JP5139852B2 - スクライブ装置及びスクライブ方法 - Google Patents

スクライブ装置及びスクライブ方法 Download PDF

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Publication number
JP5139852B2
JP5139852B2 JP2008067420A JP2008067420A JP5139852B2 JP 5139852 B2 JP5139852 B2 JP 5139852B2 JP 2008067420 A JP2008067420 A JP 2008067420A JP 2008067420 A JP2008067420 A JP 2008067420A JP 5139852 B2 JP5139852 B2 JP 5139852B2
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Japan
Prior art keywords
scribing
brittle material
material substrate
substrate
scribe
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Expired - Fee Related
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JP2008067420A
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English (en)
Japanese (ja)
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JP2009220405A5 (enExample
JP2009220405A (ja
Inventor
正信 曽山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2008067420A priority Critical patent/JP5139852B2/ja
Priority to TW098104286A priority patent/TWI393618B/zh
Priority to KR1020090016845A priority patent/KR101123613B1/ko
Priority to CN200910119533.0A priority patent/CN101554755B/zh
Publication of JP2009220405A publication Critical patent/JP2009220405A/ja
Publication of JP2009220405A5 publication Critical patent/JP2009220405A5/ja
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
JP2008067420A 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法 Expired - Fee Related JP5139852B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008067420A JP5139852B2 (ja) 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法
TW098104286A TWI393618B (zh) 2008-03-17 2009-02-11 Scribing device and scribing method
KR1020090016845A KR101123613B1 (ko) 2008-03-17 2009-02-27 스크라이브 장치 및 스크라이브 방법
CN200910119533.0A CN101554755B (zh) 2008-03-17 2009-03-13 划线装置及划线方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008067420A JP5139852B2 (ja) 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法

Publications (3)

Publication Number Publication Date
JP2009220405A JP2009220405A (ja) 2009-10-01
JP2009220405A5 JP2009220405A5 (enExample) 2011-03-24
JP5139852B2 true JP5139852B2 (ja) 2013-02-06

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Family Applications (1)

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JP2008067420A Expired - Fee Related JP5139852B2 (ja) 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法

Country Status (4)

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JP (1) JP5139852B2 (enExample)
KR (1) KR101123613B1 (enExample)
CN (1) CN101554755B (enExample)
TW (1) TWI393618B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5327070B2 (ja) * 2010-01-19 2013-10-30 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101004854B1 (ko) 2010-09-14 2010-12-28 주식회사 루스텍 석판 이미지 가공장치
KR101215082B1 (ko) 2010-12-16 2012-12-24 안정근 Ｑｒ코드를 가공하는 장치
JP5554228B2 (ja) * 2010-12-28 2014-07-23 三星ダイヤモンド工業株式会社 基板加工方法
CN102653115B (zh) * 2011-03-04 2015-01-14 三星钻石工业股份有限公司 刻划装置及刻划方法
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置
CN102390057B (zh) * 2011-11-17 2016-04-13 贵州大自然科技股份有限公司 一种植物纤维床垫边角圆弧切割方法及装置
US9221226B2 (en) * 2012-04-09 2015-12-29 Xerox Corporation Personalized packaging production system
CN104552375B (zh) * 2013-10-12 2016-09-14 北新集团建材股份有限公司 一种封边带切断装置
CN103862180A (zh) * 2014-01-29 2014-06-18 苏州兰叶光电科技有限公司 玻璃盖片激光划片装置
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置
TWI527674B (zh) * 2014-06-19 2016-04-01 三星國際機械股份有限公司 脆性材料基板之刻劃方法及裝置
JP6212507B2 (ja) * 2015-02-05 2017-10-11 Ｔｏｗａ株式会社 切断装置及び切断方法
CN106891094A (zh) * 2015-12-14 2017-06-27 上海申和热磁电子有限公司 用于覆铜陶瓷基板的激光切割机工作台
CN105538518B (zh) * 2016-02-19 2017-05-03 李谋遵 一种应用智能石材切割机器人的切割方法
CN105710978B (zh) * 2016-03-21 2017-08-29 李谋遵 一种应用智能石材切割流水线的切割方法
JP6744626B2 (ja) * 2016-07-25 2020-08-19 三星ダイヤモンド工業株式会社 スクライブ方法並びにスクライブ装置
CN106426071B (zh) * 2016-12-02 2018-11-16 浦江和平真空镀膜有限公司 一种划线装置
CN106926310A (zh) * 2017-05-19 2017-07-07 安徽华诚海绵制品有限公司 一种海绵用切割机工作台
ES2913270T3 (es) * 2017-07-31 2022-06-01 Dow Global Technologies Llc Dispositivo de corte de película con actuador lineal
CN107777869A (zh) * 2017-11-20 2018-03-09 魏超军 一种能够对玻璃幕墙进行快速精准的切割设备
CN107889365B (zh) * 2017-11-29 2020-02-28 南京协辰电子科技有限公司 一种基板旋转装置以及基板对位方法
KR102286476B1 (ko) * 2019-05-23 2021-08-06 코닝 인코포레이티드 유리 기판 절단 방법 및 도광판 제조 방법
CN111070422A (zh) * 2019-12-31 2020-04-28 厦门庚华机械有限公司 一种自动仿型锯机
CN111152372B (zh) * 2020-01-14 2021-09-21 大同新成新材料股份有限公司 一种智能碳滑板挤压成型限位打标切割装置
CN114083700B (zh) * 2021-11-01 2024-08-06 深圳市高美福商显科技有限公司 一种液晶显示面板加工装置及方法
CN114893004B (zh) * 2022-06-20 2024-05-10 阿尔法测绘科技(广州)有限公司 一种测绘用的放线装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000072464A (ja) * 1998-08-20 2000-03-07 Sharp Corp ガラスのスクライブ方法
JP4402883B2 (ja) * 2001-01-17 2010-01-20 三星ダイヤモンド工業株式会社 分断装置および分断システム並びに分断方法
DE60238198D1 (de) * 2001-07-18 2010-12-16 Mitsuboshi Diamond Ind Co Ltd Ritzkopf
US7015118B2 (en) * 2001-10-31 2006-03-21 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
SG149824A1 (en) * 2004-02-02 2009-02-27 Mitsuboshi Diamond Ind Co Ltd Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel
KR100637590B1 (ko) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 평판표시장치 제조용 기판 스크라이빙장치
KR100756519B1 (ko) * 2005-10-06 2007-09-10 주식회사 탑 엔지니어링 글라스 절단 시스템 및 절단 위치 검사 방법
KR100777983B1 (ko) * 2005-12-29 2007-11-21 주식회사 탑 엔지니어링 기판 절단 장치
KR100972512B1 (ko) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
KR100745577B1 (ko) * 2005-12-29 2007-08-03 주식회사 탑 엔지니어링 자기식 압력 조절 스크라이버
KR100863439B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 기판 스크라이브 장치 및 그 방법

Also Published As

Publication number Publication date
CN101554755B (zh) 2014-02-12
KR20090099460A (ko) 2009-09-22
KR101123613B1 (ko) 2012-03-20
TWI393618B (zh) 2013-04-21
TW200940291A (en) 2009-10-01
CN101554755A (zh) 2009-10-14
JP2009220405A (ja) 2009-10-01

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