US20100092335A1 - Pb-free solder alloy - Google Patents

Pb-free solder alloy Download PDF

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Publication number
US20100092335A1
US20100092335A1 US12/521,655 US52165507A US2010092335A1 US 20100092335 A1 US20100092335 A1 US 20100092335A1 US 52165507 A US52165507 A US 52165507A US 2010092335 A1 US2010092335 A1 US 2010092335A1
Authority
US
United States
Prior art keywords
specimen
experiment
solder alloy
free solder
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/521,655
Other languages
English (en)
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Copper Foil Co Ltd
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Assigned to ILJIN COPPER FOIL CO., LTD. reassignment ILJIN COPPER FOIL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANG, KYOO-SIK, KIM, SANG-BEOM, LEE, DONG-NYUNG
Publication of US20100092335A1 publication Critical patent/US20100092335A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
US12/521,655 2006-12-29 2007-12-28 Pb-free solder alloy Abandoned US20100092335A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR20060138548 2006-12-29
KR10-2006-0138548 2006-12-29
KR1020070139767A KR101042031B1 (ko) 2006-12-29 2007-12-28 무연 솔더 합금
KR10-2007-0139767 2007-12-28
PCT/KR2007/006951 WO2008082191A1 (en) 2006-12-29 2007-12-28 Pb-free solder alloy

Publications (1)

Publication Number Publication Date
US20100092335A1 true US20100092335A1 (en) 2010-04-15

Family

ID=39815104

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/521,655 Abandoned US20100092335A1 (en) 2006-12-29 2007-12-28 Pb-free solder alloy

Country Status (7)

Country Link
US (1) US20100092335A1 (ko)
EP (1) EP2101951A4 (ko)
JP (1) JP5210323B2 (ko)
KR (2) KR101042031B1 (ko)
CN (1) CN101588889A (ko)
TW (1) TWI366497B (ko)
WO (1) WO2008082191A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101951A4 (en) 2006-12-29 2010-01-27 Iljin Copper Foil Co Ltd LEAD-FREE SOLDERING ALLOY
JP5245568B2 (ja) * 2008-06-23 2013-07-24 新日鉄住金マテリアルズ株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
CN103056543B (zh) * 2013-01-18 2015-03-25 江苏师范大学 一种含Yb、Al、B的纳米无铅钎料
CN105149809B (zh) * 2015-10-10 2017-09-26 南京青锐风新材料科技有限公司 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834612B (zh) * 2016-05-04 2018-02-23 中南大学 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料
CN105834611B (zh) * 2016-05-04 2018-02-13 中南大学 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024545A (en) * 1933-10-04 1935-12-17 L D Caulk Company Dental alloy
US3827884A (en) * 1970-07-15 1974-08-06 Daido Metal Co Tin based white metal bearing alloys producing good bond with backing material
US5384090A (en) * 1987-01-30 1995-01-24 Tanaka Denshi Kogyo Kabushiki Kaisha Fine wire for forming bump electrodes using a wire bonder
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US20050123784A1 (en) * 2003-12-02 2005-06-09 Fcm Co., Ltd. Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2778171B2 (ja) * 1990-01-10 1998-07-23 三菱マテリアル株式会社 半導体装置組み立て用Ｐｂ合金はんだ材
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
JP3833829B2 (ja) * 1998-07-07 2006-10-18 内橋エステック株式会社 はんだ合金及び電子部品の実装方法
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP2005288478A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 無鉛はんだ接合部
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP4471824B2 (ja) * 2004-12-09 2010-06-02 日本電波工業株式会社 高温はんだ及びクリームはんだ
JP4471825B2 (ja) * 2004-12-09 2010-06-02 日本電波工業株式会社 電子部品、及び電子部品の製造方法
JP4617485B2 (ja) * 2004-12-13 2011-01-26 ナノジョイン株式会社 はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
JP2008030047A (ja) * 2006-07-26 2008-02-14 Eishin Kogyo Kk 無鉛ハンダ
EP2101951A4 (en) 2006-12-29 2010-01-27 Iljin Copper Foil Co Ltd LEAD-FREE SOLDERING ALLOY

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024545A (en) * 1933-10-04 1935-12-17 L D Caulk Company Dental alloy
US3827884A (en) * 1970-07-15 1974-08-06 Daido Metal Co Tin based white metal bearing alloys producing good bond with backing material
US5384090A (en) * 1987-01-30 1995-01-24 Tanaka Denshi Kogyo Kabushiki Kaisha Fine wire for forming bump electrodes using a wire bonder
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US20050123784A1 (en) * 2003-12-02 2005-06-09 Fcm Co., Ltd. Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same

Also Published As

Publication number Publication date
WO2008082191A1 (en) 2008-07-10
KR20100132470A (ko) 2010-12-17
KR20080063176A (ko) 2008-07-03
KR101165426B1 (ko) 2012-07-12
JP5210323B2 (ja) 2013-06-12
CN101588889A (zh) 2009-11-25
TWI366497B (en) 2012-06-21
EP2101951A1 (en) 2009-09-23
EP2101951A4 (en) 2010-01-27
KR101042031B1 (ko) 2011-06-16
JP2010514931A (ja) 2010-05-06
TW200927358A (en) 2009-07-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ILJIN COPPER FOIL CO., LTD.,KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, DONG-NYUNG;KIM, SANG-BEOM;KANG, KYOO-SIK;REEL/FRAME:022887/0554

Effective date: 20090601

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION