JP5115645B2 - 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 - Google Patents

絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Download PDF

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Publication number
JP5115645B2
JP5115645B2 JP2011209540A JP2011209540A JP5115645B2 JP 5115645 B2 JP5115645 B2 JP 5115645B2 JP 2011209540 A JP2011209540 A JP 2011209540A JP 2011209540 A JP2011209540 A JP 2011209540A JP 5115645 B2 JP5115645 B2 JP 5115645B2
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JP
Japan
Prior art keywords
layer
fiber base
resin
insulating substrate
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011209540A
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English (en)
Japanese (ja)
Other versions
JP2012124460A (ja
JP2012124460A5 (enExample
Inventor
偉師 小野塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2011209540A priority Critical patent/JP5115645B2/ja
Priority to TW100141393A priority patent/TWI477208B/zh
Priority to KR1020137013803A priority patent/KR20130133199A/ko
Priority to US13/885,321 priority patent/US20130242520A1/en
Priority to PCT/JP2011/076254 priority patent/WO2012067094A1/ja
Priority to CN201180064929.5A priority patent/CN103298612B/zh
Publication of JP2012124460A publication Critical patent/JP2012124460A/ja
Publication of JP2012124460A5 publication Critical patent/JP2012124460A5/ja
Application granted granted Critical
Publication of JP5115645B2 publication Critical patent/JP5115645B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W70/60—
    • H10W70/635—
    • H10W70/685—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W74/15—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2011209540A 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 Expired - Fee Related JP5115645B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011209540A JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
TW100141393A TWI477208B (zh) 2010-11-18 2011-11-14 半導體裝置
US13/885,321 US20130242520A1 (en) 2010-11-18 2011-11-15 Insulating substrate, metal-clad laminate, printed wiring board and semiconductor device
PCT/JP2011/076254 WO2012067094A1 (ja) 2010-11-18 2011-11-15 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
KR1020137013803A KR20130133199A (ko) 2010-11-18 2011-11-15 절연성 기판, 금속장 적층판, 프린트 배선판, 및 반도체 장치
CN201180064929.5A CN103298612B (zh) 2010-11-18 2011-11-15 绝缘性基板、覆金属箔层压板、印刷线路板及半导体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010258172 2010-11-18
JP2010258172 2010-11-18
JP2011209540A JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2012191863A Division JP5821811B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
JP2012191864A Division JP5152432B2 (ja) 2010-11-18 2012-08-31 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2012124460A JP2012124460A (ja) 2012-06-28
JP2012124460A5 JP2012124460A5 (enExample) 2012-08-09
JP5115645B2 true JP5115645B2 (ja) 2013-01-09

Family

ID=46084021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011209540A Expired - Fee Related JP5115645B2 (ja) 2010-11-18 2011-09-26 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置

Country Status (6)

Country Link
US (1) US20130242520A1 (enExample)
JP (1) JP5115645B2 (enExample)
KR (1) KR20130133199A (enExample)
CN (1) CN103298612B (enExample)
TW (1) TWI477208B (enExample)
WO (1) WO2012067094A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
JP2013123907A (ja) * 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
US9117730B2 (en) * 2011-12-29 2015-08-25 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
SG11201404327PA (en) * 2012-01-31 2014-10-30 Mitsubishi Gas Chemical Co Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same
JP6112452B2 (ja) * 2013-03-29 2017-04-12 パナソニックＩｐマネジメント株式会社 両面金属張積層板及びその製造方法
CN103237418B (zh) * 2013-05-15 2015-10-21 广州兴森快捷电路科技有限公司 印制电路板翘曲的判断方法
US9893043B2 (en) * 2014-06-06 2018-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a chip package
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
US9818682B2 (en) * 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes
WO2017057138A1 (ja) * 2015-09-30 2017-04-06 住友ベークライト株式会社 構造体、配線基板および配線基板の製造方法
KR102512228B1 (ko) * 2015-10-01 2023-03-21 삼성전기주식회사 절연재 및 이를 포함하는 인쇄회로기판
US9640492B1 (en) * 2015-12-17 2017-05-02 International Business Machines Corporation Laminate warpage control
JP6661232B2 (ja) * 2016-03-01 2020-03-11 新光電気工業株式会社 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
WO2018088493A1 (ja) * 2016-11-09 2018-05-17 日立化成株式会社 プリント配線板及び半導体パッケージ
JP7135364B2 (ja) * 2018-03-23 2022-09-13 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
TWI705536B (zh) * 2018-11-16 2020-09-21 欣興電子股份有限公司 載板結構及其製作方法
WO2020202903A1 (ja) * 2019-03-29 2020-10-08 東レ株式会社 繊維強化プラスチック成形体
CN111712062B (zh) * 2020-06-30 2021-09-28 生益电子股份有限公司 一种芯片与pcb的焊接方法
EP3964824B1 (en) 2020-09-02 2024-02-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Expansion coefficient determination with deformation measurement and simulation
JP7566652B2 (ja) 2021-02-02 2024-10-15 キオクシア株式会社 半導体装置および基板
KR20230116461A (ko) 2022-01-28 2023-08-04 삼성전자주식회사 디스플레이 장치
US20250174533A1 (en) * 2023-11-29 2025-05-29 Mediatek Inc. Semiconductor package structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134918A (ja) * 2000-10-26 2002-05-10 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP3499837B2 (ja) * 2001-03-13 2004-02-23 住友ベークライト株式会社 プリプレグの製造方法
US7859110B2 (en) * 2006-04-28 2010-12-28 Sumitomo Bakelite Co., Ltd. Solder resist material, wiring board using the solder resist material, and semiconductor package
JP5234962B2 (ja) * 2006-08-07 2013-07-10 新日鉄住金化学株式会社 プリプレグ、積層板およびプリント配線板
MY150139A (en) * 2007-01-29 2013-11-29 Sumitomo Bakelite Co Laminated body, method of manufacturing substrate, substrate and semiconductor device
JP5268395B2 (ja) * 2007-03-26 2013-08-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5138267B2 (ja) * 2007-04-18 2013-02-06 日立化成工業株式会社 プリプレグ、それを用いた多層基配線板及び電子部品
JP2010087402A (ja) * 2008-10-02 2010-04-15 Hitachi Chem Co Ltd プリント配線板用多層基板の製造方法

Also Published As

Publication number Publication date
JP2012124460A (ja) 2012-06-28
WO2012067094A1 (ja) 2012-05-24
US20130242520A1 (en) 2013-09-19
TW201233260A (en) 2012-08-01
CN103298612B (zh) 2015-09-16
TWI477208B (zh) 2015-03-11
CN103298612A (zh) 2013-09-11
KR20130133199A (ko) 2013-12-06

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