JP5117629B1 - ウェハ加工用粘着テープ - Google Patents

ウェハ加工用粘着テープ Download PDF

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Publication number
JP5117629B1
JP5117629B1 JP2012146005A JP2012146005A JP5117629B1 JP 5117629 B1 JP5117629 B1 JP 5117629B1 JP 2012146005 A JP2012146005 A JP 2012146005A JP 2012146005 A JP2012146005 A JP 2012146005A JP 5117629 B1 JP5117629 B1 JP 5117629B1
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JP
Japan
Prior art keywords
sensitive adhesive
layer
thickness
elastic modulus
pressure
Prior art date
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Active
Application number
JP2012146005A
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English (en)
Japanese (ja)
Other versions
JP2014011273A (ja
Inventor
祥文 岡
啓時 横井
具朗 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2012146005A priority Critical patent/JP5117629B1/ja
Application granted granted Critical
Publication of JP5117629B1 publication Critical patent/JP5117629B1/ja
Priority to KR1020130074472A priority patent/KR101411080B1/ko
Priority to CN201310260994.6A priority patent/CN103509479A/zh
Priority to TW102123102A priority patent/TWI460248B/zh
Publication of JP2014011273A publication Critical patent/JP2014011273A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2012146005A 2012-06-28 2012-06-28 ウェハ加工用粘着テープ Active JP5117629B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012146005A JP5117629B1 (ja) 2012-06-28 2012-06-28 ウェハ加工用粘着テープ
KR1020130074472A KR101411080B1 (ko) 2012-06-28 2013-06-27 웨이퍼 가공용 점착 테이프
CN201310260994.6A CN103509479A (zh) 2012-06-28 2013-06-27 晶片加工用胶带
TW102123102A TWI460248B (zh) 2012-06-28 2013-06-28 晶圓加工用黏著帶

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012146005A JP5117629B1 (ja) 2012-06-28 2012-06-28 ウェハ加工用粘着テープ

Publications (2)

Publication Number Publication Date
JP5117629B1 true JP5117629B1 (ja) 2013-01-16
JP2014011273A JP2014011273A (ja) 2014-01-20

Family

ID=47692800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012146005A Active JP5117629B1 (ja) 2012-06-28 2012-06-28 ウェハ加工用粘着テープ

Country Status (4)

Country Link
JP (1) JP5117629B1 (ko)
KR (1) KR101411080B1 (ko)
CN (1) CN103509479A (ko)
TW (1) TWI460248B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015053355A1 (ja) * 2013-10-11 2015-04-16 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
JPWO2015174216A1 (ja) * 2014-05-14 2017-04-20 旭硝子株式会社 複合体、積層体および電子デバイス、ならびに、それらの製造方法
CN111868190A (zh) * 2018-03-20 2020-10-30 琳得科株式会社 粘着胶带及半导体装置的制造方法
CN112080217A (zh) * 2019-06-13 2020-12-15 日东电工株式会社 切割带及切割芯片接合薄膜
CN112534554A (zh) * 2018-08-08 2021-03-19 琳得科株式会社 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141555A1 (ja) * 2014-03-17 2015-09-24 リンテック株式会社 ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法
JP5697061B1 (ja) 2014-03-24 2015-04-08 古河電気工業株式会社 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6299405B2 (ja) * 2014-05-13 2018-03-28 旭硝子株式会社 複合体の製造方法および積層体の製造方法
SG11201708564WA (en) * 2015-06-29 2017-11-29 Mitsui Chemicals Tohcello Inc Film for manufacturing semiconductor parts
KR102060981B1 (ko) * 2015-10-21 2019-12-31 후루카와 덴키 고교 가부시키가이샤 반도체 웨이퍼의 이면 연삭가공용 표면보호 점착테이프 및 반도체 웨이퍼의 연삭가공 방법
CN108028190A (zh) * 2015-10-29 2018-05-11 古河电气工业株式会社 半导体晶圆表面保护用粘合带及半导体晶圆的加工方法
WO2017156506A1 (en) * 2016-03-11 2017-09-14 Entrotech, Inc. Protective sheets, articles, and methods
SG11201902922WA (en) * 2016-10-03 2019-05-30 Lintec Corp Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
EP3786246A4 (en) 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. SELF-ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
JP7141515B2 (ja) * 2019-03-07 2022-09-22 リンテック株式会社 ダイボンディングシート、及びフィルム状接着剤付き半導体チップの製造方法
CN113613896A (zh) * 2019-03-29 2021-11-05 琳得科株式会社 半导体加工用保护片以及半导体装置的制造方法
CN113453893A (zh) * 2019-03-29 2021-09-28 琳得科株式会社 半导体加工用保护片及半导体装置的制造方法
KR102099071B1 (ko) * 2019-05-09 2020-05-18 길화소재 주식회사 반도체 웨이퍼 보호용 점착 필름 및 이의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006630A (ja) * 2002-01-11 2004-01-08 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
WO2006088074A1 (ja) * 2005-02-18 2006-08-24 Mitsui Chemicals, Inc. 半導体ウェハ表面保護シート及び該保護シートを用いる半導体ウェハの保護方法
JP2007045965A (ja) * 2005-08-11 2007-02-22 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP2010254789A (ja) * 2009-04-24 2010-11-11 Kimoto & Co Ltd 粘着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW215453B (ko) * 1991-06-28 1993-11-01 Furukawa Electric Co Ltd
DE19520238C2 (de) * 1995-06-02 1998-01-15 Beiersdorf Ag Selbstklebeband
JP4054113B2 (ja) 1998-06-25 2008-02-27 三井化学株式会社 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
JP4707805B2 (ja) 2000-08-08 2011-06-22 三井化学株式会社 半導体ウエハ表面保護用粘着フィルム及びそれを用いる半導体ウエハ表面の保護方法
TW578222B (en) * 2002-01-11 2004-03-01 Mitsui Chemicals Inc Semiconductor wafer surface protective adhesive tape and backside process method of semiconductor wafer using the same
JP4748518B2 (ja) 2005-07-20 2011-08-17 古河電気工業株式会社 ダイシングダイボンドテープおよびダイシングテープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006630A (ja) * 2002-01-11 2004-01-08 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
WO2006088074A1 (ja) * 2005-02-18 2006-08-24 Mitsui Chemicals, Inc. 半導体ウェハ表面保護シート及び該保護シートを用いる半導体ウェハの保護方法
JP2007045965A (ja) * 2005-08-11 2007-02-22 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP2010254789A (ja) * 2009-04-24 2010-11-11 Kimoto & Co Ltd 粘着シート

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015053355A1 (ja) * 2013-10-11 2015-04-16 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
JP2015074770A (ja) * 2013-10-11 2015-04-20 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
JPWO2015174216A1 (ja) * 2014-05-14 2017-04-20 旭硝子株式会社 複合体、積層体および電子デバイス、ならびに、それらの製造方法
CN111868190A (zh) * 2018-03-20 2020-10-30 琳得科株式会社 粘着胶带及半导体装置的制造方法
CN112534554A (zh) * 2018-08-08 2021-03-19 琳得科株式会社 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法
CN112534554B (zh) * 2018-08-08 2024-02-06 琳得科株式会社 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法
CN112080217A (zh) * 2019-06-13 2020-12-15 日东电工株式会社 切割带及切割芯片接合薄膜

Also Published As

Publication number Publication date
CN103509479A (zh) 2014-01-15
KR101411080B1 (ko) 2014-06-27
TWI460248B (zh) 2014-11-11
KR20140001780A (ko) 2014-01-07
TW201400583A (zh) 2014-01-01
JP2014011273A (ja) 2014-01-20

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