JP5181219B2 - 封止用エポキシ樹脂組成物及び電子部品装置 - Google Patents

封止用エポキシ樹脂組成物及び電子部品装置 Download PDF

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Publication number
JP5181219B2
JP5181219B2 JP2007524709A JP2007524709A JP5181219B2 JP 5181219 B2 JP5181219 B2 JP 5181219B2 JP 2007524709 A JP2007524709 A JP 2007524709A JP 2007524709 A JP2007524709 A JP 2007524709A JP 5181219 B2 JP5181219 B2 JP 5181219B2
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Japan
Prior art keywords
epoxy resin
resin composition
group
magnesium hydroxide
compound
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JP2007524709A
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English (en)
Japanese (ja)
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JPWO2007007843A1 (ja
Inventor
良一 池澤
秀崇 吉沢
清一 赤城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2007524709A priority Critical patent/JP5181219B2/ja
Publication of JPWO2007007843A1 publication Critical patent/JPWO2007007843A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
JP2007524709A 2005-07-13 2006-07-13 封止用エポキシ樹脂組成物及び電子部品装置 Active JP5181219B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007524709A JP5181219B2 (ja) 2005-07-13 2006-07-13 封止用エポキシ樹脂組成物及び電子部品装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005204290 2005-07-13
JP2005204290 2005-07-13
PCT/JP2006/313994 WO2007007843A1 (ja) 2005-07-13 2006-07-13 封止用エポキシ樹脂組成物及び電子部品装置
JP2007524709A JP5181219B2 (ja) 2005-07-13 2006-07-13 封止用エポキシ樹脂組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2007007843A1 JPWO2007007843A1 (ja) 2009-01-29
JP5181219B2 true JP5181219B2 (ja) 2013-04-10

Family

ID=37637223

Family Applications (1)

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JP2007524709A Active JP5181219B2 (ja) 2005-07-13 2006-07-13 封止用エポキシ樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20090137717A1 (enExample)
JP (1) JP5181219B2 (enExample)
KR (2) KR101413822B1 (enExample)
CN (1) CN101223235B (enExample)
TW (1) TW200710161A (enExample)
WO (1) WO2007007843A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005085316A1 (ja) * 2004-03-03 2005-09-15 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
JP5177480B2 (ja) * 2007-06-14 2013-04-03 日本化薬株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP2010229368A (ja) * 2009-03-30 2010-10-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
US9048187B2 (en) * 2010-03-25 2015-06-02 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
CN102453914A (zh) * 2010-10-22 2012-05-16 中国核动力研究设计院 用微晶石腊包裹强酸溶解金属焊接件易腐蚀部位的方法
CN103517948A (zh) * 2011-05-13 2014-01-15 日立化成株式会社 密封用环氧树脂成形材料及电子部件装置
JP5573773B2 (ja) * 2011-05-23 2014-08-20 日立化成株式会社 電子部品封止用樹脂組成物およびそれを用いた電子部品装置
JP5944714B2 (ja) * 2012-03-27 2016-07-05 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物
JP6059577B2 (ja) * 2012-11-13 2017-01-11 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物
KR20200109090A (ko) 2019-03-12 2020-09-22 동우 화인켐 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
KR20210078940A (ko) 2019-12-19 2021-06-29 동우 화인켐 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
EP4159810A4 (en) * 2020-06-02 2024-09-04 Sumitomo Bakelite Co., Ltd. PHENOLIC RESIN COMPOSITION FOR FRICTION MATERIAL
JP2022142564A (ja) * 2021-03-16 2022-09-30 キオクシア株式会社 半導体パッケージ及び半導体装置
TW202436501A (zh) * 2022-11-22 2024-09-16 日商力森諾科股份有限公司 成形用樹脂組成物及電子零件裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006306658A (ja) * 2005-04-28 2006-11-09 Tateho Chem Ind Co Ltd 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
JP2006306659A (ja) * 2005-04-28 2006-11-09 Tateho Chem Ind Co Ltd 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物

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JPS56109820A (en) * 1980-02-06 1981-08-31 Shin Nippon Kagaku Kogyo Co Ltd Manufacture of magnesium hydroxide
JPH03170325A (ja) * 1989-11-27 1991-07-23 Mitsubishi Materials Corp 水酸化マグネシウムの製造方法
IL124061A (en) * 1997-04-15 2001-01-11 Taheto Chemical Ind Co Ltd Solid solutions of metal hydroxide and metal oxide and their preparation
ES2284278T3 (es) * 1998-12-14 2007-11-01 Kyowa Chemical Industry Co., Ltd. Particulas de hidroxido de magnesio, metodo de produccion de las mismas, composicion de resina que contiene las mismas.
JP2000233924A (ja) * 1998-12-14 2000-08-29 Kyowa Chem Ind Co Ltd 水酸化マグネシウム粒子およびその製造方法
JP3836649B2 (ja) * 1999-11-22 2006-10-25 協和化学工業株式会社 半導体封止用樹脂組成物およびその成型品
WO2002024808A1 (fr) * 2000-09-25 2002-03-28 Hitachi Chemical Co., Ltd. Materiau de moulage de resine epoxy utilise a des fins d'etancheite
JP2002212392A (ja) * 2000-11-20 2002-07-31 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
US20050222300A1 (en) * 2002-02-27 2005-10-06 Ryoichi Ikezawa Encapsulating epoxy resin composition, and electronic parts device using the same
CN101412838B (zh) * 2002-02-27 2011-02-09 日立化成工业株式会社 封装用环氧树脂组合物及使用该组合物的电子组件
JP2003327667A (ja) * 2002-03-07 2003-11-19 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
US7397139B2 (en) * 2003-04-07 2008-07-08 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing use and semiconductor device
JP2004307646A (ja) * 2003-04-07 2004-11-04 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
KR100840065B1 (ko) * 2004-07-13 2008-06-19 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치
US20080039556A1 (en) * 2004-07-13 2008-02-14 Hitachi Chemical Co., Ltd. Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device
JP5400267B2 (ja) * 2005-12-13 2014-01-29 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006306658A (ja) * 2005-04-28 2006-11-09 Tateho Chem Ind Co Ltd 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
JP2006306659A (ja) * 2005-04-28 2006-11-09 Tateho Chem Ind Co Ltd 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物

Also Published As

Publication number Publication date
KR20080035624A (ko) 2008-04-23
KR20130105767A (ko) 2013-09-25
TW200710161A (en) 2007-03-16
WO2007007843A1 (ja) 2007-01-18
US20090137717A1 (en) 2009-05-28
KR101413822B1 (ko) 2014-07-01
JPWO2007007843A1 (ja) 2009-01-29
CN101223235B (zh) 2011-07-27
CN101223235A (zh) 2008-07-16
KR101342206B1 (ko) 2013-12-16
TWI332023B (enExample) 2010-10-21

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