201233513 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種尤其用於低溫烺燒陶瓷基板等脆性材 料基板之切斷之刻劃裝置及刻劃方法。 【先前技術】 低溫煅燒陶瓷（以下，稱為LTCC(Low Temperature Cofired Ceramic))係將導體佈線於混合有氧化鋁之骨材與玻璃材料 q 之片材上而形成多層膜，並以800°C左右之低溫對該多層膜 進行煅燒而成之基板。LTCC基板係於丨塊母基板上成格子 狀地同時形成多個功能區域，並依各功能區域分割該等功 能區域來使用。先前，如專利文獻丨所示般，使用陶瓷用之 刻劃器進行刻劃來分割LTCC基板。又，利用切割工具機械 式地切割LTCC基板，藉此分割該1；1(：(：：基板。 又，於專利文獻2中提出有如下方法：當分割LTCC基板 時先對每條刻劃線形成對準標記，針對產生煅燒後之歪曲 Ο 之基板m視器確崎準標記，並以連結料標記之 方式形成刻劃線。 [先前技術文獻] [專利文獻] [專利文獻1 ]日本專利第3丨丨6743號公報 [專利文獻2]日本專利特时2_·22_5號公報 【發明内容】 [發明所欲解決之問題] 於先前之利用機械式 153908.doc 之切割之分割方法中 不僅切割花 201233513 費時間，而且_ LV、，隹r 士，， 切斷時會產生t、靡卞騎切#j。又’存在如τ之缺點： 置用㈣斷 母基板上必須於各小基板間設 置用於切斷之-定之空間。 子L也：Γ，於平面顯示器用途等中’當將玻璃製且成格 ^有功能區域之母基板等分割成多個小基板時， 一 刻劃裝置成格子狀地進行刻劃。因此，如圖1所 列到=於母基板之周圍之對準標記中選擇—對標記並 二3’…亥標記之線。其次’自該線起設定考慮了功能區 或之大小之料之間距，而形成其他平行之刻劃線。圖中 由虛線所不之線表示應進行刻劃之線。於玻璃基板上，當 形成對：標記後，不會發生不可逆之大變形，且對準標記 之精度高’因此即便自周圍之對準標記起使母基板以特定 之間距平行料來進行_，亦可準確地對母基板進行刻 劃，並進行分割。 而LTCC基板係於锻燒前形成功能區域及對準標記， 但於锻燒時有時會如圖2所示般彎曲並收縮。因此，即便預 先於LTCC基板之周圍附加對準標記，並將該對準標記作為 基準使母基板以所㈣之間距平行移動，亦難以以準確地 等分功能區域之方式進行刻畫卜因此，存在依各功能區域 準確地分割母基板來製造產品基板較困難之問題。尤其， 於基板與產品基板較小之情形（例如分割長寬為2〇〇 mm以 下，尤其1 00 mm以下之基板之情形，藉由分割而獲得長寬 為10 mm以下（尤其5 mm以下）之產品之情形）下，依各功能 區域準確地進行分割來製造產品基板變得困難。 153908.doc 201233513 又，於專利文獻2中，於基板之周圍設置多個對準標記， 並以連結對準標記之方式形成刻劃線，但此時所形成之刻 劃線係直線狀之線，當LTCC基板彎曲成曲線狀時，存在無 法以穿過各功能區域之中間之方式形成曲線狀之刻劃線之 問題。 〇201233513 VI. Description of the Invention: [Technical Field] The present invention relates to a scribing apparatus and a scribing method which are particularly used for cutting a brittle material substrate such as a low-temperature calcined ceramic substrate. [Prior Art] Low-temperature calcined ceramics (hereinafter referred to as LTCC (Low Temperature Cofired Ceramic)) are formed by wiring a conductor on a sheet in which an alumina-containing aggregate and a glass material q are mixed to form a multilayer film at 800 ° C. A substrate obtained by calcining the multilayer film at a low temperature on the left and right sides. The LTCC substrate is formed by forming a plurality of functional regions in a lattice on the mother substrate, and dividing the functional regions according to the respective functional regions for use. Previously, as shown in the patent document, a scriber for ceramics was used for scribing to divide the LTCC substrate. Further, the LTCC substrate is mechanically cut by a dicing tool, thereby dividing the 1; 1 (: (:: substrate). Further, Patent Document 2 proposes a method of scribing each scriber when dividing the LTCC substrate. An alignment mark is formed, and a scribe line is formed for the substrate m-mirror which produces the calcined koji, and the scribe line is formed by the binder mark. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. 2_22_5 [Invention] [Problems to be Solved by the Invention] In the prior division method using the cutting of the mechanical type 153908.doc, not only the cutting method Flower 201233513 Time-consuming, and _ LV,, 隹r 士,, will produce t, 靡卞骑切#j when cut off. Also, there are shortcomings such as τ: Use (4) The mother substrate must be between the small substrates Set the space for the cut-off. Sub-L also: Γ, in flat-panel display applications, etc. 'When a glass substrate is formed into a plurality of small substrates with functional areas, a scribing device Scratch in a grid pattern. Therefore, As shown in Figure 1, the selection is made in the alignment mark around the mother substrate - the line marking the mark and the 3'...hai mark. Secondly, the distance between the materials of the functional area or the size is considered from the line. And other parallel scribe lines are formed. The lines indicated by the broken lines indicate the lines to be scribed. On the glass substrate, when the pair is formed, no irreversible deformation occurs, and the alignment marks are The precision is high. Therefore, even if the mother substrate is made to be parallel with a specific distance from the surrounding alignment mark, the mother substrate can be accurately scored and divided. The LTCC substrate is formed before calcination. The area and the alignment mark are sometimes bent and contracted as shown in Fig. 2. Therefore, even if an alignment mark is added in advance around the LTCC substrate, the mother mark is made by using the alignment mark as a reference. Parallel movement between (4) is difficult to accurately divide the functional area. Therefore, it is difficult to accurately divide the mother substrate according to each functional area to manufacture the product substrate. In particular, the substrate and When the product substrate is small (for example, when the length and width are divided into 2 mm or less, especially in the case of a substrate of 100 mm or less, the product having a length and width of 10 mm or less (especially 5 mm or less) is obtained by division) Further, it is difficult to accurately divide the functional regions to manufacture the product substrate. 153908.doc 201233513 Further, in Patent Document 2, a plurality of alignment marks are provided around the substrate, and the alignment marks are formed by connecting the alignment marks. The scribe line is scribed, but the scribe line formed at this time is a straight line. When the LTCC substrate is curved into a curved shape, there is a problem that a curved scribe line cannot be formed so as to pass through the middle of each functional region. 〇
本發明係解決上述先前技術之問題之發明，其目的在 於：使用用於玻璃基板等脆性材料基板之刻劃之刻劃裝 置，即便係假定如低溫煅燒陶瓷等般彎曲並變形之脆性材 料基板，亦可於功能區域間準確地進行刻劃並分割。 [解決問題之技術手段] 為解決該課題，本發明之刻劃裝置係為了將成格子狀地 形成有多個功能區域之脆性材料基板依各功能區域加以分 割來製成產品基板而進行刻劃之刻劃裝置，其包括：平台， 設置上述脆性材料基板；刻劃頭，以與上述平台上之脆性 材料基板對向之方式設置成升降自如，且其前端保持刻劃 輪；移動機構’於將上述刻劃輪㈣於上述脆性材料基板 之表面之狀態下使上述刻劃頭及脆性材料基板相對移動. 相機’拍攝上述脆性材料基板之功能零件之中間點；控制 ^根據上述相機之圖像檢測上述功能零件之中間點之位 置’並檢測上述脆性材料基板之上述功能零件之中間點之 中，應進行刻劃之線上之至少3個測定點的位置，對連結上 逑測定點之刻劃線進行運算’使上述刻劃頭及脆性材料基 板沿著經運算之刻劃線相對移動，並且使上述刻劃頭升降 153908.doc 201233513 此處’亦可進-步具有使拍攝上述平台上之功能零件之 中間點之上述相機移動的相機移動機構。 為解決該課題’本發明之刻财法係為了將成袼子狀地 形成有多個功能區域之脆性材料基板依各功能區域加以分 割來製成產品基板而形成刻劃線之刻劃方法，其包括如下 步驟.檢測上述脆性材料基板之功能零件之令間點之位 置；檢測上述脆十生材料基板之上述功能零件之巾間點之 中’應進行刻劃之線上之至少3個測定點的位置，·以連結被 測定之刻劃線之上述測定點之方式進行運算；以及使上述 U頭及脆性材料基板沿著經運算之刻劃線相對移動，並 且使上述刻劃頭升降而對上述脆性材料基板進行刻劃。 再者纟說明書中之刻劃係指使刻劃輪於壓接在脆性材 料基板上之狀態下滾動而刻出刻劃線。於分割時形成刻劃 線’並沿著該線產生於板厚方向上伸展之垂直之裂縫，藉 此可分割脆性材料基板。 [發明之效果] 〈據有此種特徵之本發明，以穿過功能區域間之測; 方式對刻劃線進行運算，並沿著該線進行刻劃。因此 叫時谷易變形之LTCC基板等之脆性材料基板，1 4 M ^準確地穿過功能區域之中間之方式進行刻劃，並1 根據該刻劃繞；隹人+丨 較小之主一、進仃刀割。本發明尤其對於基板與產品基;i __ /(例如分割長寬為200 mm以下（尤其1 〇〇 mm j 下）之基板之情形 — /、精由分割而獲得長寬為10mm以下（尤. 5 mm以下彳> $ )之產。0之情形）有效。 153908.doc 201233513 【實施方式】 圖3係表示本發明之實施形態之刻劃裝置之一例之概略 立體圖。於該刻㈣41⑽中，移動台⑻係沿著—對導軌 • 102a、102b而移動自如地保持於y軸方向上。滾珠螺桿⑻ 4 與移動台101旋接。滾珠螺桿1G3藉由馬達1()4之驅動而旋 - 轉’並使移動台101沿著導轨102a、102b而於y轴方向上移 動。於移動台101之上表面設置有馬達105。馬達1〇5使平台 〇 106於xy平面上旋轉並^位於特㈣度。此處，將脆性㈣ 基板107没定為低溫煅燒陶瓷基板。將該基板1〇7載置於平 台106上，並藉由未圖示之真空吸引機構等來保持。 於刻劃裝置1〇〇中，藉由支柱1Ua、lllb以橫跨移動台ι〇ι 與其上部之平台106之方式，沿著X轴方向架設支架110。支 架110係藉由線性馬達113而將刻劃頭112保持為移動自 如。線性馬達113係沿著乂轴方向直線驅動刻劃頭112者。於 刻劃頭112之前端部，藉由固持器114而安裝有刻劃輪115。 Ο 刻劃頭U2係使刻劃輪115於脆性材料基板之表面上一面以 適當之負荷壓接一面滾動，從而形成刻劃線者。 作為刻劃輪115 ’較佳為使用曰本專利第3〇74153號中所 示之高滲透型之刻劃輪，於實施形態中亦設定為使用該刻 劃輪。作為刻劃輪之材質，可使用燒結金剛石 (PCD(Polycrystalline Diamond ’ 多晶金剛石））、超硬合金 等’但就刻劃輪之壽命之觀點而言，較佳為燒結金剛石 (PCD)。 於線性馬達Π 3上並列地設置有線性馬達116，於線性馬 153908.doc 201233513 達116上安裝有CCD (Charged Coupled Device，電荷輕合元 件）相機117。線性馬達116係於χ軸方向上驅動CCD相機 117 ’而使其拍攝後述之脆性材料基板上所設置之功能區域 之中間點之相機移動機構。 此處，移動台101 ’導軌102a、102b或平台106及驅動該 等之馬達104、105，以及使刻劃頭112移動之線性馬達113 構成使刻劃頭與脆性材料基板於平行於該基板之受到刻劃 之面之方向上相對移動的移動機構。 其次，使用方塊圖對本實施形態之刻劃裝置1〇〇之控制器 之構成進行說明。圖4係刻劃裝置1〇〇之控制器12〇之方塊 圖。於本圖中，來自CCD相機117之輸出經由控制器12〇之 圖像處理部12i而被提供給控制部122。輸入部123係如後述 般輸入脆性材料基板之基準間距者。控制部122上連接有X 馬達驅動部124a、124b，進而連接有γ馬達驅動部125、旋 轉用馬達驅動部126及刻劃頭驅動部⑵。χ馬達驅動部 i24a、124b分別為驅動線性馬達U3、u6者。γ馬達驅動部 125係驅動馬達104者。旋轉用馬達驅動部U6係驅動馬達 ⑽者》_部122根據刻劃線之資料，控制平台轴 方向之位置’並旋轉控制平a 寻？市』十σ 106。又，控制部122係經由 刻劃頭驅動部127而於χ軸方向卜艇紅μ知 ±人 神万句上驅動刻劃頭，並且當刻割The present invention is an invention for solving the problems of the prior art described above, and an object thereof is to use a scribing device for scribing a substrate of a brittle material such as a glass substrate, even if it is a brittle material substrate which is bent and deformed like a low-temperature calcined ceramic. It can also be accurately scored and divided between functional areas. [Means for Solving the Problems] In order to solve the problem, the scribing device of the present invention performs the scribing by dividing a brittle material substrate in which a plurality of functional regions are formed in a lattice shape into respective product regions, thereby forming a product substrate. The scoring device comprises: a platform, the above-mentioned brittle material substrate is disposed; the scribing head is arranged to be lifted and lowered in a manner opposite to the brittle material substrate on the platform, and the front end of the scribing wheel is maintained; the moving mechanism is The scoring wheel (4) is relatively moved on the surface of the brittle material substrate to move the scribing head and the brittle material substrate relative to each other. The camera 'photographs the intermediate point of the functional component of the brittle material substrate; and controls the image according to the camera Detecting the position of the intermediate point of the functional component and detecting the position of at least three measurement points on the line on the scribe line among the intermediate points of the functional component of the brittle material substrate, and marking the connection point of the connection point The line performs the operation 'to make the above-mentioned scribing head and the brittle material substrate move relative to each other along the operation line, and to make the above-mentioned scribing Here lifting 153908.doc 201233513 'into the can - above further has a camera imaging a moving mechanism moving the midpoint of the camera function part of the said platform. In order to solve the problem, the method of engraving according to the present invention is to form a product substrate by dividing a brittle material substrate in which a plurality of functional regions are formed in a braid shape into a product substrate, thereby forming a scribing method. The method includes the steps of: detecting a position of a command point of the functional component of the brittle material substrate; detecting at least three measurement points on a line to be scribed in the inter-spot point of the functional component of the crumb-like material substrate The position is calculated by connecting the measurement points of the scribe line to be measured; and the U-head and the brittle material substrate are relatively moved along the calculated scribe line, and the scribe head is lifted and lowered. The above-mentioned brittle material substrate is scribed. Further, the scribe in the specification means that the scoring wheel is rolled while being crimped onto the brittle material substrate to engrave the score line. A scribe line ' is formed at the time of division and a vertical crack extending in the thickness direction is generated along the line, whereby the brittle material substrate can be divided. [Effects of the Invention] According to the present invention having such a feature, the score line is calculated by passing through the measurement between the functional areas, and the line is scored along the line. Therefore, the brittle material substrate such as the LTCC substrate which is deformed by the valley is scribed, and the 1 4 M ^ is accurately scribed through the middle of the functional region, and 1 is wound according to the scribe; the 丨人+丨小小主一Into the knife cut. In particular, the present invention relates to a substrate and a product base; i __ / (for example, a case where a substrate having a length and width of 200 mm or less (especially 1 〇〇 mm j ) is divided - /, and a length and a width of 10 mm or less are obtained by division. The production of 5 mm or less 彳 > $ ). The case of 0) is valid. [Embodiment] Fig. 3 is a schematic perspective view showing an example of a scribing device according to an embodiment of the present invention. At the moment (4) 41 (10), the moving table (8) is movably held in the y-axis direction along the pair of guide rails 102a, 102b. The ball screw (8) 4 is screwed to the moving table 101. The ball screw 1G3 is rotated and rotated by the driving of the motor 1 () 4, and the moving table 101 is moved in the y-axis direction along the guide rails 102a, 102b. A motor 105 is provided on the upper surface of the mobile station 101. Motor 1〇5 causes platform 〇106 to rotate on the xy plane and to be at (four) degrees. Here, the brittle (four) substrate 107 is not designated as a low-temperature calcined ceramic substrate. The substrate 1〇7 is placed on the stage 106 and held by a vacuum suction mechanism or the like (not shown). In the scoring apparatus 1A, the bracket 110 is erected in the X-axis direction by the struts 1Ua, 11b1 so as to straddle the movable platform ι〇 and the upper platform 106 thereof. The bracket 110 holds the scribing head 112 freely by the linear motor 113. The linear motor 113 linearly drives the scribing head 112 along the z-axis direction. At the end of the scribe head 112, a scoring wheel 115 is mounted by the holder 114.刻 The scribing head U2 is such that the scoring wheel 115 is rolled on the surface of the brittle material substrate while being pressed by an appropriate load to form a score line. The scribing wheel 115' is preferably a high-permeability scribing wheel as shown in Japanese Patent No. 3,741,533, and is also set to use the scribing wheel in the embodiment. As the material of the scoring wheel, sintered diamond (PCD (Polycrystalline Diamond)), super hard alloy or the like can be used. However, from the viewpoint of the life of the scoring wheel, sintered diamond (PCD) is preferable. A linear motor 116 is disposed side by side on the linear motor Π 3, and a CCD (Charged Coupled Device) camera 117 is mounted on the linear horse 153908.doc 201233513 up to 116. The linear motor 116 is a camera moving mechanism that drives the CCD camera 117' in the x-axis direction to take an intermediate point of a functional area provided on a brittle material substrate to be described later. Here, the mobile station 101' rails 102a, 102b or platform 106 and the motors 104, 105 that drive the same, and the linear motor 113 that moves the scribing head 112 are configured such that the scribing head and the brittle material substrate are parallel to the substrate. A moving mechanism that moves relatively in the direction of the face being scored. Next, the configuration of the controller of the scribing apparatus 1 of the present embodiment will be described using a block diagram. Figure 4 is a block diagram of the controller 12 of the scoring device 1〇〇. In the figure, the output from the CCD camera 117 is supplied to the control unit 122 via the image processing unit 12i of the controller 12. The input unit 123 is a reference pitch for inputting a brittle material substrate as will be described later. The X motor drive units 124a and 124b are connected to the control unit 122, and the γ motor drive unit 125, the rotation motor drive unit 126, and the scribing head drive unit (2) are further connected. The motor drive units i24a and 124b are driven by the linear motors U3 and u6, respectively. The γ motor drive unit 125 drives the motor 104. The rotation motor drive unit U6 drives the motor (10). The portion _ portion 122 controls the position of the platform axis direction based on the scribe line data and rotates the control level a. City 』 ten σ 106. Further, the control unit 122 drives the scribe head on the yaw axis via the scribe head driving unit 127, and when the scribe head is driven,
輪115滚動時，以使刻劃輪丨B A 適®之負荷壓接於脆性材 枓基板之表面上之方式進行 拉女於、 仃驅動者。於控制部122上進而連 接有皿視态128及資料保持部12 立 述之攝像點之位置資料用# 』保持部129係保持後 之位置貝枓或用於刻劃之刻劃資料者。 153908.doc 201233513 其次，使用流程圖及脆性材料基板對本實施形態之刻劃 裝置之刻劃方法進行說明。圖5係表示配置於刻劃裝置之平 台106上之正方形之脆性材料基板107的圖，此處，將脆性 • 材料基板1G7設定為成格子狀地形成有llXll之功能區域之 LTCC基板。此處，如點鏈線所示般於該脆性材料基板⑺7 ' 上形成刻劃線。脆性材料基板1〇7於煅燒前為正方形，且成 格子狀地規則地形成有正方形之功能區域，但於煅燒後略 〇 微產生歪曲。圖6係將煅燒後產生歪曲之基板之一部分誇張 表7ft之圖。 於圖7所示之流程圖中，若開始動作，則首先於步驟S11 中，由輸入部123輸入基準間距。所謂基準間距，係指"固 功能區域間之間距，例如當成格子狀地形成有2 5χ2.5随 之功能區域時，將基準間距設定為2 5 mm。其次，進入至 步驟S12，《馬達驅動部12朴、γ馬達驅動部125動作，而 使CCD相機llmx軸方向々軸方向上移動。然後，進入至 ❹㈣S13’檢測配置於平台1G6上之脆性材料基㈣7之攝像 點，並對攝像點進行拍攝。此處，攝像點可為功能區域之 所有㈣點’亦可自幾個中間點中·丨個來作為攝像點。 於本實施形態中’每隔3個點選擇！個中間點並設定為攝像 點P1〜P16。然後，於步驟S14中保持攝像點之位置資料後， 檢查拍攝是否已結束（步驟S15)，若並未結束，則回到步驟 S12,重複上述動作直至所有攝像點之拍攝結束為止。 -旦將圖5所示之各測^點之位置f料保持於資料保持 部129之記憶體中’則進入至步驟Sl6，算出χ轴歪曲修正之 153908.doc 201233513 刻劃線(步驟S16)。所謂雄歪曲修正之㈣線，係指例如 圖5所不之Lxl、Lx4、Lx7等連結複數個攝像點之幾乎平行 於X轴之線。由於脆性材料基板⑽準確而言並非正方形， 且燒結時產生歪曲，因此連結各攝像點之線亦成為曲線而 非直線。因此’③定如連結該線之函數，藉此作為連結各 線之X軸歪曲修正刻劃線。I軸歪曲修正刻劃線可近似於 直線地連結各攝像點之摺線，但較佳為平滑地連結複數個 攝像點之曲線。為算出修正刻劃線，g刻劃線上需要至少 3個攝像點。 —旦算出連結攝像點之所有X軸歪曲修正刻劃線L X1、 Lx4、Lx7、Lxl〇，則繼而算出χ轴内插刻劃線。所謂X轴内 插刻劃線，係指歪曲修正刻劃線以外之幾乎平行於χ轴之刻 劃線，即圖 5所示之 Lx0、Lx2、LX3、LX5、LX6、LX8、、 Lxll之線。該等刻劃線係將對相鄰之2個測定點，例如pi、 P2進行3等分之點作為虛擬之測定點，並連結該等虛擬之測 定點之線。由此依次對沿著乂軸之線進行運算，而完成乂軸 内插刻劃線之所有運算。再者，將χ軸内插刻劃線Lx〇設定 為以Lx 1為基準，朝Lx2之相反方向彎曲而形成之線。經運 鼻之刻劃線之資料係保持於資料保持部〗29中。 繼而，算出y軸歪曲修正刻劃線（步驟S18)。丫轴歪曲修正 刻劃線亦如圖5所示般，係連結沿著y轴之測定點之刻劃線 即L>1、Ly4、Ly7、LylO。於此情形時，將該y軸歪曲修正 刻劃線設定為平滑地連結各測定點之曲線亦較佳。然後， 於步驟S 19中以與χ軸内插刻劃線之運算相同之方式，算出 I53908.doc 201233513 幾乎平行於7軸之内插刻劃線LyO、Ly2、Ly3、Ly5、Ly6、 、Ly9、LyU。經運算之刻劃線之資料係保持於資料保 持部129中。 、若如上述般對所有刻劃線進行運算，則進入至步驟S20， 首先依-人對幾乎平行於x軸之刻劃線LxO〜Lxl 1進行刻劃（步 驟S2〇)。虽進行刻劃時，首先驅動馬達104 ,使平台1 〇6於y 轴方向上移動，當存在角度偏差時，以消除該角度偏差之 0 方式驅動馬達1G5而使平台1G6旋轉，並進行定位。若完成 °亥疋位，則藉由線性馬達113使刻劃頭112於X軸方向上移 動亚使刻劃頭112下降。然後，根據^軸内插刻劃線之資 料驅動馬達104 ’使平台於丫軸方向上移動，並沿著刻劃線 LX〇進行刻劃。然後，若該刻劃結束，則使刻劃頭112上升。 繼而，根據所保持之内插刻劃線之資料驅動馬達1 ，使平 〇 ; y軸方向上移動，進行自刻劃線向刻劃線[X 1之間距 進、。然後，以與刻劃線Lxl一致之方式進行y軸位置之微 〇 調整H使刻劃頭112下降並沿著歪曲修正刻劃線Lxi 進订刻劃。進而，沿著内插刻劃線Lx2、Lx3，$曲修正刻 劃線Lx4·. ·依次進行刻劃。 . 如此，若於步驟S20中完成幾乎平行於X軸之所有刻劃線When the wheel 115 is rolled, the driver of the rim rim B A is pressed against the surface of the brittle material 枓 substrate. Further, the control unit 122 is connected to the position information of the imaging point 128 and the data holding unit 12, and the holding unit 129 holds the position after the holding unit 129 or the scribe data for characterization. 153908.doc 201233513 Next, a scribing method of the scoring apparatus of the present embodiment will be described using a flowchart and a brittle material substrate. Fig. 5 is a view showing a square brittle material substrate 107 disposed on the stage 106 of the scribing apparatus. Here, the brittle material substrate 1G7 is formed as an LTCC substrate in which a functional region of ll 111 is formed in a lattice shape. Here, a scribe line is formed on the brittle material substrate (7) 7' as indicated by a dotted line. The brittle material substrate 1〇7 is square before calcination, and a square functional region is regularly formed in a lattice shape, but is slightly distorted after calcination. Figure 6 is a diagram exaggerating a portion of the substrate which is tortuous after calcination, and is shown in Figure 7ft. In the flowchart shown in FIG. 7, when the operation is started, first, in step S11, the reference pitch is input from the input unit 123. The reference pitch refers to the distance between the solid-function regions. For example, when a functional area of 25 χ 2.5 is formed in a lattice shape, the reference pitch is set to 25 mm. Then, the process proceeds to step S12, and the motor drive unit 12 and the γ motor drive unit 125 operate to move the CCD camera in the x-axis direction in the x-axis direction. Then, it proceeds to ❹(4)S13' to detect the imaging point of the brittle material base (4) 7 disposed on the platform 1G6, and photographs the imaging point. Here, the camera point may be all (four) points of the function area, or may be used as a camera point from among several intermediate points. In this embodiment, 'every three points are selected! The intermediate points are set to the imaging points P1 to P16. Then, after the position data of the imaging point is held in step S14, it is checked whether or not the shooting has ended (step S15). If not, the process returns to step S12, and the above operation is repeated until the shooting of all the imaging points is completed. Once the position of each of the measurement points shown in FIG. 5 is held in the memory of the data holding unit 129, the process proceeds to step S16, and the 153908.doc 201233513 scribe line for the 歪-axis distortion correction is calculated (step S16). . The "fourth" line of the male distortion correction means that, for example, Lxl, Lx4, and Lx7, which are not shown in Fig. 5, are connected to a line parallel to the X-axis of a plurality of imaging points. Since the brittle material substrate (10) is not square in accuracy and is distorted during sintering, the line connecting the respective imaging points also becomes a curved line instead of a straight line. Therefore, '3' is a function of connecting the lines, thereby correcting the scribe line as the X-axis distortion connecting the lines. The I-axis warp correction scribe line can be approximated by a straight line connecting the fold lines of the respective image pickup points, but it is preferable to smoothly connect the curves of the plurality of image pickup points. In order to calculate the corrected score line, at least 3 camera points are required on the g-scribe line. Once all the X-axis distortion correction scribe lines L X1, Lx4, Lx7, and Lxl 连结 connecting the imaging points are calculated, the χ-axis interpolation scribe lines are calculated. The so-called X-axis interpolation scribe line refers to the scribe line almost parallel to the χ axis except the 修正 修正 刻 刻 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , . These score lines are used as virtual measurement points for three adjacent measurement points, for example, pi and P2, and are connected to the virtual measurement points. Thereby, the operation along the axis of the 乂 axis is sequentially performed, and all the operations of the scribe line interpolation scribe line are completed. Further, the zigzag interpolation scribe line Lx 〇 is set to a line formed by bending in the opposite direction of Lx2 with reference to Lx 1 . The data traced by the nose is kept in the data holding unit 〖29. Then, the y-axis warp correction score line is calculated (step S18). The 丫 歪 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正 修正In this case, it is also preferable to set the y-axis warp correction score line to smoothly connect the curves of the respective measurement points. Then, in step S19, I53908.doc 201233513 is calculated in the same manner as the interpolation of the scribe line in the χ axis. The scribe lines LyO, Ly2, Ly3, Ly5, Ly6, and Ly9 are almost parallel to the 7 axes. , LyU. The data of the score lined by the operation is held in the data holding unit 129. When all the score lines are calculated as described above, the process proceeds to step S20, and first, the score lines Lx0 to Lxl 1 which are almost parallel to the x-axis are scored by the person (step S2). When scribing, the motor 104 is first driven to move the stage 1 〇6 in the y-axis direction. When there is an angular deviation, the motor 1G5 is driven to cancel the angular deviation 0, and the stage 1G6 is rotated and positioned. If the 疋 疋 position is completed, the scribe head 112 is moved in the X-axis direction by the linear motor 113 to lower the scribe head 112. Then, the motor 104' is driven to move the stage in the direction of the x-axis according to the information of the inscribed scribe line, and is scored along the scribe line LX. Then, if the scoring is completed, the scribing head 112 is raised. Then, the motor 1 is driven according to the data of the inserted scribe line, and the y-axis is moved in the direction of the y-axis, and the scribe line is scribed to the scribe line [X1. Then, the y-axis position is adjusted in such a manner as to coincide with the scribe line Lx1. The H is lowered so that the scribe head 112 is lowered and the scribe is advanced along the distortion correction scribe line Lxi. Further, the scribe lines Lx2 and Lx3 are interpolated, and the koji correction scribe lines Lx4·. are sequentially scribed. Thus, if all the scribe lines almost parallel to the X axis are completed in step S20
Lx0 Lxl1之刻劃，則藉由馬達驅動部126驅動馬達1〇5而使 平台106旋轉90。（步驟S21)e然後，沿著了軸内插刻When the Lx0 Lxl1 is scored, the motor 106 is driven by the motor driving portion 126 to rotate the stage 106 by 90. (Step S21) e Then, along the axis
劃線LyO 進行刻剑。以下，同樣地重複平台朝y軸方向之移動與沿著 刻劃線Lyl、Ly2.··之刻劃（步驟S22)。然後，若完成最後之 刻劃，則結束處理。 153908.doc 201233513 如此，於實施形態中，每次刻劃時將功能區域之中間之 測疋點作為通過點進行檢測，將連結測定點之曲線狀之線 作為刻劃線，因此即便於如LTCC基板般煅燒時容易產生歪 之脆丨生材料基板之情形時，亦可進行連結各功能零件之 中間點之刻劃。藉此，可提昇產品基板之尺寸精度。於該 實元》心中將刻劃線形成為曲線狀，因此利用由锻燒所引 起之收縮之偏向，對於如圖2所示般變形成梯形形狀之基 板、及其他不定形之基板，亦能夠以可依各功能區域進行 分割之方式進行刻劃，從而可提昇產品之良率。 再者，此處所示之脆性材料基板與其對準標記係一例， 亦可為具有更多之功能區域或對準標記之基板。例如於在1 鬼基板上成格子狀地形成有25x25之功能區域之情形等 時，亦可每隔例如5個交點檢測刻劃線之通過點，並以連結 邊通過點之方式將刻劃線形成為曲線狀。&，亦可將所有 功能區域之中間點作為測定點而算出刻劃線。 再者，於該實施形態中，藉由移動機構使平台於y軸方向 上移動並使平台旋轉，且使刻劃頭於χ軸方向上移動。作為 替代’亦可將使平台於χ軸及y軸方向上移動者設定為移動 機構，又，亦可將使刻劃頭於χ軸及y軸方向上移動 為移動機構。 &疋 再者，於該實施形態中，將脆性材料基板設定為低溫锻 儿陶瓷基板，對於針對容易變形之基板之刻劃有效。對於 針對特別小之基板之刻劃或用於獲得較小之產品基板之，; 劃特別有效。X，即便係用於液晶面板等之玻璃基板、1 153908.doc -12- 201233513 他基板，亦可應用本發明來更準確地進行刻劃。 又’於該實施形態令，與刻劃頭同樣地藉由線性馬達而 使CCD相機移動。藉此，可更準禮地檢測交點之測定點之 位置。當使用高解析度之CCD相機作為替代品時，亦可將 CCD相機設為固定來拍攝平台上之脆性材料基板。於此情 ‘形時，不需要相機移動機構，可使構成變得簡單。 [產業上之可利用性] 0 本發明可廣泛地用於低溫锻燒陶瓷基板之分割或形成玻 璃基板等脆性材料基板之刻劃線之步驟。 【圖式簡單說明】 圖1係表示刻劃前之玻璃基板之一例.之圖； 圖2係表示煅燒後'刻劃前之低溫煅燒陶瓷基板之一例的 園， 圖3係表示本發明之實施形態之刻劃裝置之立體圖； 圖4係表示本實施形態之刻劃裝置之控制器之方塊圖； Q 圖5係表示利用本實施形態之刻劃裝置進行刻劃前之脆 性材料基板之圖； 圖6係刻劃前之脆性材料基板之局部放大圖；及 -圖7係表示本實施形態之刻劃裝置之刻劃動作之流程圖。 • 【主要元件符號說明】 1〇〇 刻劃裝置 101 移動台 l〇2a ' l〇2b 導軌 1〇3 滚珠螺桿 153908.doc •13- 201233513 104 ' 105 馬達 106 平台 107 脆性材料基板 110 支架 111a 、 111b 支柱 112 刻劃頭 113 、 116 線性馬達 114 固持器 115 刻劃輪 117 CCD相機 120 控制器 121 圖像處理部 122 控制部 123 輸入部 124a、124b X馬達驅動部 125 Y馬達驅動部 126 旋轉用馬達驅動部 127 刻劃頭驅動部 128 監視器 129 資料保持部 153908.doc -14-Draw the LyO for the sword. Hereinafter, the movement of the land in the y-axis direction and the scribe along the scribe lines Lyl and Ly2.. are repeated in the same manner (step S22). Then, if the last scribe is completed, the process ends. 153908.doc 201233513 As described above, in the embodiment, each time the scribe is performed, the measurement point in the middle of the functional area is detected as a passing point, and the curved line connecting the measurement points is used as a scribe line, so that even if it is such as LTCC In the case where the substrate of the crucible material is easily generated when the substrate is fired, the intermediate point connecting the functional parts may be scored. Thereby, the dimensional accuracy of the product substrate can be improved. In the core of the real element, the score line is formed into a curved shape. Therefore, by using the deflection caused by the calcination, the substrate having a trapezoidal shape as shown in FIG. 2 and other amorphous substrates can also be used. The product can be scored according to the division of each functional area, thereby improving the yield of the product. Furthermore, the brittle material substrate and the alignment mark shown here may be a substrate having more functional regions or alignment marks. For example, when a functional area of 25×25 is formed in a lattice form on a ghost substrate, the passing point of the scribe line may be detected every five intersection points, for example, and the scribed line may be formed by the connecting edge passing point. Become curved. &, the middle point of all functional areas can also be used as the measurement point to calculate the score line. Further, in this embodiment, the stage is moved in the y-axis direction by the moving mechanism to rotate the stage, and the scribe head is moved in the z-axis direction. Alternatively, the movement of the platform in the x-axis and the y-axis direction may be set as the moving mechanism, and the scribe head may be moved in the x-axis and y-axis directions as the moving mechanism. & 疋 In this embodiment, the brittle material substrate is set as a low-temperature forged ceramic substrate, which is effective for scribing a substrate which is easily deformed. It is particularly effective for scoring a particularly small substrate or for obtaining a smaller product substrate. X, even if it is used for a glass substrate such as a liquid crystal panel, or the substrate of 1 153908.doc -12-201233513, the present invention can be applied to more accurately scribe. Further, in this embodiment, the CCD camera is moved by a linear motor in the same manner as the scribing head. Thereby, the position of the measurement point of the intersection can be detected more accurately. When using a high-resolution CCD camera as a replacement, the CCD camera can also be fixed to capture the brittle material substrate on the platform. In this case, the camera movement mechanism is not required, and the configuration can be simplified. [Industrial Applicability] 0 The present invention can be widely applied to the step of dividing a low-temperature calcined ceramic substrate or forming a scribe line of a brittle material substrate such as a glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of a glass substrate before scribing; Fig. 2 is a view showing an example of a low-temperature calcined ceramic substrate before scoring after calcination, and Fig. 3 is a view showing the practice of the present invention. FIG. 4 is a block diagram showing a controller of the scribing device of the present embodiment; and FIG. 5 is a view showing a substrate of a brittle material before scribing by the scribing device of the embodiment; Fig. 6 is a partial enlarged view of the substrate of the brittle material before scribing; and Fig. 7 is a flow chart showing the scribing operation of the scribing device of the embodiment. • [Main component symbol description] 1〇〇 scribing device 101 mobile station l〇2a ' l〇2b rail 1〇3 ball screw 153908.doc •13- 201233513 104 '105 motor 106 platform 107 brittle material substrate 110 bracket 111a, 111b strut 112 scribing head 113, 116 linear motor 114 retainer 115 scoring wheel 117 CCD camera 120 controller 121 image processing unit 122 control unit 123 input unit 124a, 124b X motor drive unit 125 Y motor drive unit 126 for rotation Motor drive unit 127 scribing head drive unit 128 monitor 129 data holding unit 153908.doc -14-