CN100552401C - 用于压力测量的系统和方法 - Google Patents

用于压力测量的系统和方法 Download PDF

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Publication number
CN100552401C
CN100552401C CNB2005800286968A CN200580028696A CN100552401C CN 100552401 C CN100552401 C CN 100552401C CN B2005800286968 A CNB2005800286968 A CN B2005800286968A CN 200580028696 A CN200580028696 A CN 200580028696A CN 100552401 C CN100552401 C CN 100552401C
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CN
China
Prior art keywords
circuit board
board housing
housing
diameter portion
pressure measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800286968A
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English (en)
Chinese (zh)
Other versions
CN101040176A (zh
Inventor
金子义和
岛田修二
柳泽育弘
和田义则
W·S·柯什
W·J·洛克西姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ashcroft Nagano Inc
Original Assignee
Ashcroft Nagano Inc
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Filing date
Publication date
Application filed by Ashcroft Nagano Inc filed Critical Ashcroft Nagano Inc
Publication of CN101040176A publication Critical patent/CN101040176A/zh
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Publication of CN100552401C publication Critical patent/CN100552401C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
CNB2005800286968A 2004-08-27 2005-08-25 用于压力测量的系统和方法 Expired - Fee Related CN100552401C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/928,024 US7270010B2 (en) 2004-08-27 2004-08-27 System and method for pressure measurement
US10/928,024 2004-08-27

Publications (2)

Publication Number Publication Date
CN101040176A CN101040176A (zh) 2007-09-19
CN100552401C true CN100552401C (zh) 2009-10-21

Family

ID=35427553

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800286968A Expired - Fee Related CN100552401C (zh) 2004-08-27 2005-08-25 用于压力测量的系统和方法

Country Status (6)

Country Link
US (1) US7270010B2 (enExample)
EP (1) EP1800098B1 (enExample)
JP (1) JP5091676B2 (enExample)
CN (1) CN100552401C (enExample)
CA (1) CA2576853C (enExample)
WO (1) WO2006026376A1 (enExample)

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JP4203678B2 (ja) * 2006-12-07 2009-01-07 Ｓｍｃ株式会社 圧力スイッチ
JP4403559B2 (ja) * 2006-12-07 2010-01-27 Ｓｍｃ株式会社 圧力スイッチ
US7779701B2 (en) * 2008-06-02 2010-08-24 Sensata Technologies, Inc. Pressure sensor apparatus
JP5395412B2 (ja) * 2008-11-25 2014-01-22 パナソニック株式会社 インタポーザ
US9354132B2 (en) * 2009-02-12 2016-05-31 Continental Automotive Systems, Inc. Jointless pressure sensor port
US8156816B2 (en) * 2010-05-27 2012-04-17 Sensata Technologies, Inc. Pressure sensor
CN102323836A (zh) * 2011-05-10 2012-01-18 贵州航天电器股份有限公司 一种温度控制组件
US8459125B2 (en) * 2011-08-01 2013-06-11 Honeywell International Inc. Pressure sensor assembly
DE102012012527B4 (de) * 2012-06-26 2015-05-21 Krohne Analytics Gmbh Messvorrichtung zum Bestimmen einer Prozessgröße
US9746390B2 (en) * 2015-02-26 2017-08-29 Sensata Technologies, Inc. Microfused silicon strain gauge (MSG) pressure sensor package
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) * 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
JP6793624B2 (ja) * 2017-11-13 2020-12-02 株式会社鷺宮製作所 圧力センサ
CN108168766B (zh) * 2018-01-09 2020-03-27 武汉飞恩微电子有限公司 一种重载压力传感器及其制造方法
DE102019119426A1 (de) * 2019-07-17 2021-01-21 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
CN112556919A (zh) * 2020-12-10 2021-03-26 龙微科技无锡有限公司 一种新型耐腐蚀压力传感器模块
DE102021122566A1 (de) * 2021-08-31 2023-03-02 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
EP4469769A2 (en) * 2022-03-17 2024-12-04 Sensata Technologies, Inc. Brake pedal with force sensor and membranes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0995979A1 (de) * 1998-10-23 2000-04-26 Endress + Hauser GmbH + Co. Druckaufnehmer
CN2400795Y (zh) * 1999-12-23 2000-10-11 王洪业 离子束溅射沉积薄膜压力传感器
EP1211496A2 (en) * 2000-11-30 2002-06-05 Nagano Keiki Co., Ltd. Pressure sensor
EP1382953A2 (en) * 2002-07-10 2004-01-21 Texas Instruments Incorporated Hermetic pressure transducer

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JPH0650271B2 (ja) * 1986-03-07 1994-06-29 太平洋工業株式会社 圧力検知装置
US5174014A (en) * 1990-07-27 1992-12-29 Data Instruments, Inc. Method of manufacturing pressure transducers
IT1257206B (it) 1992-05-29 1996-01-10 Fascia elastica di molleggio per sedili di autoveicoli.
JPH0821775A (ja) * 1994-07-08 1996-01-23 Fuji Koki Seisakusho:Kk 圧力センサ
JPH08105808A (ja) * 1994-10-05 1996-04-23 Mitsubishi Electric Corp 圧力センサ
JP3440629B2 (ja) 1995-04-25 2003-08-25 松下電工株式会社 圧力センサ
JPH10185735A (ja) * 1996-12-27 1998-07-14 Nagano Keiki Co Ltd 圧力センサモジュール
US5880372A (en) * 1997-01-10 1999-03-09 Integrated Sensor Solutions Media compatible pressure sensor device utilizing self-aligned components which fit together without the need for adhesives
US6089106A (en) * 1998-09-04 2000-07-18 Breed Automotive Technology, Inc. Force sensor assembly
JP2000155062A (ja) * 1998-11-19 2000-06-06 Nippon Seiki Co Ltd 圧力検出器
DE19916087A1 (de) * 1999-04-09 2000-10-26 Lucas Ind Plc Anordnung zur Messung eines Fluiddrucks
US6453747B1 (en) * 2000-01-12 2002-09-24 Peter A. Weise Hermetic pressure transducer
JP2001208633A (ja) 2000-01-27 2001-08-03 Matsushita Electric Ind Co Ltd 圧力センサ
DE10004408C1 (de) * 2000-02-02 2001-06-21 Paragon Sensors & Systems Ag Mikrofonmodul
US6769308B1 (en) * 2000-09-22 2004-08-03 Delphi Technologies, Inc. Low-cost stainless steel pressure sensor assembly for a pneumatic valve
JP3556165B2 (ja) * 2000-11-30 2004-08-18 長野計器株式会社 圧力センサ
JP4356238B2 (ja) * 2000-12-25 2009-11-04 株式会社デンソー 圧力センサ
US6907789B2 (en) * 2002-05-06 2005-06-21 Honeywell International Inc. Sensor package
US6722205B2 (en) * 2002-06-24 2004-04-20 Honeywell International, Inc. Unitary pressure sensor housing and assembly
US6782758B2 (en) * 2002-07-10 2004-08-31 Texas Instruments Incorporated Hermetic pressure transducer
US6823718B2 (en) * 2002-10-28 2004-11-30 Pti Technologies, Inc. Single-body multiple sensing device
US6742395B1 (en) * 2002-12-20 2004-06-01 Texas Instruments Incorporated Hermetic pressure transducer
US6866545B2 (en) * 2003-03-10 2005-03-15 Control Products, Inc., (Us) Electrical cordset with integral signal conditioning circuitry
US6997059B2 (en) * 2003-10-07 2006-02-14 Cts Corporation Pressure sensor
JP4301048B2 (ja) * 2004-03-19 2009-07-22 株式会社デンソー 圧力センサおよびその製造方法
US7131334B2 (en) * 2004-04-19 2006-11-07 Celerity, Inc. Pressure sensor device and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0995979A1 (de) * 1998-10-23 2000-04-26 Endress + Hauser GmbH + Co. Druckaufnehmer
CN2400795Y (zh) * 1999-12-23 2000-10-11 王洪业 离子束溅射沉积薄膜压力传感器
EP1211496A2 (en) * 2000-11-30 2002-06-05 Nagano Keiki Co., Ltd. Pressure sensor
EP1382953A2 (en) * 2002-07-10 2004-01-21 Texas Instruments Incorporated Hermetic pressure transducer

Also Published As

Publication number Publication date
WO2006026376A1 (en) 2006-03-09
JP5091676B2 (ja) 2012-12-05
CN101040176A (zh) 2007-09-19
CA2576853A1 (en) 2006-03-09
US20060042393A1 (en) 2006-03-02
CA2576853C (en) 2014-05-06
EP1800098B1 (en) 2015-08-12
JP2008511833A (ja) 2008-04-17
US7270010B2 (en) 2007-09-18
EP1800098A1 (en) 2007-06-27

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Granted publication date: 20091021

Termination date: 20190825