CN101554755B - 划线装置及划线方法 - Google Patents
划线装置及划线方法 Download PDFInfo
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- CN101554755B CN101554755B CN200910119533.0A CN200910119533A CN101554755B CN 101554755 B CN101554755 B CN 101554755B CN 200910119533 A CN200910119533 A CN 200910119533A CN 101554755 B CN101554755 B CN 101554755B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 110
- 239000003550 marker Substances 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 19
- 231100000647 material safety data sheet Toxicity 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 6
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 7
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Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-067420 | 2008-03-17 | ||
| JP2008067420A JP5139852B2 (ja) | 2008-03-17 | 2008-03-17 | スクライブ装置及びスクライブ方法 |
| JP2008067420 | 2008-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101554755A CN101554755A (zh) | 2009-10-14 |
| CN101554755B true CN101554755B (zh) | 2014-02-12 |
Family
ID=41173110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910119533.0A Expired - Fee Related CN101554755B (zh) | 2008-03-17 | 2009-03-13 | 划线装置及划线方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5139852B2 (enExample) |
| KR (1) | KR101123613B1 (enExample) |
| CN (1) | CN101554755B (enExample) |
| TW (1) | TWI393618B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107650277A (zh) * | 2016-07-25 | 2018-02-02 | 三星钻石工业股份有限公司 | 划线方法以及划线装置 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5327070B2 (ja) * | 2010-01-19 | 2013-10-30 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
| KR101004854B1 (ko) | 2010-09-14 | 2010-12-28 | 주식회사 루스텍 | 석판 이미지 가공장치 |
| KR101215082B1 (ko) | 2010-12-16 | 2012-12-24 | 안정근 | Qr코드를 가공하는 장치 |
| JP5554228B2 (ja) * | 2010-12-28 | 2014-07-23 | 三星ダイヤモンド工業株式会社 | 基板加工方法 |
| CN102653115B (zh) * | 2011-03-04 | 2015-01-14 | 三星钻石工业股份有限公司 | 刻划装置及刻划方法 |
| JP5912395B2 (ja) * | 2011-10-14 | 2016-04-27 | 三星ダイヤモンド工業株式会社 | 基板上面検出方法及びスクライブ装置 |
| CN102390057B (zh) * | 2011-11-17 | 2016-04-13 | 贵州大自然科技股份有限公司 | 一种植物纤维床垫边角圆弧切割方法及装置 |
| US9221226B2 (en) * | 2012-04-09 | 2015-12-29 | Xerox Corporation | Personalized packaging production system |
| CN104552375B (zh) * | 2013-10-12 | 2016-09-14 | 北新集团建材股份有限公司 | 一种封边带切断装置 |
| CN103862180A (zh) * | 2014-01-29 | 2014-06-18 | 苏州兰叶光电科技有限公司 | 玻璃盖片激光划片装置 |
| JP6282176B2 (ja) * | 2014-05-29 | 2018-02-21 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の端材分離装置 |
| TWI527674B (zh) * | 2014-06-19 | 2016-04-01 | 三星國際機械股份有限公司 | 脆性材料基板之刻劃方法及裝置 |
| JP6212507B2 (ja) * | 2015-02-05 | 2017-10-11 | Towa株式会社 | 切断装置及び切断方法 |
| CN106891094A (zh) * | 2015-12-14 | 2017-06-27 | 上海申和热磁电子有限公司 | 用于覆铜陶瓷基板的激光切割机工作台 |
| CN105538518B (zh) * | 2016-02-19 | 2017-05-03 | 李谋遵 | 一种应用智能石材切割机器人的切割方法 |
| CN105710978B (zh) * | 2016-03-21 | 2017-08-29 | 李谋遵 | 一种应用智能石材切割流水线的切割方法 |
| CN106426071B (zh) * | 2016-12-02 | 2018-11-16 | 浦江和平真空镀膜有限公司 | 一种划线装置 |
| CN106926310A (zh) * | 2017-05-19 | 2017-07-07 | 安徽华诚海绵制品有限公司 | 一种海绵用切割机工作台 |
| ES2913270T3 (es) * | 2017-07-31 | 2022-06-01 | Dow Global Technologies Llc | Dispositivo de corte de película con actuador lineal |
| CN107777869A (zh) * | 2017-11-20 | 2018-03-09 | 魏超军 | 一种能够对玻璃幕墙进行快速精准的切割设备 |
| CN107889365B (zh) * | 2017-11-29 | 2020-02-28 | 南京协辰电子科技有限公司 | 一种基板旋转装置以及基板对位方法 |
| KR102286476B1 (ko) * | 2019-05-23 | 2021-08-06 | 코닝 인코포레이티드 | 유리 기판 절단 방법 및 도광판 제조 방법 |
| CN111070422A (zh) * | 2019-12-31 | 2020-04-28 | 厦门庚华机械有限公司 | 一种自动仿型锯机 |
| CN111152372B (zh) * | 2020-01-14 | 2021-09-21 | 大同新成新材料股份有限公司 | 一种智能碳滑板挤压成型限位打标切割装置 |
| CN114083700B (zh) * | 2021-11-01 | 2024-08-06 | 深圳市高美福商显科技有限公司 | 一种液晶显示面板加工装置及方法 |
| CN114893004B (zh) * | 2022-06-20 | 2024-05-10 | 阿尔法测绘科技(广州)有限公司 | 一种测绘用的放线装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1863740A (zh) * | 2001-07-18 | 2006-11-15 | 三星钻石工业股份有限公司 | 划线头和使用该划线头的划线装置以及划线方法 |
| CN1891422A (zh) * | 2005-07-08 | 2007-01-10 | 塔工程有限公司 | 用来对用于平板显示器的基板划片的装置 |
| CN1914014A (zh) * | 2004-02-02 | 2007-02-14 | 三星钻石工业股份有限公司 | 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法 |
| CN1952751A (zh) * | 2005-12-29 | 2007-04-25 | 塔工程有限公司 | 用于切割基板的装置 |
| CN1958489A (zh) * | 2005-12-29 | 2007-05-09 | 塔工程有限公司 | 用于使用磁力来控制压力的划线器 |
| CN1991491A (zh) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | 液晶显示板切割方法和使用该方法制造液晶显示板的方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000072464A (ja) * | 1998-08-20 | 2000-03-07 | Sharp Corp | ガラスのスクライブ方法 |
| JP4402883B2 (ja) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | 分断装置および分断システム並びに分断方法 |
| US7015118B2 (en) * | 2001-10-31 | 2006-03-21 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line |
| TWI286232B (en) * | 2002-10-29 | 2007-09-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| KR100756519B1 (ko) * | 2005-10-06 | 2007-09-10 | 주식회사 탑 엔지니어링 | 글라스 절단 시스템 및 절단 위치 검사 방법 |
| KR100863439B1 (ko) * | 2006-05-08 | 2008-10-16 | 주식회사 탑 엔지니어링 | 기판 스크라이브 장치 및 그 방법 |
-
2008
- 2008-03-17 JP JP2008067420A patent/JP5139852B2/ja not_active Expired - Fee Related
-
2009
- 2009-02-11 TW TW098104286A patent/TWI393618B/zh not_active IP Right Cessation
- 2009-02-27 KR KR1020090016845A patent/KR101123613B1/ko not_active Expired - Fee Related
- 2009-03-13 CN CN200910119533.0A patent/CN101554755B/zh not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1863740A (zh) * | 2001-07-18 | 2006-11-15 | 三星钻石工业股份有限公司 | 划线头和使用该划线头的划线装置以及划线方法 |
| CN1914014A (zh) * | 2004-02-02 | 2007-02-14 | 三星钻石工业股份有限公司 | 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法 |
| CN1891422A (zh) * | 2005-07-08 | 2007-01-10 | 塔工程有限公司 | 用来对用于平板显示器的基板划片的装置 |
| CN1952751A (zh) * | 2005-12-29 | 2007-04-25 | 塔工程有限公司 | 用于切割基板的装置 |
| CN1958489A (zh) * | 2005-12-29 | 2007-05-09 | 塔工程有限公司 | 用于使用磁力来控制压力的划线器 |
| CN1991491A (zh) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | 液晶显示板切割方法和使用该方法制造液晶显示板的方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107650277A (zh) * | 2016-07-25 | 2018-02-02 | 三星钻石工业股份有限公司 | 划线方法以及划线装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5139852B2 (ja) | 2013-02-06 |
| KR20090099460A (ko) | 2009-09-22 |
| KR101123613B1 (ko) | 2012-03-20 |
| TWI393618B (zh) | 2013-04-21 |
| TW200940291A (en) | 2009-10-01 |
| CN101554755A (zh) | 2009-10-14 |
| JP2009220405A (ja) | 2009-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20210313 |
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| CF01 | Termination of patent right due to non-payment of annual fee |