JP5202233B2 - 実装構造体 - Google Patents

実装構造体 Download PDF

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Publication number
JP5202233B2
JP5202233B2 JP2008282666A JP2008282666A JP5202233B2 JP 5202233 B2 JP5202233 B2 JP 5202233B2 JP 2008282666 A JP2008282666 A JP 2008282666A JP 2008282666 A JP2008282666 A JP 2008282666A JP 5202233 B2 JP5202233 B2 JP 5202233B2
Authority
JP
Japan
Prior art keywords
substrate
solder
chip component
sealing resin
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008282666A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135479A5 (cg-RX-API-DMAC7.html
JP2009135479A (ja
Inventor
敦史 山口
秀規 宮川
茂昭 酒谷
行壮 松野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008282666A priority Critical patent/JP5202233B2/ja
Publication of JP2009135479A publication Critical patent/JP2009135479A/ja
Publication of JP2009135479A5 publication Critical patent/JP2009135479A5/ja
Application granted granted Critical
Publication of JP5202233B2 publication Critical patent/JP5202233B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2008282666A 2007-11-01 2008-11-04 実装構造体 Expired - Fee Related JP5202233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007284976 2007-11-01
JP2007284976 2007-11-01
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Publications (3)

Publication Number Publication Date
JP2009135479A JP2009135479A (ja) 2009-06-18
JP2009135479A5 JP2009135479A5 (cg-RX-API-DMAC7.html) 2011-09-15
JP5202233B2 true JP5202233B2 (ja) 2013-06-05

Family

ID=40587897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282666A Expired - Fee Related JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Country Status (4)

Country Link
US (1) US8410377B2 (cg-RX-API-DMAC7.html)
JP (1) JP5202233B2 (cg-RX-API-DMAC7.html)
KR (1) KR101011199B1 (cg-RX-API-DMAC7.html)
CN (1) CN101425511B (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
WO2011114759A1 (ja) * 2010-03-19 2011-09-22 株式会社安川電機 電子部品の実装方法および電子機器
JP5785760B2 (ja) * 2011-04-11 2015-09-30 日本特殊陶業株式会社 部品実装基板
US10032692B2 (en) * 2013-03-12 2018-07-24 Nvidia Corporation Semiconductor package structure
EP3499554A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung aus zwei bauelementen mit dazwischen befindlichem lot mittels heisspressens unterhalb der schmelztemperatur des lotmaterials einer lotvorform
EP3870389A1 (en) 2018-10-24 2021-09-01 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260592A (ja) * 1989-03-31 1990-10-23 Mitsumi Electric Co Ltd 回路基板
JPH0327441A (ja) 1989-06-23 1991-02-05 Nippon Telegr & Teleph Corp <Ntt> 知識情報処理システムにおけるデータベース利用方式
JP3027441B2 (ja) 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
US5520752A (en) 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH09214095A (ja) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd 基板および回路モジュールおよび回路モジュールの製造方法
JPH10163605A (ja) 1996-11-27 1998-06-19 Sony Corp 電子回路装置
JPH11177016A (ja) 1997-12-15 1999-07-02 Denso Corp 混成集積回路装置
JP3184491B2 (ja) * 1998-05-20 2001-07-09 松下電子工業株式会社 半導体装置およびその製造方法
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Industrial Co Ltd Module with embedded electric elements and the manufacturing method thereof
JP2001267473A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 半導体装置およびその製造方法
US6680436B2 (en) * 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6608375B2 (en) * 2001-04-06 2003-08-19 Oki Electric Industry Co., Ltd. Semiconductor apparatus with decoupling capacitor
SE520714C2 (sv) * 2001-04-20 2003-08-12 Aamic Ab Mikroreplikerade miniatyriserade elektriska komponenter
US6550665B1 (en) * 2001-06-06 2003-04-22 Indigo Systems Corporation Method for electrically interconnecting large contact arrays using eutectic alloy bumping
US7215022B2 (en) * 2001-06-21 2007-05-08 Ati Technologies Inc. Multi-die module
JP2003297873A (ja) * 2002-03-29 2003-10-17 Hitachi Ltd 半導体装置，構造体及び電子装置
JP2004193404A (ja) * 2002-12-12 2004-07-08 Alps Electric Co Ltd 回路モジュール、及びその製造方法
JP2005011838A (ja) 2003-06-16 2005-01-13 Toshiba Corp 半導体装置及びその組立方法
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP2005108950A (ja) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd セラミックモジュール部品およびその製造方法
US20070152025A1 (en) * 2004-03-02 2007-07-05 Fuji Electric Holdings Co., Ltd. Electronic part mounting method
JP4383257B2 (ja) * 2004-05-31 2009-12-16 三洋電機株式会社 回路装置およびその製造方法
JP2006100752A (ja) 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
CN101996962B (zh) * 2004-10-28 2013-01-16 京瓷株式会社 电子部件模块以及无线通信设备
JP4975342B2 (ja) * 2005-03-15 2012-07-11 パナソニック株式会社 導電性接着剤
TW200730288A (en) * 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making

Also Published As

Publication number Publication date
JP2009135479A (ja) 2009-06-18
KR101011199B1 (ko) 2011-01-26
KR20090045016A (ko) 2009-05-07
CN101425511B (zh) 2014-10-29
US20090116205A1 (en) 2009-05-07
CN101425511A (zh) 2009-05-06
US8410377B2 (en) 2013-04-02

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