KR101123613B1 - 스크라이브 장치 및 스크라이브 방법 - Google Patents

스크라이브 장치 및 스크라이브 방법 Download PDF

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KR101123613B1
KR101123613B1 KR1020090016845A KR20090016845A KR101123613B1 KR 101123613 B1 KR101123613 B1 KR 101123613B1 KR 1020090016845 A KR1020090016845 A KR 1020090016845A KR 20090016845 A KR20090016845 A KR 20090016845A KR 101123613 B1 KR101123613 B1 KR 101123613B1
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South Korea
Prior art keywords
brittle material
scribing
material substrate
substrate
scribe
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Korean (ko)
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KR20090099460A (ko
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마사노부 소야마
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미쓰보시 다이야몬도 고교 가부시키가이샤
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
KR1020090016845A 2008-03-17 2009-02-27 스크라이브 장치 및 스크라이브 방법 Expired - Fee Related KR101123613B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-067420 2008-03-17
JP2008067420A JP5139852B2 (ja) 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法

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Publication Number Publication Date
KR20090099460A KR20090099460A (ko) 2009-09-22
KR101123613B1 true KR101123613B1 (ko) 2012-03-20

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KR1020090016845A Expired - Fee Related KR101123613B1 (ko) 2008-03-17 2009-02-27 스크라이브 장치 및 스크라이브 방법

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JP (1) JP5139852B2 (enExample)
KR (1) KR101123613B1 (enExample)
CN (1) CN101554755B (enExample)
TW (1) TWI393618B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426071A (zh) * 2016-12-02 2017-02-22 东莞市天合机电开发有限公司 一种划线装置
KR20170110651A (ko) * 2015-02-05 2017-10-11 토와 가부시기가이샤 절단 장치 및 절단 방법

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* Cited by examiner, † Cited by third party
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JP5327070B2 (ja) * 2010-01-19 2013-10-30 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101004854B1 (ko) 2010-09-14 2010-12-28 주식회사 루스텍 석판 이미지 가공장치
KR101215082B1 (ko) 2010-12-16 2012-12-24 안정근 Ｑｒ코드를 가공하는 장치
JP5554228B2 (ja) * 2010-12-28 2014-07-23 三星ダイヤモンド工業株式会社 基板加工方法
CN102653115B (zh) * 2011-03-04 2015-01-14 三星钻石工业股份有限公司 刻划装置及刻划方法
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置
CN102390057B (zh) * 2011-11-17 2016-04-13 贵州大自然科技股份有限公司 一种植物纤维床垫边角圆弧切割方法及装置
US9221226B2 (en) * 2012-04-09 2015-12-29 Xerox Corporation Personalized packaging production system
CN104552375B (zh) * 2013-10-12 2016-09-14 北新集团建材股份有限公司 一种封边带切断装置
CN103862180A (zh) * 2014-01-29 2014-06-18 苏州兰叶光电科技有限公司 玻璃盖片激光划片装置
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置
TWI527674B (zh) * 2014-06-19 2016-04-01 三星國際機械股份有限公司 脆性材料基板之刻劃方法及裝置
CN106891094A (zh) * 2015-12-14 2017-06-27 上海申和热磁电子有限公司 用于覆铜陶瓷基板的激光切割机工作台
CN105538518B (zh) * 2016-02-19 2017-05-03 李谋遵 一种应用智能石材切割机器人的切割方法
CN105710978B (zh) * 2016-03-21 2017-08-29 李谋遵 一种应用智能石材切割流水线的切割方法
JP6744626B2 (ja) * 2016-07-25 2020-08-19 三星ダイヤモンド工業株式会社 スクライブ方法並びにスクライブ装置
CN106926310A (zh) * 2017-05-19 2017-07-07 安徽华诚海绵制品有限公司 一种海绵用切割机工作台
US20210078193A1 (en) * 2017-07-31 2021-03-18 Dow Global Technologies Llc Film cutting device having a linear actuator
CN107777869A (zh) * 2017-11-20 2018-03-09 魏超军 一种能够对玻璃幕墙进行快速精准的切割设备
CN107889365B (zh) * 2017-11-29 2020-02-28 南京协辰电子科技有限公司 一种基板旋转装置以及基板对位方法
KR102286476B1 (ko) * 2019-05-23 2021-08-06 코닝 인코포레이티드 유리 기판 절단 방법 및 도광판 제조 방법
CN111070422A (zh) * 2019-12-31 2020-04-28 厦门庚华机械有限公司 一种自动仿型锯机
CN111152372B (zh) * 2020-01-14 2021-09-21 大同新成新材料股份有限公司 一种智能碳滑板挤压成型限位打标切割装置
CN114083700B (zh) * 2021-11-01 2024-08-06 深圳市高美福商显科技有限公司 一种液晶显示面板加工装置及方法
CN114893004B (zh) * 2022-06-20 2024-05-10 阿尔法测绘科技(广州)有限公司 一种测绘用的放线装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000072464A (ja) * 1998-08-20 2000-03-07 Sharp Corp ガラスのスクライブ方法
KR100748159B1 (ko) * 2001-01-17 2007-08-09 미쓰보시 다이야몬도 고교 가부시키가이샤 절단장치, 절단시스템 및 절단방법
KR100756519B1 (ko) * 2005-10-06 2007-09-10 주식회사 탑 엔지니어링 글라스 절단 시스템 및 절단 위치 검사 방법
KR20070108597A (ko) * 2006-05-08 2007-11-13 주식회사 탑 엔지니어링 기판 스크라이브 장치 및 그 방법

Family Cites Families (8)

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JP4118804B2 (ja) * 2001-07-18 2008-07-16 三星ダイヤモンド工業株式会社 スクライブヘッド及びそのスクライブヘッドを用いたスクライブ装置ならびに脆性材料基板のスクライブ方法
EP1441385A4 (en) * 2001-10-31 2009-11-18 Mitsuboshi Diamond Ind Co Ltd METHOD FOR FORMING A CROP LINE ON A SEMICONDUCTOR WAFER AND A CROWDING DEVICE
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
JP5022602B2 (ja) * 2004-02-02 2012-09-12 三星ダイヤモンド工業株式会社 カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法
KR100637590B1 (ko) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 평판표시장치 제조용 기판 스크라이빙장치
KR100777983B1 (ko) * 2005-12-29 2007-11-21 주식회사 탑 엔지니어링 기판 절단 장치
KR100745577B1 (ko) * 2005-12-29 2007-08-03 주식회사 탑 엔지니어링 자기식 압력 조절 스크라이버
KR100972512B1 (ko) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000072464A (ja) * 1998-08-20 2000-03-07 Sharp Corp ガラスのスクライブ方法
KR100748159B1 (ko) * 2001-01-17 2007-08-09 미쓰보시 다이야몬도 고교 가부시키가이샤 절단장치, 절단시스템 및 절단방법
KR100756519B1 (ko) * 2005-10-06 2007-09-10 주식회사 탑 엔지니어링 글라스 절단 시스템 및 절단 위치 검사 방법
KR20070108597A (ko) * 2006-05-08 2007-11-13 주식회사 탑 엔지니어링 기판 스크라이브 장치 및 그 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170110651A (ko) * 2015-02-05 2017-10-11 토와 가부시기가이샤 절단 장치 및 절단 방법
KR102089098B1 (ko) 2015-02-05 2020-03-13 토와 가부시기가이샤 절단 장치 및 절단 방법
CN106426071A (zh) * 2016-12-02 2017-02-22 东莞市天合机电开发有限公司 一种划线装置
CN106426071B (zh) * 2016-12-02 2018-11-16 浦江和平真空镀膜有限公司 一种划线装置

Also Published As

Publication number Publication date
TW200940291A (en) 2009-10-01
TWI393618B (zh) 2013-04-21
CN101554755A (zh) 2009-10-14
JP5139852B2 (ja) 2013-02-06
CN101554755B (zh) 2014-02-12
KR20090099460A (ko) 2009-09-22
JP2009220405A (ja) 2009-10-01

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