TWI366497B - Pb-free solder alloy - Google Patents

Pb-free solder alloy

Info

Publication number
TWI366497B
TWI366497B TW097123948A TW97123948A TWI366497B TW I366497 B TWI366497 B TW I366497B TW 097123948 A TW097123948 A TW 097123948A TW 97123948 A TW97123948 A TW 97123948A TW I366497 B TWI366497 B TW I366497B
Authority
TW
Taiwan
Prior art keywords
free solder
solder alloy
alloy
free
solder
Prior art date
Application number
TW097123948A
Other languages
English (en)
Other versions
TW200927358A (en
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of TW200927358A publication Critical patent/TW200927358A/zh
Application granted granted Critical
Publication of TWI366497B publication Critical patent/TWI366497B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
TW097123948A 2006-12-29 2008-06-26 Pb-free solder alloy TWI366497B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060138548 2006-12-29
KR1020070139767A KR101042031B1 (ko) 2006-12-29 2007-12-28 무연 솔더 합금

Publications (2)

Publication Number Publication Date
TW200927358A TW200927358A (en) 2009-07-01
TWI366497B true TWI366497B (en) 2012-06-21

Family

ID=39815104

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097123948A TWI366497B (en) 2006-12-29 2008-06-26 Pb-free solder alloy

Country Status (7)

Country Link
US (1) US20100092335A1 (zh)
EP (1) EP2101951A4 (zh)
JP (1) JP5210323B2 (zh)
KR (2) KR101042031B1 (zh)
CN (1) CN101588889A (zh)
TW (1) TWI366497B (zh)
WO (1) WO2008082191A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100092335A1 (en) 2006-12-29 2010-04-15 Iljin Copper Foil Co., Ltd. Pb-free solder alloy
JP5245568B2 (ja) * 2008-06-23 2013-07-24 新日鉄住金マテリアルズ株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
CN103056543B (zh) * 2013-01-18 2015-03-25 江苏师范大学 一种含Yb、Al、B的纳米无铅钎料
CN105149809B (zh) * 2015-10-10 2017-09-26 南京青锐风新材料科技有限公司 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834612B (zh) * 2016-05-04 2018-02-23 中南大学 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料
CN105834611B (zh) * 2016-05-04 2018-02-13 中南大学 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024545A (en) * 1933-10-04 1935-12-17 L D Caulk Company Dental alloy
US3827884A (en) * 1970-07-15 1974-08-06 Daido Metal Co Tin based white metal bearing alloys producing good bond with backing material
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
JP2778171B2 (ja) * 1990-01-10 1998-07-23 三菱マテリアル株式会社 半導体装置組み立て用Ｐｂ合金はんだ材
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
JP3833829B2 (ja) * 1998-07-07 2006-10-18 内橋エステック株式会社 はんだ合金及び電子部品の実装方法
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
KR100698662B1 (ko) * 2003-12-02 2007-03-23 에프씨엠 가부시끼가이샤 주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품
JP2005288544A (ja) * 2004-03-09 2005-10-20 Toshiba Corp 無鉛はんだ、はんだ付け方法および電子部品
JP2005288478A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 無鉛はんだ接合部
JP2005319470A (ja) * 2004-05-06 2005-11-17 Katsuaki Suganuma 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法
JP4471824B2 (ja) * 2004-12-09 2010-06-02 日本電波工業株式会社 高温はんだ及びクリームはんだ
JP4471825B2 (ja) * 2004-12-09 2010-06-02 日本電波工業株式会社 電子部品、及び電子部品の製造方法
JP4617485B2 (ja) * 2004-12-13 2011-01-26 ナノジョイン株式会社 はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
JP2008030047A (ja) * 2006-07-26 2008-02-14 Eishin Kogyo Kk 無鉛ハンダ
US20100092335A1 (en) 2006-12-29 2010-04-15 Iljin Copper Foil Co., Ltd. Pb-free solder alloy

Also Published As

Publication number Publication date
US20100092335A1 (en) 2010-04-15
JP2010514931A (ja) 2010-05-06
EP2101951A1 (en) 2009-09-23
KR20100132470A (ko) 2010-12-17
KR101165426B1 (ko) 2012-07-12
TW200927358A (en) 2009-07-01
KR101042031B1 (ko) 2011-06-16
WO2008082191A1 (en) 2008-07-10
CN101588889A (zh) 2009-11-25
EP2101951A4 (en) 2010-01-27
KR20080063176A (ko) 2008-07-03
JP5210323B2 (ja) 2013-06-12

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