JP5119039B2 - 金属接触層を有するパワー半導体基板並びにそのための製造方法 - Google Patents

金属接触層を有するパワー半導体基板並びにそのための製造方法 Download PDF

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JP5119039B2
JP5119039B2 JP2008122169A JP2008122169A JP5119039B2 JP 5119039 B2 JP5119039 B2 JP 5119039B2 JP 2008122169 A JP2008122169 A JP 2008122169A JP 2008122169 A JP2008122169 A JP 2008122169A JP 5119039 B2 JP5119039 B2 JP 5119039B2
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layer
power semiconductor
semiconductor substrate
contact
contact surface
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JP2008283183A (ja
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ゲープル クリスチアン
ブラムル ハイコ
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Semikron Elektronik GmbH and Co KG
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Semikron Elektronik GmbH and Co KG
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Description

本発明は、絶縁基本ボディと少なくとも１つの導体通路（導電トラック）とこの導体通路の少なくとも１つの接触面とを有するパワー半導体基板に関する。この種のパワー半導体基板は例えばＡＭＤ（アクティブメタルブレーズ）基板又はＤＣＢ（ダイレクトカッパーボンディング）基板又はＩＭＳ（インスレイテッドメタルサブストレート）基板として知られている。
導体通路の一部分又は一区画として接触面は例えばパワー半導体素子又は外部の接続要素との導電接続のために用いられる。この種の接続要素は例えばロウ付け技術による接続を用いて又は押圧接触式の接続を用いて接触面と接続され得る。ここでは特に押圧接触式の接続において接触バネを用いた接続が特に関心事である。
従来技術に従い、多くの場合は酸化アルミニウム又は窒化アルミニウムであるセラミックス基本ボディから成り、銅フォイルから成る導体通路がその上に配置されているＤＣＢ基板が知られている。この種の導体通路は好ましくはロウ付け技術による接続のためにあり、その際には接触面自体を形成する。同様に幾つかの又は全ての接触面を好ましくは数原子層の厚さの追加的な薄い金層とともに形成することが知られている。この金層は特にワイヤボンディング接続の接触面のために有利である。従来技術に従い接触バネとして形成され得る、パワー半導体モジュールの補助端子要素や負荷端子要素のような押圧接触式の端子要素との関連においてそれらの接触面は十分なものとは言えない。熱負荷並びに押圧負荷により接触バネの接触フットが薄い金層を損傷し、それにより接触確実性が損なわれることがある。
本発明の基礎を成す課題は、特に押圧接触式の適用のために接触面の接触特性が改善されたパワー半導体基板を紹介し、並びにこの種のパワー半導体基板のための簡単で安価な製造方法を提示することである。
前記の課題は本発明に従い、請求項４による方法を用いて製造される、請求項１の構成要件を有するパワー半導体基板により解決される。有利な実施形態は下位請求項に記載されている。
本発明の出発点は、平たい絶縁基本ボディと少なくとも１つの導体通路とこの導体通路の一部としての少なくとも１つの接触面とを有するパワー半導体基板である。本発明に従いこの接触面上には好ましくは少なくとも１０マイクロメートルの厚さの金属性素材の層が加圧焼結接続を用いて配置されている。この際、加圧焼結接続としては金属性素材の層が以下に述べる方法を用いて配置されるものとして理解される。
この際、この第２の金属性素材が１００のうち９０以上の貴金属の割合を有し、パワー半導体モジュールから外に出てゆく端子要素である接触バネの接触フットが、金属性素材の層と接続される。この際、この貴金属が銀であると特に有利である。
更に接触面と金属性素材の層の間に数原子層の層厚を有する好ましくは金である貴金属の他の金属性層を配置することは有利であり得る。
この種のパワー半導体基板を製造するための本発明に従う方法は次の主要ステップを有する：
・ 平たい絶縁基本ボディと導体通路とこの導体通路の接触面とを有するパワー半導体基板を製造するステップ
・ 金属性素材と溶剤から成るペースト状の層をパワー半導体基板の少なくとも１つの接触面上に配置するステップ
・ このペースト状の層に対する加圧のステップ。この際、溶剤の大部分を加圧前にペースト状の層から追い出すことは有利である。
・ パワー半導体モジュールから外に出てゆく端子要素である接触バネの接触フットをペースト状の層に接続するステップ
ここで、ペースト状の層が少なくとも１０マイクロメートルの層厚と、１００のうち９０以上の貴金属の割合を有する。
この際、ペースト状の層がスクリーン印刷法を用いて塗布されると有利であり得る。この際、一方では要求される層厚において必要な位置決め精度が達成され、他方ではこの方法が安価で実現可能である。
ペースト状の層に対する加圧の有利な実施形はプレス（加圧機）と２つのプレススタンプ（押型）の適用により提供され得る。更にこの際、少なくとも１つのプレススタンプがこの上に配置されていて準静水圧を生成するシリコーンクッションとともに形成されていると有利である。
この際、パワー半導体基板上に好ましくはテフロン（登録商標）フォイルであるフォイルを配置し、引き続きこの結合体を圧力で付勢することは同様に有利である。
このパワー半導体基板並びにその製造方法の特に有利な他の構成は実施例の各々の説明で述べられている。次に本発明の解決策を図１〜図３の実施例に基づき更に説明する。
図１及び図２は本発明に従う第１パワー半導体基板（１０）の本発明に従う製造方法の個々のステップを示している。図１には周知のＤＣＢ基板に基づくパワー半導体基板（１０）が図示されている。この基板はセラミックス基本ボディ（１２）を有し、この基本ボディは２５０μｍ〜７００μｍの厚さを有し、酸化アルミニウムから成り、その両方の主面（１４０、１６０）上には金属性積層部（１４、１６）が配置されている。これらの金属性積層部は２００μｍと５００μｍの間の厚さを有する銅フォイルとして形成されている。基本ボディ（１２）の第１主面（１４０）上の銅フォイル（１４）は平たく形成されていて、非図示の冷却体に対する熱接触のために用いられる。基本ボディ（１２）の第２主面（１６０）上の銅フォイル（１６）は自ら構造化（パターン化）されていてそれにより導体通路を形成し、接触面（１６２）自体をも形成している。
他の有利な構成では導体通路はその延在経過の主要部分で更に被覆層を有し得る。この種の構成では接触面（１６２）は被覆部をもたず、それにより半導体素子又は接続要素又は端子要素と接続され得る。
本発明に従う方法に従い、明確には図示されていない第１ステップにより、好ましくはスクリーン印刷技術を用い、従来技術による焼結接続から知られているようなペースト状の層（２０）が接触面（１６２）上又は導体通路の一部分上に配置される。この際、このペースト状の層の層厚が１０μｍと２００μｍの間の値であると特に有利である。
このペースト状の層（２０）自体は、マイクロメートルのけた数の最大膨張を有する金属薄片の形状の金属性素材と溶剤との混合物から成る。金属薄片の材料としては特に銀が適しているが他の貴金属や１００のうち９０以上の貴金属の割合を有する混合物でもよい。
図２は金属性層を形成するためのペースト状の層（２０）に対する加圧（３０）を示している。この加圧（３０）前、ペースト状の層（２０）から少なくとも１００のうち９５の割合で溶剤を追い出すことが有利である。このことは好ましくはパワー半導体基板（１０）に対する温度付勢を用いて達成される。少なくとも３５０Ｋへのこの加熱は引き続く加圧（３０）中にも維持される又は更に高められる。
好ましいものでもあるフォイル（４０）が追加的に図示されていて、例えば加圧（３０）前に取り付けられたテフロン（登録商標）フォイルである。この際、全パワー半導体基板（１０）を被覆することが好ましい。しかし多くの構成では選択的に各々のペースト状の層（２０）だけをフォイル（４０）で覆うことも可能である。
ペースト状の層（２０）と接触面（１６２）の間に十分な付着接続を形成するためには加圧（３０）時の最大終圧が少なくとも８ＭＰａに対応すると有利である。
図３は本発明に従う第２パワー半導体基板（１０）とパワー半導体素子（５０）と接触バネ（６０）とを有する装置を示している。パワー半導体基板（１０）は図１に記載されているようにＤＣＢ基板である。この基板の導体通路（１６）上にはここではパワーダイオードであるパワー半導体素子（５０）が配置されていて、導体通路（１６）とロウ付け技術で接続されている。しかしこの接続バリエーションに限定されるものとして理解されるべきではない。
更にパワーダイオード（５０）は（同様に限定されるべきではない）ワイヤボンディング接続部（５２）を用いて第２の導体通路（１６）と接続されている。この第２の導体通路は、ボンディングワイヤ（５２）に対する電気接触を改善するために接触面（１６２）の領域で薄い金層（１８）を有し、この金層は数原子層の範囲の厚さを有する。金層（１８）上には本発明に従い上述の方法による金属性層（２０）が配置されている。この層（２０）は銀層であり、１０μｍ以上の厚さを有する。同様に他の素材、好ましくは１００のうち９０以上の貴金属の割合を有する素材も適している。
同様に接触バネ（６０）が図示されていて、この接触バネは押圧接触式の端子要素のために知られている。その接触フット（６２）は金属性層（２０）と接続状態にあり、例えばパワー半導体モジュールから外に出てゆく端子要素の接触部を意味する。
本発明に従うパワー半導体基板（１０）の長所は、１０μｍ以上、好ましくは５０μｍ以上の金属性層（２０）の厚さにより、押圧接触式の接触バネ（６０）との組み合わせで品質的に極めて高価値の持続的な接続部を形成するために傑出した接触面が形成されることである。
本発明に従う製造は、必要とされる材料に関し、また必要不可欠な層に関しても従来技術による加圧焼結接続に対応するものである。それによりこの種のパワー半導体基板（１０）の製造は簡単で安価に可能なため特に有利である。
本発明に従う第１パワー半導体基板の本発明に従う製造方法の個々のステップを示す図である。 本発明に従う第１パワー半導体基板の本発明に従う製造方法の個々のステップを示す図である。 本発明に従う第２パワー半導体基板を有する装置を示す図である。
１０ パワー半導体基板
１２ セラミックス基本ボディ
１４、１６ 金属積層部
１４０、１６０ セラミックス基本ボディの主面
１６２ 接触面
１８ 金層
２０ ペースト状の層
３０ 加圧
４０ フォイル
５０ パワー半導体素子
５２ ワイヤボンディング接続部／ボンディングワイヤ
６０ 接触バネ
６２ 接触フット

Claims (4)

  1. 平たい絶縁基本ボディ（１２）と少なくとも１つの導体通路（１６）とこの導体通路（１６）の一部としての少なくとも１つの接触面（１６２）とを有するパワー半導体基板（１０）において、この接触面（１６２）上に金属性素材の層（２０）が加圧焼結接続を用いて配置されており、
    前記金属性素材が少なくとも１０マイクロメートルの層厚と、１００のうち９０以上の貴金属の割合を有し、
    パワー半導体モジュールから外に出てゆく端子要素である接触バネ（６０）の接触フット（６２）が、前記金属性素材の層（２０）と接続されることを特徴とするパワー半導体基板。
  2. 前記貴金属が銀であることを特徴とする、請求項１に記載のパワー半導体基板。
  3. 接触面（１６２）と金属性素材の層（２０）の間に数原子層の層厚を有する貴金属の他の金属性層（１８）が配置されていることを特徴とする、請求項１に記載のパワー半導体基板。
  4. 請求項１に記載のパワー半導体基板（１０）を製造するための方法が次の主要ステップ、即ち、
    ・ 平たい絶縁基本ボディ（１２）と導体通路（１６）とこの導体通路（１６）の接触面（１６２）とを有するパワー半導体基板（１０）を製造するステップと、
    ・ 金属性素材と溶剤から成るペースト状の層（２０）をパワー半導体基板（１０）の少なくとも１つの接触面（１６２）上に配置するステップと、
    ・ このペースト状の層（２０）に対する加圧（３０）のステップと、
    ・ パワー半導体モジュールから外に出てゆく端子要素である接触バネ（６０）の接触フット（６２）をペースト状の層（２０）に接続するステップと、を有し、
    ペースト状の層が少なくとも１０マイクロメートルの層厚と、１００のうち９０以上の貴金属の割合を有することを特徴とする方法。
JP2008122169A 2007-05-12 2008-05-08 金属接触層を有するパワー半導体基板並びにそのための製造方法 Expired - Fee Related JP5119039B2 (ja)

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US20090008784A1 (en) 2009-01-08
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