CA2576853C - System and method for pressure measurement - Google Patents
System and method for pressure measurement Download PDFInfo
- Publication number
- CA2576853C CA2576853C CA2576853A CA2576853A CA2576853C CA 2576853 C CA2576853 C CA 2576853C CA 2576853 A CA2576853 A CA 2576853A CA 2576853 A CA2576853 A CA 2576853A CA 2576853 C CA2576853 C CA 2576853C
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- board housing
- pressure
- housing
- diameter section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009530 blood pressure measurement Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title description 10
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 24
- 238000005476 soldering Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/928,024 US7270010B2 (en) | 2004-08-27 | 2004-08-27 | System and method for pressure measurement |
| US10/928,024 | 2004-08-27 | ||
| PCT/US2005/030297 WO2006026376A1 (en) | 2004-08-27 | 2005-08-25 | System and method for pressure measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2576853A1 CA2576853A1 (en) | 2006-03-09 |
| CA2576853C true CA2576853C (en) | 2014-05-06 |
Family
ID=35427553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2576853A Expired - Fee Related CA2576853C (en) | 2004-08-27 | 2005-08-25 | System and method for pressure measurement |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7270010B2 (enExample) |
| EP (1) | EP1800098B1 (enExample) |
| JP (1) | JP5091676B2 (enExample) |
| CN (1) | CN100552401C (enExample) |
| CA (1) | CA2576853C (enExample) |
| WO (1) | WO2006026376A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4203678B2 (ja) * | 2006-12-07 | 2009-01-07 | Ｓｍｃ株式会社 | 圧力スイッチ |
| JP4403559B2 (ja) * | 2006-12-07 | 2010-01-27 | Ｓｍｃ株式会社 | 圧力スイッチ |
| US7779701B2 (en) * | 2008-06-02 | 2010-08-24 | Sensata Technologies, Inc. | Pressure sensor apparatus |
| JP5395412B2 (ja) * | 2008-11-25 | 2014-01-22 | パナソニック株式会社 | インタポーザ |
| US9354132B2 (en) * | 2009-02-12 | 2016-05-31 | Continental Automotive Systems, Inc. | Jointless pressure sensor port |
| US8156816B2 (en) * | 2010-05-27 | 2012-04-17 | Sensata Technologies, Inc. | Pressure sensor |
| CN102323836A (zh) * | 2011-05-10 | 2012-01-18 | 贵州航天电器股份有限公司 | 一种温度控制组件 |
| US8459125B2 (en) * | 2011-08-01 | 2013-06-11 | Honeywell International Inc. | Pressure sensor assembly |
| DE102012012527B4 (de) * | 2012-06-26 | 2015-05-21 | Krohne Analytics Gmbh | Messvorrichtung zum Bestimmen einer Prozessgröße |
| US9746390B2 (en) * | 2015-02-26 | 2017-08-29 | Sensata Technologies, Inc. | Microfused silicon strain gauge (MSG) pressure sensor package |
| CN107290099B (zh) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | 压力传感器、用于压力传感器的插塞件和制造插塞件的方法 |
| EP3236226B1 (en) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| US10323998B2 (en) * | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
| US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
| JP6793624B2 (ja) * | 2017-11-13 | 2020-12-02 | 株式会社鷺宮製作所 | 圧力センサ |
| CN108168766B (zh) * | 2018-01-09 | 2020-03-27 | 武汉飞恩微电子有限公司 | 一种重载压力传感器及其制造方法 |
| DE102019119426A1 (de) * | 2019-07-17 | 2021-01-21 | Endress+Hauser SE+Co. KG | Feldgerät der Automatisierungstechnik |
| CN112556919A (zh) * | 2020-12-10 | 2021-03-26 | 龙微科技无锡有限公司 | 一种新型耐腐蚀压力传感器模块 |
| DE102021122566A1 (de) * | 2021-08-31 | 2023-03-02 | Endress+Hauser SE+Co. KG | Feldgerät der Automatisierungstechnik |
| EP4469769A2 (en) * | 2022-03-17 | 2024-12-04 | Sensata Technologies, Inc. | Brake pedal with force sensor and membranes |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650271B2 (ja) * | 1986-03-07 | 1994-06-29 | 太平洋工業株式会社 | 圧力検知装置 |
| US5174014A (en) * | 1990-07-27 | 1992-12-29 | Data Instruments, Inc. | Method of manufacturing pressure transducers |
| IT1257206B (it) | 1992-05-29 | 1996-01-10 | Fascia elastica di molleggio per sedili di autoveicoli. | |
| JPH0821775A (ja) * | 1994-07-08 | 1996-01-23 | Fuji Koki Seisakusho:Kk | 圧力センサ |
| JPH08105808A (ja) * | 1994-10-05 | 1996-04-23 | Mitsubishi Electric Corp | 圧力センサ |
| JP3440629B2 (ja) | 1995-04-25 | 2003-08-25 | 松下電工株式会社 | 圧力センサ |
| JPH10185735A (ja) * | 1996-12-27 | 1998-07-14 | Nagano Keiki Co Ltd | 圧力センサモジュール |
| US5880372A (en) * | 1997-01-10 | 1999-03-09 | Integrated Sensor Solutions | Media compatible pressure sensor device utilizing self-aligned components which fit together without the need for adhesives |
| US6089106A (en) * | 1998-09-04 | 2000-07-18 | Breed Automotive Technology, Inc. | Force sensor assembly |
| EP0995979B1 (de) | 1998-10-23 | 2003-07-23 | Endress + Hauser GmbH + Co. KG | Druckaufnehmer |
| JP2000155062A (ja) * | 1998-11-19 | 2000-06-06 | Nippon Seiki Co Ltd | 圧力検出器 |
| DE19916087A1 (de) * | 1999-04-09 | 2000-10-26 | Lucas Ind Plc | Anordnung zur Messung eines Fluiddrucks |
| CN2400795Y (zh) * | 1999-12-23 | 2000-10-11 | 王洪业 | 离子束溅射沉积薄膜压力传感器 |
| US6453747B1 (en) * | 2000-01-12 | 2002-09-24 | Peter A. Weise | Hermetic pressure transducer |
| JP2001208633A (ja) | 2000-01-27 | 2001-08-03 | Matsushita Electric Ind Co Ltd | 圧力センサ |
| DE10004408C1 (de) * | 2000-02-02 | 2001-06-21 | Paragon Sensors & Systems Ag | Mikrofonmodul |
| US6769308B1 (en) * | 2000-09-22 | 2004-08-03 | Delphi Technologies, Inc. | Low-cost stainless steel pressure sensor assembly for a pneumatic valve |
| US6584851B2 (en) * | 2000-11-30 | 2003-07-01 | Nagano Keiki Co., Ltd. | Fluid pressure sensor having a pressure port |
| JP3556165B2 (ja) * | 2000-11-30 | 2004-08-18 | 長野計器株式会社 | 圧力センサ |
| JP4356238B2 (ja) * | 2000-12-25 | 2009-11-04 | 株式会社デンソー | 圧力センサ |
| US6907789B2 (en) * | 2002-05-06 | 2005-06-21 | Honeywell International Inc. | Sensor package |
| US6722205B2 (en) * | 2002-06-24 | 2004-04-20 | Honeywell International, Inc. | Unitary pressure sensor housing and assembly |
| JP2004101515A (ja) | 2002-07-10 | 2004-04-02 | Texas Instruments Inc | 気密圧力変換器 |
| US6782758B2 (en) * | 2002-07-10 | 2004-08-31 | Texas Instruments Incorporated | Hermetic pressure transducer |
| US6823718B2 (en) * | 2002-10-28 | 2004-11-30 | Pti Technologies, Inc. | Single-body multiple sensing device |
| US6742395B1 (en) * | 2002-12-20 | 2004-06-01 | Texas Instruments Incorporated | Hermetic pressure transducer |
| US6866545B2 (en) * | 2003-03-10 | 2005-03-15 | Control Products, Inc., (Us) | Electrical cordset with integral signal conditioning circuitry |
| US6997059B2 (en) * | 2003-10-07 | 2006-02-14 | Cts Corporation | Pressure sensor |
| JP4301048B2 (ja) * | 2004-03-19 | 2009-07-22 | 株式会社デンソー | 圧力センサおよびその製造方法 |
| US7131334B2 (en) * | 2004-04-19 | 2006-11-07 | Celerity, Inc. | Pressure sensor device and method |
-
2004
- 2004-08-27 US US10/928,024 patent/US7270010B2/en not_active Expired - Fee Related
-
2005
- 2005-08-25 JP JP2007530136A patent/JP5091676B2/ja not_active Expired - Fee Related
- 2005-08-25 WO PCT/US2005/030297 patent/WO2006026376A1/en not_active Ceased
- 2005-08-25 CN CNB2005800286968A patent/CN100552401C/zh not_active Expired - Fee Related
- 2005-08-25 EP EP05791289.1A patent/EP1800098B1/en not_active Expired - Lifetime
- 2005-08-25 CA CA2576853A patent/CA2576853C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006026376A1 (en) | 2006-03-09 |
| CN100552401C (zh) | 2009-10-21 |
| JP5091676B2 (ja) | 2012-12-05 |
| CN101040176A (zh) | 2007-09-19 |
| CA2576853A1 (en) | 2006-03-09 |
| US20060042393A1 (en) | 2006-03-02 |
| EP1800098B1 (en) | 2015-08-12 |
| JP2008511833A (ja) | 2008-04-17 |
| US7270010B2 (en) | 2007-09-18 |
| EP1800098A1 (en) | 2007-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20200831 |