JP5210323B2 - 無鉛ソルダ合金 - Google Patents
無鉛ソルダ合金 Download PDFInfo
- Publication number
- JP5210323B2 JP5210323B2 JP2009543954A JP2009543954A JP5210323B2 JP 5210323 B2 JP5210323 B2 JP 5210323B2 JP 2009543954 A JP2009543954 A JP 2009543954A JP 2009543954 A JP2009543954 A JP 2009543954A JP 5210323 B2 JP5210323 B2 JP 5210323B2
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- JP
- Japan
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- experimental example
- experiment
- thermal shock
- test
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 title claims description 44
- 229910045601 alloy Inorganic materials 0.000 title claims description 30
- 239000000956 alloy Substances 0.000 title claims description 30
- 239000010949 copper Substances 0.000 claims description 33
- 229910052718 tin Inorganic materials 0.000 claims description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 23
- 229910052790 beryllium Inorganic materials 0.000 claims description 20
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000002474 experimental method Methods 0.000 description 69
- 238000012360 testing method Methods 0.000 description 54
- 230000035939 shock Effects 0.000 description 49
- 230000000052 comparative effect Effects 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910052796 boron Inorganic materials 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910002058 ternary alloy Inorganic materials 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910017770 Cu—Ag Inorganic materials 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910002059 quaternary alloy Inorganic materials 0.000 description 2
- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20060138548 | 2006-12-29 | ||
| KR10-2006-0138548 | 2006-12-29 | ||
| KR1020070139767A KR101042031B1 (ko) | 2006-12-29 | 2007-12-28 | 무연 솔더 합금 |
| KR10-2007-0139767 | 2007-12-28 | ||
| PCT/KR2007/006951 WO2008082191A1 (en) | 2006-12-29 | 2007-12-28 | Pb-free solder alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010514931A JP2010514931A (ja) | 2010-05-06 |
| JP5210323B2 true JP5210323B2 (ja) | 2013-06-12 |
Family
ID=39815104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009543954A Active JP5210323B2 (ja) | 2006-12-29 | 2007-12-28 | 無鉛ソルダ合金 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100092335A1 (ko) |
| EP (1) | EP2101951A4 (ko) |
| JP (1) | JP5210323B2 (ko) |
| KR (2) | KR101042031B1 (ko) |
| CN (1) | CN101588889A (ko) |
| TW (1) | TWI366497B (ko) |
| WO (1) | WO2008082191A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2101951A4 (en) | 2006-12-29 | 2010-01-27 | Iljin Copper Foil Co Ltd | LEAD-FREE SOLDERING ALLOY |
| JP5245568B2 (ja) * | 2008-06-23 | 2013-07-24 | 新日鉄住金マテリアルズ株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
| CN103056543B (zh) * | 2013-01-18 | 2015-03-25 | 江苏师范大学 | 一种含Yb、Al、B的纳米无铅钎料 |
| CN105149809B (zh) * | 2015-10-10 | 2017-09-26 | 南京青锐风新材料科技有限公司 | 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法 |
| CN105834612B (zh) * | 2016-05-04 | 2018-02-23 | 中南大学 | 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料 |
| CN105834611B (zh) * | 2016-05-04 | 2018-02-13 | 中南大学 | 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料 |
| CN107877031A (zh) * | 2017-11-27 | 2018-04-06 | 东莞市千岛金属锡品有限公司 | 一种无铅低温焊料及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2024545A (en) * | 1933-10-04 | 1935-12-17 | L D Caulk Company | Dental alloy |
| US3827884A (en) * | 1970-07-15 | 1974-08-06 | Daido Metal Co | Tin based white metal bearing alloys producing good bond with backing material |
| GB2201545B (en) * | 1987-01-30 | 1991-09-11 | Tanaka Electronics Ind | Method for connecting semiconductor material |
| JP2778171B2 (ja) * | 1990-01-10 | 1998-07-23 | 三菱マテリアル株式会社 | 半導体装置組み立て用Ｐｂ合金はんだ材 |
| JP3226213B2 (ja) * | 1996-10-17 | 2001-11-05 | 松下電器産業株式会社 | 半田材料及びそれを用いた電子部品 |
| US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
| JP3306007B2 (ja) * | 1998-06-30 | 2002-07-24 | 株式会社東芝 | ハンダ材 |
| JP3833829B2 (ja) * | 1998-07-07 | 2006-10-18 | 内橋エステック株式会社 | はんだ合金及び電子部品の実装方法 |
| JP2002248596A (ja) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
| KR100698662B1 (ko) * | 2003-12-02 | 2007-03-23 | 에프씨엠 가부시끼가이샤 | 주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품 |
| JP2005288544A (ja) * | 2004-03-09 | 2005-10-20 | Toshiba Corp | 無鉛はんだ、はんだ付け方法および電子部品 |
| JP2005288478A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 無鉛はんだ接合部 |
| JP2005319470A (ja) * | 2004-05-06 | 2005-11-17 | Katsuaki Suganuma | 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法 |
| JP4471824B2 (ja) * | 2004-12-09 | 2010-06-02 | 日本電波工業株式会社 | 高温はんだ及びクリームはんだ |
| JP4471825B2 (ja) * | 2004-12-09 | 2010-06-02 | 日本電波工業株式会社 | 電子部品、及び電子部品の製造方法 |
| JP4617485B2 (ja) * | 2004-12-13 | 2011-01-26 | ナノジョイン株式会社 | はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ |
| JP2008030047A (ja) * | 2006-07-26 | 2008-02-14 | Eishin Kogyo Kk | 無鉛ハンダ |
| EP2101951A4 (en) | 2006-12-29 | 2010-01-27 | Iljin Copper Foil Co Ltd | LEAD-FREE SOLDERING ALLOY |
-
2007
- 2007-12-28 EP EP07860735A patent/EP2101951A4/en not_active Withdrawn
- 2007-12-28 JP JP2009543954A patent/JP5210323B2/ja active Active
- 2007-12-28 CN CNA200780047594XA patent/CN101588889A/zh active Pending
- 2007-12-28 KR KR1020070139767A patent/KR101042031B1/ko active IP Right Grant
- 2007-12-28 US US12/521,655 patent/US20100092335A1/en not_active Abandoned
- 2007-12-28 WO PCT/KR2007/006951 patent/WO2008082191A1/en active Application Filing
-
2008
- 2008-06-26 TW TW097123948A patent/TWI366497B/zh active
-
2010
- 2010-11-22 KR KR1020100116460A patent/KR101165426B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008082191A1 (en) | 2008-07-10 |
| KR20100132470A (ko) | 2010-12-17 |
| KR20080063176A (ko) | 2008-07-03 |
| KR101165426B1 (ko) | 2012-07-12 |
| CN101588889A (zh) | 2009-11-25 |
| US20100092335A1 (en) | 2010-04-15 |
| TWI366497B (en) | 2012-06-21 |
| EP2101951A1 (en) | 2009-09-23 |
| EP2101951A4 (en) | 2010-01-27 |
| KR101042031B1 (ko) | 2011-06-16 |
| JP2010514931A (ja) | 2010-05-06 |
| TW200927358A (en) | 2009-07-01 |
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