EP2101951A4 - LEAD-FREE SOLDERING ALLOY - Google Patents

LEAD-FREE SOLDERING ALLOY

Info

Publication number
EP2101951A4
EP2101951A4 EP07860735A EP07860735A EP2101951A4 EP 2101951 A4 EP2101951 A4 EP 2101951A4 EP 07860735 A EP07860735 A EP 07860735A EP 07860735 A EP07860735 A EP 07860735A EP 2101951 A4 EP2101951 A4 EP 2101951A4
Authority
EP
European Patent Office
Prior art keywords
free solder
solder alloy
alloy
free
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07860735A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2101951A1 (en
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Copper Foil Co Ltd
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of EP2101951A1 publication Critical patent/EP2101951A1/en
Publication of EP2101951A4 publication Critical patent/EP2101951A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
EP07860735A 2006-12-29 2007-12-28 LEAD-FREE SOLDERING ALLOY Withdrawn EP2101951A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20060138548 2006-12-29
KR1020070139767A KR101042031B1 (ko) 2006-12-29 2007-12-28 무연 솔더 합금
PCT/KR2007/006951 WO2008082191A1 (en) 2006-12-29 2007-12-28 Pb-free solder alloy

Publications (2)

Publication Number Publication Date
EP2101951A1 EP2101951A1 (en) 2009-09-23
EP2101951A4 true EP2101951A4 (en) 2010-01-27

Family

ID=39815104

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07860735A Withdrawn EP2101951A4 (en) 2006-12-29 2007-12-28 LEAD-FREE SOLDERING ALLOY

Country Status (7)

Country Link
US (1) US20100092335A1 (ko)
EP (1) EP2101951A4 (ko)
JP (1) JP5210323B2 (ko)
KR (2) KR101042031B1 (ko)
CN (1) CN101588889A (ko)
TW (1) TWI366497B (ko)
WO (1) WO2008082191A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101951A4 (en) 2006-12-29 2010-01-27 Iljin Copper Foil Co Ltd LEAD-FREE SOLDERING ALLOY
JP5245568B2 (ja) * 2008-06-23 2013-07-24 新日鉄住金マテリアルズ株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
CN103056543B (zh) * 2013-01-18 2015-03-25 江苏师范大学 一种含Yb、Al、B的纳米无铅钎料
CN105149809B (zh) * 2015-10-10 2017-09-26 南京青锐风新材料科技有限公司 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834612B (zh) * 2016-05-04 2018-02-23 中南大学 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料
CN105834611B (zh) * 2016-05-04 2018-02-13 中南大学 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0847828A1 (en) * 1996-10-17 1998-06-17 Matsushita Electric Industrial Co., Ltd Solder material and electronic part using the same
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP2000015479A (ja) * 1998-07-07 2000-01-18 Uchihashi Estec Co Ltd はんだ合金及び電子部品の実装方法
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
US20050123784A1 (en) * 2003-12-02 2005-06-09 Fcm Co., Ltd. Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
JP2005288478A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 無鉛はんだ接合部
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP2006159265A (ja) * 2004-12-09 2006-06-22 Nippon Dempa Kogyo Co Ltd 高温はんだ及びクリームはんだ
JP2006159266A (ja) * 2004-12-09 2006-06-22 Nippon Dempa Kogyo Co Ltd 電子部品、及び電子部品の製造方法
JP2006167800A (ja) * 2004-12-13 2006-06-29 Nanojoin Kk はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ及びアルミニウム用ろう材

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024545A (en) * 1933-10-04 1935-12-17 L D Caulk Company Dental alloy
US3827884A (en) * 1970-07-15 1974-08-06 Daido Metal Co Tin based white metal bearing alloys producing good bond with backing material
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
JP2778171B2 (ja) * 1990-01-10 1998-07-23 三菱マテリアル株式会社 半導体装置組み立て用Ｐｂ合金はんだ材
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP2008030047A (ja) * 2006-07-26 2008-02-14 Eishin Kogyo Kk 無鉛ハンダ
EP2101951A4 (en) 2006-12-29 2010-01-27 Iljin Copper Foil Co Ltd LEAD-FREE SOLDERING ALLOY

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0847828A1 (en) * 1996-10-17 1998-06-17 Matsushita Electric Industrial Co., Ltd Solder material and electronic part using the same
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP2000015479A (ja) * 1998-07-07 2000-01-18 Uchihashi Estec Co Ltd はんだ合金及び電子部品の実装方法
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
US20050123784A1 (en) * 2003-12-02 2005-06-09 Fcm Co., Ltd. Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
JP2005288478A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 無鉛はんだ接合部
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP2006159265A (ja) * 2004-12-09 2006-06-22 Nippon Dempa Kogyo Co Ltd 高温はんだ及びクリームはんだ
JP2006159266A (ja) * 2004-12-09 2006-06-22 Nippon Dempa Kogyo Co Ltd 電子部品、及び電子部品の製造方法
JP2006167800A (ja) * 2004-12-13 2006-06-29 Nanojoin Kk はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ及びアルミニウム用ろう材

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 1999, YE L ET AL: "Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron", XP002560675, Database accession no. 6364429 *
KARL J . PUTTLITZ AND KATHLEEN A . STALTER: "Chapter 8. Sn-Ag and Sn-Ag-X Solders and Properties", 2004, ISBN: 978-0-8247-4870-8, Retrieved from the Internet <URL:http://www.crcnetbase.com/doi/pdfplus/10.1201/9780203021484.ch8> DOI: 10.1201/9780203021484.ch8 *
See also references of WO2008082191A1 *
YE L ET AL: "Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron", PROCEEDINGS INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS. PROCESSES, PROPERTIES AND INTERFACES (IEEE CAT. NO.99TH8405) IMAPS - INT. MICROELECTRON. & PACKAGING SOC RESTON, VA, USA, 1999, pages 262 - 267, XP002560676, ISBN: 0-930815-56-4 *

Also Published As

Publication number Publication date
WO2008082191A1 (en) 2008-07-10
KR20100132470A (ko) 2010-12-17
KR20080063176A (ko) 2008-07-03
KR101165426B1 (ko) 2012-07-12
JP5210323B2 (ja) 2013-06-12
CN101588889A (zh) 2009-11-25
US20100092335A1 (en) 2010-04-15
TWI366497B (en) 2012-06-21
EP2101951A1 (en) 2009-09-23
KR101042031B1 (ko) 2011-06-16
JP2010514931A (ja) 2010-05-06
TW200927358A (en) 2009-07-01

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RIC1 Information provided on ipc code assigned before grant

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Ipc: B23K 35/26 20060101ALI20091217BHEP

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