TWI393618B - Scribing device and scribing method - Google Patents

Scribing device and scribing method Download PDF

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Publication number
TWI393618B
TWI393618B TW098104286A TW98104286A TWI393618B TW I393618 B TWI393618 B TW I393618B TW 098104286 A TW098104286 A TW 098104286A TW 98104286 A TW98104286 A TW 98104286A TW I393618 B TWI393618 B TW I393618B
Authority
TW
Taiwan
Prior art keywords
scribing
low
substrate
ceramic substrate
line
Prior art date
Application number
TW098104286A
Other languages
English (en)
Chinese (zh)
Other versions
TW200940291A (en
Inventor
Masanobu Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200940291A publication Critical patent/TW200940291A/zh
Application granted granted Critical
Publication of TWI393618B publication Critical patent/TWI393618B/zh

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
TW098104286A 2008-03-17 2009-02-11 Scribing device and scribing method TWI393618B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008067420A JP5139852B2 (ja) 2008-03-17 2008-03-17 スクライブ装置及びスクライブ方法

Publications (2)

Publication Number Publication Date
TW200940291A TW200940291A (en) 2009-10-01
TWI393618B true TWI393618B (zh) 2013-04-21

Family

ID=41173110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104286A TWI393618B (zh) 2008-03-17 2009-02-11 Scribing device and scribing method

Country Status (4)

Country Link
JP (1) JP5139852B2 (enExample)
KR (1) KR101123613B1 (enExample)
CN (1) CN101554755B (enExample)
TW (1) TWI393618B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5327070B2 (ja) * 2010-01-19 2013-10-30 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101004854B1 (ko) 2010-09-14 2010-12-28 주식회사 루스텍 석판 이미지 가공장치
KR101215082B1 (ko) 2010-12-16 2012-12-24 안정근 Ｑｒ코드를 가공하는 장치
JP5554228B2 (ja) * 2010-12-28 2014-07-23 三星ダイヤモンド工業株式会社 基板加工方法
CN102653115B (zh) * 2011-03-04 2015-01-14 三星钻石工业股份有限公司 刻划装置及刻划方法
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置
CN102390057B (zh) * 2011-11-17 2016-04-13 贵州大自然科技股份有限公司 一种植物纤维床垫边角圆弧切割方法及装置
US9221226B2 (en) * 2012-04-09 2015-12-29 Xerox Corporation Personalized packaging production system
CN104552375B (zh) * 2013-10-12 2016-09-14 北新集团建材股份有限公司 一种封边带切断装置
CN103862180A (zh) * 2014-01-29 2014-06-18 苏州兰叶光电科技有限公司 玻璃盖片激光划片装置
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置
TWI527674B (zh) * 2014-06-19 2016-04-01 三星國際機械股份有限公司 脆性材料基板之刻劃方法及裝置
JP6212507B2 (ja) * 2015-02-05 2017-10-11 Ｔｏｗａ株式会社 切断装置及び切断方法
CN106891094A (zh) * 2015-12-14 2017-06-27 上海申和热磁电子有限公司 用于覆铜陶瓷基板的激光切割机工作台
CN105538518B (zh) * 2016-02-19 2017-05-03 李谋遵 一种应用智能石材切割机器人的切割方法
CN105710978B (zh) * 2016-03-21 2017-08-29 李谋遵 一种应用智能石材切割流水线的切割方法
JP6744626B2 (ja) * 2016-07-25 2020-08-19 三星ダイヤモンド工業株式会社 スクライブ方法並びにスクライブ装置
CN106426071B (zh) * 2016-12-02 2018-11-16 浦江和平真空镀膜有限公司 一种划线装置
CN106926310A (zh) * 2017-05-19 2017-07-07 安徽华诚海绵制品有限公司 一种海绵用切割机工作台
ES2913270T3 (es) * 2017-07-31 2022-06-01 Dow Global Technologies Llc Dispositivo de corte de película con actuador lineal
CN107777869A (zh) * 2017-11-20 2018-03-09 魏超军 一种能够对玻璃幕墙进行快速精准的切割设备
CN107889365B (zh) * 2017-11-29 2020-02-28 南京协辰电子科技有限公司 一种基板旋转装置以及基板对位方法
KR102286476B1 (ko) * 2019-05-23 2021-08-06 코닝 인코포레이티드 유리 기판 절단 방법 및 도광판 제조 방법
CN111070422A (zh) * 2019-12-31 2020-04-28 厦门庚华机械有限公司 一种自动仿型锯机
CN111152372B (zh) * 2020-01-14 2021-09-21 大同新成新材料股份有限公司 一种智能碳滑板挤压成型限位打标切割装置
CN114083700B (zh) * 2021-11-01 2024-08-06 深圳市高美福商显科技有限公司 一种液晶显示面板加工装置及方法
CN114893004B (zh) * 2022-06-20 2024-05-10 阿尔法测绘科技(广州)有限公司 一种测绘用的放线装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254984B (en) * 2001-10-31 2006-05-11 Mitsuboshi Diamond Ind Co Ltd Forming method of scribing for semiconductor wafer and forming apparatus of scribing
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
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JP2000072464A (ja) * 1998-08-20 2000-03-07 Sharp Corp ガラスのスクライブ方法
JP4402883B2 (ja) * 2001-01-17 2010-01-20 三星ダイヤモンド工業株式会社 分断装置および分断システム並びに分断方法
DE60238198D1 (de) * 2001-07-18 2010-12-16 Mitsuboshi Diamond Ind Co Ltd Ritzkopf
SG149824A1 (en) * 2004-02-02 2009-02-27 Mitsuboshi Diamond Ind Co Ltd Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel
KR100637590B1 (ko) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 평판표시장치 제조용 기판 스크라이빙장치
KR100756519B1 (ko) * 2005-10-06 2007-09-10 주식회사 탑 엔지니어링 글라스 절단 시스템 및 절단 위치 검사 방법
KR100777983B1 (ko) * 2005-12-29 2007-11-21 주식회사 탑 엔지니어링 기판 절단 장치
KR100972512B1 (ko) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
KR100745577B1 (ko) * 2005-12-29 2007-08-03 주식회사 탑 엔지니어링 자기식 압력 조절 스크라이버
KR100863439B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 기판 스크라이브 장치 및 그 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254984B (en) * 2001-10-31 2006-05-11 Mitsuboshi Diamond Ind Co Ltd Forming method of scribing for semiconductor wafer and forming apparatus of scribing
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate

Also Published As

Publication number Publication date
CN101554755B (zh) 2014-02-12
JP5139852B2 (ja) 2013-02-06
KR20090099460A (ko) 2009-09-22
KR101123613B1 (ko) 2012-03-20
TW200940291A (en) 2009-10-01
CN101554755A (zh) 2009-10-14
JP2009220405A (ja) 2009-10-01

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