 32 φ [0036] pedestal: 101 [0037] First electrode: 102 [0038] Second electrode: 103 [0039] Light-emitting diode Bulk wafer: 104 [0040] Package: 105, 15 [0041] Substrate: 11, 21, 321 φ [0042] Solid-state light-emitting wafer: 12, 22, 322 [0043] Conductive column: 13, 23, 323 [0044] Conductive rods: 14, 24, 324 [0045] First surface: 110, 210 [0046] Second surface: 112 [0047] First pass: 113, 213 [0048] Second pass: 115 097109094 Form number A0101 Page 11 of 20 1003455872-0 1380468 [0049] Top electrode: 121 [0050] Bottom electrode: 122 [0051] Metal wire: 16, 26, [0052] Insulation: 17 [0053] Positive electrode: 221 [0054 Negative electrode: 222 [0055] Bump: 231 [0056] Light source module: 30 [0057] Heat sink: 31 [0058] Inner insulating film: 33 [0059] Conductive film: 34 [0060] Outer insulating film: 35 [ 0061] Heat sink fin: 36 [0062] Third surface: 310 [0063] Fourth surface: 311 [0064] Side: 312 [0065] Third through hole: 313 [0066] External thread: 132 332 [0067] internal thread: 3130097109094 Form Number A0101 Page 12 / Total 20 100 On December 9 page 1003455872-0 shuttle being replaced.
1380468 . · 100年.12月09日梭正替换頁 [0068] 第四通扎:331 • 097109094 表單編號A0101 第13頁/共20頁 1003455872-01380468 . · 100 years. December 09 shuttle replacement page [0068] Fourth connection: 331 • 097109094 Form number A0101 Page 13 of 20 1003455872-0
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97109094A TWI380468B (en) | 2008-03-14 | 2008-03-14 | Solid-state lighting element and light source module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97109094A TWI380468B (en) | 2008-03-14 | 2008-03-14 | Solid-state lighting element and light source module |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200939533A TW200939533A (en) | 2009-09-16 |
TWI380468B true TWI380468B (en) | 2012-12-21 |
Family
ID=44867737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97109094A TWI380468B (en) | 2008-03-14 | 2008-03-14 | Solid-state lighting element and light source module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI380468B (en) |
-
2008
- 2008-03-14 TW TW97109094A patent/TWI380468B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200939533A (en) | 2009-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5082083B2 (en) | LED lighting device | |
US7893444B2 (en) | Light emitting diode and light source module having same | |
US7408204B2 (en) | Flip-chip packaging structure for light emitting diode and method thereof | |
US9349930B2 (en) | LED module and lighting assembly | |
JP2006287188A (en) | LED PACKAGE UTILIZING Si SUBSTRATE AND MANUFACTURING METHOD THEREFOR | |
US8801238B2 (en) | Light-emitting device | |
US20100301359A1 (en) | Light Emitting Diode Package Structure | |
TWI447975B (en) | Led chip structure, led package substrate, led package structure and method of forming same | |
JP2010267834A (en) | Optical semiconductor device module and chip for conducting heat used for the same | |
JP5131668B2 (en) | LED lighting device | |
TW200830583A (en) | Combined assembly of LED and liquid/gas phase heat dissipation device | |
CN106058030A (en) | Method of manufacturing semiconductor light-emitting unit heat dissipation structure | |
TWI517442B (en) | Light emitting diode (led) device and manufacturing method thereof | |
TW200905924A (en) | Multi-chip light emitting diode package | |
TWI380468B (en) | Solid-state lighting element and light source module | |
JP2011254106A (en) | Semiconductor device module and heat conduction chip for use therein | |
TWI591860B (en) | Light emitting diodes package structure for high-voltage power supply | |
TWM406259U (en) | Package substrate of light emitting diode having a double-sided DLC film | |
TWI411145B (en) | High heat dissipation stacking / cladding type light emitting diodes | |
CN106098920B (en) | A kind of radiator structure of semiconductor light emitting unit | |
US10367126B2 (en) | Light-emitting device | |
KR101259876B1 (en) | Led package having a thermoelectric element and method for manufacturin thereof | |
TWI438948B (en) | Light emitting diode package | |
EP2251915A1 (en) | Light emitting diode and light source module having same | |
TWM338437U (en) | Assembly structure of light-emitting diode |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |