JP5210408B2 - 脆性材料基板の分断装置 - Google Patents

脆性材料基板の分断装置 Download PDF

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Publication number
JP5210408B2
JP5210408B2 JP2011084776A JP2011084776A JP5210408B2 JP 5210408 B2 JP5210408 B2 JP 5210408B2 JP 2011084776 A JP2011084776 A JP 2011084776A JP 2011084776 A JP2011084776 A JP 2011084776A JP 5210408 B2 JP5210408 B2 JP 5210408B2
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JP
Japan
Prior art keywords
material substrate
brittle material
suction
air
suction pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011084776A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012218246A (ja
Inventor
圭介 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011084776A priority Critical patent/JP5210408B2/ja
Priority to TW100145925A priority patent/TWI472493B/zh
Priority to KR1020120007158A priority patent/KR101317877B1/ko
Priority to CN201210062905.2A priority patent/CN102730957B/zh
Publication of JP2012218246A publication Critical patent/JP2012218246A/ja
Application granted granted Critical
Publication of JP5210408B2 publication Critical patent/JP5210408B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP2011084776A 2011-04-06 2011-04-06 脆性材料基板の分断装置 Expired - Fee Related JP5210408B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011084776A JP5210408B2 (ja) 2011-04-06 2011-04-06 脆性材料基板の分断装置
TW100145925A TWI472493B (zh) 2011-04-06 2011-12-13 The breaking device of the brittle material substrate
KR1020120007158A KR101317877B1 (ko) 2011-04-06 2012-01-25 취성 재료 기판의 분단 장치
CN201210062905.2A CN102730957B (zh) 2011-04-06 2012-03-07 脆性材料基板的分断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011084776A JP5210408B2 (ja) 2011-04-06 2011-04-06 脆性材料基板の分断装置

Publications (2)

Publication Number Publication Date
JP2012218246A JP2012218246A (ja) 2012-11-12
JP5210408B2 true JP5210408B2 (ja) 2013-06-12

Family

ID=46987357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011084776A Expired - Fee Related JP5210408B2 (ja) 2011-04-06 2011-04-06 脆性材料基板の分断装置

Country Status (4)

Country Link
JP (1) JP5210408B2 (zh)
KR (1) KR101317877B1 (zh)
CN (1) CN102730957B (zh)
TW (1) TWI472493B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10090430B2 (en) 2014-05-27 2018-10-02 Sunpower Corporation System for manufacturing a shingled solar cell module
EP3522045B1 (en) * 2014-05-27 2022-08-31 Maxeon Solar Pte. Ltd. Shingled solar cell module
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
US11949026B2 (en) 2014-05-27 2024-04-02 Maxeon Solar Pte. Ltd. Shingled solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects
CN105014809A (zh) * 2015-08-11 2015-11-04 镇江环太硅科技有限公司 一种整垫条
CN110828592B (zh) 2015-08-18 2023-04-28 迈可晟太阳能有限公司 太阳能面板
JP2017112265A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ ウエーハの加工方法
JP6212580B2 (ja) * 2016-02-29 2017-10-11 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
CN105731775B (zh) * 2016-04-29 2018-01-02 长江大学 光玻熔炼生产线自动下料机
CN110217976B (zh) * 2019-05-14 2021-11-02 Tcl华星光电技术有限公司 一种支撑平台

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3043536B2 (ja) * 1993-03-26 2000-05-22 三星ダイヤモンド工業株式会社 ブレイキングテーブル
JP3528216B2 (ja) * 1993-10-26 2004-05-17 カシオ計算機株式会社 ガラス切断方法
JP3847864B2 (ja) * 1995-11-21 2006-11-22 三星ダイヤモンド工業株式会社 ガラススクライバー
JP3220006B2 (ja) * 1996-04-11 2001-10-22 株式会社ベルデックス 板ガラスの破断方法および装置
JP4342039B2 (ja) 1999-06-15 2009-10-14 三星ダイヤモンド工業株式会社 ガラススクライバー及びスクライブ方法
JP4421697B2 (ja) * 1999-06-15 2010-02-24 三星ダイヤモンド工業株式会社 ブレイク装置
JP2001347497A (ja) * 2000-06-06 2001-12-18 Hitachi Ltd 分離切断方法及び装置
JP3787489B2 (ja) * 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
JP4619024B2 (ja) * 2004-03-19 2011-01-26 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JPWO2007142264A1 (ja) * 2006-06-08 2009-10-29 東レエンジニアリング株式会社 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板

Also Published As

Publication number Publication date
CN102730957B (zh) 2015-08-12
TW201240927A (en) 2012-10-16
KR101317877B1 (ko) 2013-10-16
JP2012218246A (ja) 2012-11-12
KR20120114148A (ko) 2012-10-16
CN102730957A (zh) 2012-10-17
TWI472493B (zh) 2015-02-11

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