JP2008511833A5 - - Google Patents

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Publication number
JP2008511833A5
JP2008511833A5 JP2007530136A JP2007530136A JP2008511833A5 JP 2008511833 A5 JP2008511833 A5 JP 2008511833A5 JP 2007530136 A JP2007530136 A JP 2007530136A JP 2007530136 A JP2007530136 A JP 2007530136A JP 2008511833 A5 JP2008511833 A5 JP 2008511833A5
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JP
Japan
Prior art keywords
circuit board
board housing
measurement system
pressure measurement
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007530136A
Other languages
English (en)
Japanese (ja)
Other versions
JP5091676B2 (ja
JP2008511833A (ja
Filing date
Publication date
Priority claimed from US10/928,024 external-priority patent/US7270010B2/en
Application filed filed Critical
Publication of JP2008511833A publication Critical patent/JP2008511833A/ja
Publication of JP2008511833A5 publication Critical patent/JP2008511833A5/ja
Application granted granted Critical
Publication of JP5091676B2 publication Critical patent/JP5091676B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007530136A 2004-08-27 2005-08-25 圧力測定システムおよび回路基板ハウジング Expired - Fee Related JP5091676B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/928,024 US7270010B2 (en) 2004-08-27 2004-08-27 System and method for pressure measurement
US10/928,024 2004-08-27
PCT/US2005/030297 WO2006026376A1 (en) 2004-08-27 2005-08-25 System and method for pressure measurement

Publications (3)

Publication Number Publication Date
JP2008511833A JP2008511833A (ja) 2008-04-17
JP2008511833A5 true JP2008511833A5 (enExample) 2008-11-20
JP5091676B2 JP5091676B2 (ja) 2012-12-05

Family

ID=35427553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530136A Expired - Fee Related JP5091676B2 (ja) 2004-08-27 2005-08-25 圧力測定システムおよび回路基板ハウジング

Country Status (6)

Country Link
US (1) US7270010B2 (enExample)
EP (1) EP1800098B1 (enExample)
JP (1) JP5091676B2 (enExample)
CN (1) CN100552401C (enExample)
CA (1) CA2576853C (enExample)
WO (1) WO2006026376A1 (enExample)

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JP4203678B2 (ja) * 2006-12-07 2009-01-07 Smc株式会社 圧力スイッチ
JP4403559B2 (ja) * 2006-12-07 2010-01-27 Smc株式会社 圧力スイッチ
US7779701B2 (en) * 2008-06-02 2010-08-24 Sensata Technologies, Inc. Pressure sensor apparatus
JP5395412B2 (ja) * 2008-11-25 2014-01-22 パナソニック株式会社 インタポーザ
US9354132B2 (en) * 2009-02-12 2016-05-31 Continental Automotive Systems, Inc. Jointless pressure sensor port
US8156816B2 (en) * 2010-05-27 2012-04-17 Sensata Technologies, Inc. Pressure sensor
CN102323836A (zh) * 2011-05-10 2012-01-18 贵州航天电器股份有限公司 一种温度控制组件
US8459125B2 (en) * 2011-08-01 2013-06-11 Honeywell International Inc. Pressure sensor assembly
DE102012012527B4 (de) * 2012-06-26 2015-05-21 Krohne Analytics Gmbh Messvorrichtung zum Bestimmen einer Prozessgröße
US9746390B2 (en) * 2015-02-26 2017-08-29 Sensata Technologies, Inc. Microfused silicon strain gauge (MSG) pressure sensor package
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (en) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Method of manufacturing a pressure sensor
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10323998B2 (en) * 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
JP6793624B2 (ja) * 2017-11-13 2020-12-02 株式会社鷺宮製作所 圧力センサ
CN108168766B (zh) * 2018-01-09 2020-03-27 武汉飞恩微电子有限公司 一种重载压力传感器及其制造方法
DE102019119426A1 (de) * 2019-07-17 2021-01-21 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
CN112556919A (zh) * 2020-12-10 2021-03-26 龙微科技无锡有限公司 一种新型耐腐蚀压力传感器模块
DE102021122566A1 (de) * 2021-08-31 2023-03-02 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
EP4469769A2 (en) * 2022-03-17 2024-12-04 Sensata Technologies, Inc. Brake pedal with force sensor and membranes

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JPH0650271B2 (ja) * 1986-03-07 1994-06-29 太平洋工業株式会社 圧力検知装置
US5174014A (en) * 1990-07-27 1992-12-29 Data Instruments, Inc. Method of manufacturing pressure transducers
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JPH0821775A (ja) * 1994-07-08 1996-01-23 Fuji Koki Seisakusho:Kk 圧力センサ
JPH08105808A (ja) * 1994-10-05 1996-04-23 Mitsubishi Electric Corp 圧力センサ
JP3440629B2 (ja) 1995-04-25 2003-08-25 松下電工株式会社 圧力センサ
JPH10185735A (ja) * 1996-12-27 1998-07-14 Nagano Keiki Co Ltd 圧力センサモジュール
US5880372A (en) * 1997-01-10 1999-03-09 Integrated Sensor Solutions Media compatible pressure sensor device utilizing self-aligned components which fit together without the need for adhesives
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EP0995979B1 (de) 1998-10-23 2003-07-23 Endress + Hauser GmbH + Co. KG Druckaufnehmer
JP2000155062A (ja) * 1998-11-19 2000-06-06 Nippon Seiki Co Ltd 圧力検出器
DE19916087A1 (de) * 1999-04-09 2000-10-26 Lucas Ind Plc Anordnung zur Messung eines Fluiddrucks
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US6769308B1 (en) * 2000-09-22 2004-08-03 Delphi Technologies, Inc. Low-cost stainless steel pressure sensor assembly for a pneumatic valve
US6584851B2 (en) * 2000-11-30 2003-07-01 Nagano Keiki Co., Ltd. Fluid pressure sensor having a pressure port
JP3556165B2 (ja) * 2000-11-30 2004-08-18 長野計器株式会社 圧力センサ
JP4356238B2 (ja) * 2000-12-25 2009-11-04 株式会社デンソー 圧力センサ
US6907789B2 (en) * 2002-05-06 2005-06-21 Honeywell International Inc. Sensor package
US6722205B2 (en) * 2002-06-24 2004-04-20 Honeywell International, Inc. Unitary pressure sensor housing and assembly
JP2004101515A (ja) 2002-07-10 2004-04-02 Texas Instruments Inc 気密圧力変換器
US6782758B2 (en) * 2002-07-10 2004-08-31 Texas Instruments Incorporated Hermetic pressure transducer
US6823718B2 (en) * 2002-10-28 2004-11-30 Pti Technologies, Inc. Single-body multiple sensing device
US6742395B1 (en) * 2002-12-20 2004-06-01 Texas Instruments Incorporated Hermetic pressure transducer
US6866545B2 (en) * 2003-03-10 2005-03-15 Control Products, Inc., (Us) Electrical cordset with integral signal conditioning circuitry
US6997059B2 (en) * 2003-10-07 2006-02-14 Cts Corporation Pressure sensor
JP4301048B2 (ja) * 2004-03-19 2009-07-22 株式会社デンソー 圧力センサおよびその製造方法
US7131334B2 (en) * 2004-04-19 2006-11-07 Celerity, Inc. Pressure sensor device and method

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