JP5091676B2 - 圧力測定システムおよび回路基板ハウジング - Google Patents

圧力測定システムおよび回路基板ハウジング Download PDF

Info

Publication number
JP5091676B2
JP5091676B2 JP2007530136A JP2007530136A JP5091676B2 JP 5091676 B2 JP5091676 B2 JP 5091676B2 JP 2007530136 A JP2007530136 A JP 2007530136A JP 2007530136 A JP2007530136 A JP 2007530136A JP 5091676 B2 JP5091676 B2 JP 5091676B2
Authority
JP
Japan
Prior art keywords
circuit board
board housing
measurement system
pressure
pressure measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007530136A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008511833A (ja
JP2008511833A5 (enExample
Inventor
嘉一 金子
周治 島田
育宏 柳澤
芳紀 和田
ウィリアム スティーヴン コッシュ
ウィリアム ジュールズ ロクソン
Original Assignee
アシュクロフト−ナガノ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アシュクロフト−ナガノ インコーポレーテッド filed Critical アシュクロフト−ナガノ インコーポレーテッド
Publication of JP2008511833A publication Critical patent/JP2008511833A/ja
Publication of JP2008511833A5 publication Critical patent/JP2008511833A5/ja
Application granted granted Critical
Publication of JP5091676B2 publication Critical patent/JP5091676B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
JP2007530136A 2004-08-27 2005-08-25 圧力測定システムおよび回路基板ハウジング Expired - Fee Related JP5091676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/928,024 US7270010B2 (en) 2004-08-27 2004-08-27 System and method for pressure measurement
US10/928,024 2004-08-27
PCT/US2005/030297 WO2006026376A1 (en) 2004-08-27 2005-08-25 System and method for pressure measurement

Publications (3)

Publication Number Publication Date
JP2008511833A JP2008511833A (ja) 2008-04-17
JP2008511833A5 JP2008511833A5 (enExample) 2008-11-20
JP5091676B2 true JP5091676B2 (ja) 2012-12-05

Family

ID=35427553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530136A Expired - Fee Related JP5091676B2 (ja) 2004-08-27 2005-08-25 圧力測定システムおよび回路基板ハウジング

Country Status (6)

Country Link
US (1) US7270010B2 (enExample)
EP (1) EP1800098B1 (enExample)
JP (1) JP5091676B2 (enExample)
CN (1) CN100552401C (enExample)
CA (1) CA2576853C (enExample)
WO (1) WO2006026376A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4203678B2 (ja) * 2006-12-07 2009-01-07 Ｓｍｃ株式会社 圧力スイッチ
JP4403559B2 (ja) * 2006-12-07 2010-01-27 Ｓｍｃ株式会社 圧力スイッチ
US7779701B2 (en) * 2008-06-02 2010-08-24 Sensata Technologies, Inc. Pressure sensor apparatus
JP5395412B2 (ja) * 2008-11-25 2014-01-22 パナソニック株式会社 インタポーザ
US9354132B2 (en) * 2009-02-12 2016-05-31 Continental Automotive Systems, Inc. Jointless pressure sensor port
US8156816B2 (en) * 2010-05-27 2012-04-17 Sensata Technologies, Inc. Pressure sensor
CN102323836A (zh) * 2011-05-10 2012-01-18 贵州航天电器股份有限公司 一种温度控制组件
US8459125B2 (en) * 2011-08-01 2013-06-11 Honeywell International Inc. Pressure sensor assembly
DE102012012527B4 (de) * 2012-06-26 2015-05-21 Krohne Analytics Gmbh Messvorrichtung zum Bestimmen einer Prozessgröße
US9746390B2 (en) * 2015-02-26 2017-08-29 Sensata Technologies, Inc. Microfused silicon strain gauge (MSG) pressure sensor package
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) * 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
JP6793624B2 (ja) * 2017-11-13 2020-12-02 株式会社鷺宮製作所 圧力センサ
CN108168766B (zh) * 2018-01-09 2020-03-27 武汉飞恩微电子有限公司 一种重载压力传感器及其制造方法
DE102019119426A1 (de) * 2019-07-17 2021-01-21 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
CN112556919A (zh) * 2020-12-10 2021-03-26 龙微科技无锡有限公司 一种新型耐腐蚀压力传感器模块
DE102021122566A1 (de) * 2021-08-31 2023-03-02 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
EP4469769A2 (en) * 2022-03-17 2024-12-04 Sensata Technologies, Inc. Brake pedal with force sensor and membranes

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650271B2 (ja) * 1986-03-07 1994-06-29 太平洋工業株式会社 圧力検知装置
US5174014A (en) * 1990-07-27 1992-12-29 Data Instruments, Inc. Method of manufacturing pressure transducers
IT1257206B (it) 1992-05-29 1996-01-10 Fascia elastica di molleggio per sedili di autoveicoli.
JPH0821775A (ja) * 1994-07-08 1996-01-23 Fuji Koki Seisakusho:Kk 圧力センサ
JPH08105808A (ja) * 1994-10-05 1996-04-23 Mitsubishi Electric Corp 圧力センサ
JP3440629B2 (ja) 1995-04-25 2003-08-25 松下電工株式会社 圧力センサ
JPH10185735A (ja) * 1996-12-27 1998-07-14 Nagano Keiki Co Ltd 圧力センサモジュール
US5880372A (en) * 1997-01-10 1999-03-09 Integrated Sensor Solutions Media compatible pressure sensor device utilizing self-aligned components which fit together without the need for adhesives
US6089106A (en) * 1998-09-04 2000-07-18 Breed Automotive Technology, Inc. Force sensor assembly
EP0995979B1 (de) 1998-10-23 2003-07-23 Endress + Hauser GmbH + Co. KG Druckaufnehmer
JP2000155062A (ja) * 1998-11-19 2000-06-06 Nippon Seiki Co Ltd 圧力検出器
DE19916087A1 (de) * 1999-04-09 2000-10-26 Lucas Ind Plc Anordnung zur Messung eines Fluiddrucks
CN2400795Y (zh) * 1999-12-23 2000-10-11 王洪业 离子束溅射沉积薄膜压力传感器
US6453747B1 (en) * 2000-01-12 2002-09-24 Peter A. Weise Hermetic pressure transducer
JP2001208633A (ja) 2000-01-27 2001-08-03 Matsushita Electric Ind Co Ltd 圧力センサ
DE10004408C1 (de) * 2000-02-02 2001-06-21 Paragon Sensors & Systems Ag Mikrofonmodul
US6769308B1 (en) * 2000-09-22 2004-08-03 Delphi Technologies, Inc. Low-cost stainless steel pressure sensor assembly for a pneumatic valve
US6584851B2 (en) * 2000-11-30 2003-07-01 Nagano Keiki Co., Ltd. Fluid pressure sensor having a pressure port
JP3556165B2 (ja) * 2000-11-30 2004-08-18 長野計器株式会社 圧力センサ
JP4356238B2 (ja) * 2000-12-25 2009-11-04 株式会社デンソー 圧力センサ
US6907789B2 (en) * 2002-05-06 2005-06-21 Honeywell International Inc. Sensor package
US6722205B2 (en) * 2002-06-24 2004-04-20 Honeywell International, Inc. Unitary pressure sensor housing and assembly
JP2004101515A (ja) 2002-07-10 2004-04-02 Texas Instruments Inc 気密圧力変換器
US6782758B2 (en) * 2002-07-10 2004-08-31 Texas Instruments Incorporated Hermetic pressure transducer
US6823718B2 (en) * 2002-10-28 2004-11-30 Pti Technologies, Inc. Single-body multiple sensing device
US6742395B1 (en) * 2002-12-20 2004-06-01 Texas Instruments Incorporated Hermetic pressure transducer
US6866545B2 (en) * 2003-03-10 2005-03-15 Control Products, Inc., (Us) Electrical cordset with integral signal conditioning circuitry
US6997059B2 (en) * 2003-10-07 2006-02-14 Cts Corporation Pressure sensor
JP4301048B2 (ja) * 2004-03-19 2009-07-22 株式会社デンソー 圧力センサおよびその製造方法
US7131334B2 (en) * 2004-04-19 2006-11-07 Celerity, Inc. Pressure sensor device and method

Also Published As

Publication number Publication date
WO2006026376A1 (en) 2006-03-09
CN100552401C (zh) 2009-10-21
CN101040176A (zh) 2007-09-19
CA2576853A1 (en) 2006-03-09
US20060042393A1 (en) 2006-03-02
CA2576853C (en) 2014-05-06
EP1800098B1 (en) 2015-08-12
JP2008511833A (ja) 2008-04-17
US7270010B2 (en) 2007-09-18
EP1800098A1 (en) 2007-06-27

Similar Documents

Publication Publication Date Title
JP5091676B2 (ja) 圧力測定システムおよび回路基板ハウジング
KR100590275B1 (ko) 압력 센서
US7152483B2 (en) High pressure sensor comprising silicon membrane and solder layer
US6131467A (en) Pressure sensor including a joint for connecting a housing and connector case together
JP3987386B2 (ja) 圧力センサ
JP4075776B2 (ja) 物理量センサおよび圧力センサ
JP5820759B2 (ja) 圧力検出装置の製造方法、圧力検出装置付き内燃機関の製造方法
EP0890830B1 (en) Pressure sensor
JP4027655B2 (ja) 圧力センサ装置
JP4118990B2 (ja) 圧力センサ
US6619132B2 (en) Sensor including a circuit lead frame and a terminal lead frame formed by a metal plate
EP1584911B1 (en) Housing for a pressure sensor and method for manufacturing the same
JP2008185349A (ja) 圧力センサ
JP4223273B2 (ja) 圧力センサ
JP4118729B2 (ja) 圧力センサ
JP5050392B2 (ja) 圧力センサ
JP2014232025A (ja) 電子装置
JPH11173931A (ja) 圧力センサ
JP2005249471A (ja) 圧力センサおよびその製造方法
JP3722191B2 (ja) 半導体圧力センサ
JP4049109B2 (ja) 圧力センサ
JP2001124648A (ja) 圧力測定装置
JP2008008829A (ja) 圧力センサ
JP2000249615A (ja) 半導体圧力センサ
JP2006184075A (ja) 圧力センサ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080825

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080825

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20080825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080826

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111004

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111229

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120821

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120914

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150921

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5091676

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees