JP5201511B2 - ウエハの保持テーブル - Google Patents

ウエハの保持テーブル Download PDF

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Publication number
JP5201511B2
JP5201511B2 JP2009008468A JP2009008468A JP5201511B2 JP 5201511 B2 JP5201511 B2 JP 5201511B2 JP 2009008468 A JP2009008468 A JP 2009008468A JP 2009008468 A JP2009008468 A JP 2009008468A JP 5201511 B2 JP5201511 B2 JP 5201511B2
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Japan
Prior art keywords
wafer
holding table
peripheral portion
rib
protective tape
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JP2009008468A
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Japanese (ja)
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JP2010165962A (ja
JP2010165962A5 (enExample
Inventor
隆樹 谷川
和哉 原田
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Takatori Corp
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Takatori Corp
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Priority to JP2009008468A priority Critical patent/JP5201511B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009008468A 2009-01-19 2009-01-19 ウエハの保持テーブル Active JP5201511B2 (ja)

Priority Applications (1)

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JP2009008468A JP5201511B2 (ja) 2009-01-19 2009-01-19 ウエハの保持テーブル

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JP2009008468A JP5201511B2 (ja) 2009-01-19 2009-01-19 ウエハの保持テーブル

Publications (3)

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JP2010165962A JP2010165962A (ja) 2010-07-29
JP2010165962A5 JP2010165962A5 (enExample) 2012-02-16
JP5201511B2 true JP5201511B2 (ja) 2013-06-05

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JP2009008468A Active JP5201511B2 (ja) 2009-01-19 2009-01-19 ウエハの保持テーブル

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JP (1) JP5201511B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160114128A (ko) * 2014-03-07 2016-10-04 제이디씨 가부시키가이샤 부압 시트 구조

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691364B2 (ja) * 2010-10-06 2015-04-01 富士電機株式会社 テープ貼付装置およびテープ貼付方法
JP5663297B2 (ja) 2010-12-27 2015-02-04 東京応化工業株式会社 塗布装置
CN102962762A (zh) * 2012-12-07 2013-03-13 日月光半导体制造股份有限公司 晶圆研磨用承载盘组件
JP6944625B2 (ja) * 2016-09-08 2021-10-06 株式会社タカトリ 基板への接着シート貼り付け装置及び貼り付け方法
CN114454023B (zh) * 2021-03-01 2022-12-16 华中科技大学 基于标准气缸的晶圆磨削吸附平台
CN115083988B (zh) * 2022-07-12 2023-01-31 法特迪精密科技（苏州）有限公司 面向探针台的晶圆吸附台及其变径环槽和转动环槽
CN120674313A (zh) * 2022-11-10 2025-09-19 华海清科股份有限公司 一种基板减薄方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3971120B2 (ja) * 2001-04-12 2007-09-05 大日本スクリーン製造株式会社 基板保持装置および基板処理装置
JP2004179513A (ja) * 2002-11-28 2004-06-24 Tokyo Electron Ltd 基板保持装置及び基板処理装置
JP4221271B2 (ja) * 2003-10-28 2009-02-12 Ｎｅｃエンジニアリング株式会社 テープ貼付装置
JP4307972B2 (ja) * 2003-12-10 2009-08-05 三洋電機株式会社 保護テープの接着方法及び保護テープ接着用テーブル
JP5390740B2 (ja) * 2005-04-27 2014-01-15 株式会社ディスコ ウェーハの加工方法
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160114128A (ko) * 2014-03-07 2016-10-04 제이디씨 가부시키가이샤 부압 시트 구조
KR101894445B1 (ko) * 2014-03-07 2018-09-03 제이디씨 가부시키가이샤 부압 시트 구조

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Publication number Publication date
JP2010165962A (ja) 2010-07-29

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