JP5188759B2 - 塗布装置及び塗布方法 - Google Patents
塗布装置及び塗布方法 Download PDFInfo
- Publication number
- JP5188759B2 JP5188759B2 JP2007205498A JP2007205498A JP5188759B2 JP 5188759 B2 JP5188759 B2 JP 5188759B2 JP 2007205498 A JP2007205498 A JP 2007205498A JP 2007205498 A JP2007205498 A JP 2007205498A JP 5188759 B2 JP5188759 B2 JP 5188759B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- flow rate
- substrate
- suction
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007205498A JP5188759B2 (ja) | 2007-08-07 | 2007-08-07 | 塗布装置及び塗布方法 |
TW097129425A TWI348396B (en) | 2007-08-07 | 2008-08-01 | Coating applicator and method of coating |
KR1020080076646A KR101034163B1 (ko) | 2007-08-07 | 2008-08-05 | 도포 장치 및 도포 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007205498A JP5188759B2 (ja) | 2007-08-07 | 2007-08-07 | 塗布装置及び塗布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009043828A JP2009043828A (ja) | 2009-02-26 |
JP5188759B2 true JP5188759B2 (ja) | 2013-04-24 |
Family
ID=40444274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007205498A Active JP5188759B2 (ja) | 2007-08-07 | 2007-08-07 | 塗布装置及び塗布方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5188759B2 (ko) |
KR (1) | KR101034163B1 (ko) |
TW (1) | TWI348396B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020131620A1 (en) * | 2018-12-21 | 2020-06-25 | Kateeva, Inc. | Devices, systems, and methods for controlling floatation of a substrate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120086888A1 (en) * | 2009-06-15 | 2012-04-12 | Sharp Kabushiki Kaisha | Lighting device, display device and television receiver |
JP5372824B2 (ja) * | 2010-03-30 | 2013-12-18 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5789416B2 (ja) * | 2011-06-03 | 2015-10-07 | 東京応化工業株式会社 | 塗布装置及び塗布方法 |
JP6010621B2 (ja) * | 2011-08-09 | 2016-10-19 | カティーバ, インコーポレイテッド | 下向き印刷装置および方法 |
CN106311529B (zh) * | 2015-06-30 | 2018-11-27 | 沈阳芯源微电子设备有限公司 | 一种液体均匀喷洒处理系统及其处理方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4049751B2 (ja) * | 2004-02-05 | 2008-02-20 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JP4226500B2 (ja) * | 2004-03-16 | 2009-02-18 | 東京エレクトロン株式会社 | 基板搬送機構および塗布膜形成装置 |
JP2006173172A (ja) * | 2004-12-13 | 2006-06-29 | Tokyo Cathode Laboratory Co Ltd | 基板支持装置 |
JP4413789B2 (ja) * | 2005-01-24 | 2010-02-10 | 東京エレクトロン株式会社 | ステージ装置および塗布処理装置 |
JP4554397B2 (ja) * | 2005-02-23 | 2010-09-29 | 東京エレクトロン株式会社 | ステージ装置および塗布処理装置 |
JP4378301B2 (ja) * | 2005-02-28 | 2009-12-02 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法及び基板処理プログラム |
JP4429943B2 (ja) * | 2005-03-17 | 2010-03-10 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP4607665B2 (ja) * | 2005-05-27 | 2011-01-05 | シーケーディ株式会社 | 非接触支持装置 |
JP4553376B2 (ja) * | 2005-07-19 | 2010-09-29 | 東京エレクトロン株式会社 | 浮上式基板搬送処理装置及び浮上式基板搬送処理方法 |
JP4570545B2 (ja) | 2005-09-22 | 2010-10-27 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP4673180B2 (ja) * | 2005-10-13 | 2011-04-20 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
-
2007
- 2007-08-07 JP JP2007205498A patent/JP5188759B2/ja active Active
-
2008
- 2008-08-01 TW TW097129425A patent/TWI348396B/zh active
- 2008-08-05 KR KR1020080076646A patent/KR101034163B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020131620A1 (en) * | 2018-12-21 | 2020-06-25 | Kateeva, Inc. | Devices, systems, and methods for controlling floatation of a substrate |
Also Published As
Publication number | Publication date |
---|---|
KR20090014983A (ko) | 2009-02-11 |
TW200932374A (en) | 2009-08-01 |
TWI348396B (en) | 2011-09-11 |
KR101034163B1 (ko) | 2011-05-12 |
JP2009043828A (ja) | 2009-02-26 |
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