JP5060988B2 - 温度検出回路 - Google Patents

温度検出回路 Download PDF

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Publication number
JP5060988B2
JP5060988B2 JP2008036433A JP2008036433A JP5060988B2 JP 5060988 B2 JP5060988 B2 JP 5060988B2 JP 2008036433 A JP2008036433 A JP 2008036433A JP 2008036433 A JP2008036433 A JP 2008036433A JP 5060988 B2 JP5060988 B2 JP 5060988B2
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Japan
Prior art keywords
circuit
temperature
temperature sensor
voltage
output
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Expired - Fee Related
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JP2008036433A
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English (en)
Japanese (ja)
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JP2009192507A5 (enExample
JP2009192507A (ja
Inventor
敦史 五十嵐
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Seiko Instruments Inc
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Seiko Instruments Inc
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Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP2008036433A priority Critical patent/JP5060988B2/ja
Priority to US12/378,190 priority patent/US7880528B2/en
Priority to CN200910118047.7A priority patent/CN101514925B/zh
Publication of JP2009192507A publication Critical patent/JP2009192507A/ja
Publication of JP2009192507A5 publication Critical patent/JP2009192507A5/ja
Application granted granted Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2008036433A 2008-02-18 2008-02-18 温度検出回路 Expired - Fee Related JP5060988B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008036433A JP5060988B2 (ja) 2008-02-18 2008-02-18 温度検出回路
US12/378,190 US7880528B2 (en) 2008-02-18 2009-02-11 Temperature detection circuit
CN200910118047.7A CN101514925B (zh) 2008-02-18 2009-02-18 温度检测电路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008036433A JP5060988B2 (ja) 2008-02-18 2008-02-18 温度検出回路

Publications (3)

Publication Number Publication Date
JP2009192507A JP2009192507A (ja) 2009-08-27
JP2009192507A5 JP2009192507A5 (enExample) 2011-01-27
JP5060988B2 true JP5060988B2 (ja) 2012-10-31

Family

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Family Applications (1)

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JP2008036433A Expired - Fee Related JP5060988B2 (ja) 2008-02-18 2008-02-18 温度検出回路

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US (1) US7880528B2 (enExample)
JP (1) JP5060988B2 (enExample)
CN (1) CN101514925B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160078273A (ko) * 2014-12-24 2016-07-04 에스아이아이 세미컨덕터 가부시키가이샤 과열 검출 회로 및 반도체 장치

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151458A (ja) * 2008-12-24 2010-07-08 Seiko Instruments Inc 温度検出回路
DE102009023354B3 (de) * 2009-05-29 2010-12-02 Austriamicrosystems Ag Schaltungsanordnung und Verfahren zur Temperaturmessung
JP5250501B2 (ja) * 2009-08-04 2013-07-31 ルネサスエレクトロニクス株式会社 温度検出回路
JP5389635B2 (ja) * 2009-12-25 2014-01-15 セイコーインスツル株式会社 温度検出システム
US8432214B2 (en) * 2011-03-21 2013-04-30 Freescale Semiconductor, Inc. Programmable temperature sensing circuit for an integrated circuit
JP5327258B2 (ja) * 2011-03-30 2013-10-30 ブラザー工業株式会社 インクジェット記録装置
US8896349B2 (en) * 2011-06-16 2014-11-25 Freescale Semiconductor, Inc. Low voltage detector
KR101276947B1 (ko) * 2011-06-27 2013-06-19 엘에스산전 주식회사 저전력, 고정밀, 넓은 온도범위의 온도 센서
JP5738141B2 (ja) * 2011-09-20 2015-06-17 ルネサスエレクトロニクス株式会社 半導体装置及び温度センサシステム
US9316542B2 (en) * 2012-09-27 2016-04-19 Freescale Semiconductor, Inc. Thermal sensor system and method based on current ratio
JP6168810B2 (ja) * 2013-03-27 2017-07-26 キヤノン株式会社 インクジェット記録装置、検出方法
US9035693B2 (en) * 2013-08-14 2015-05-19 Nanya Technology Corporation Temperature detecting apparatus, switch capacitor apparatus and voltage integrating circuit thereof
JP2015122635A (ja) * 2013-12-24 2015-07-02 三菱プレシジョン株式会社 増幅回路
JP6353689B2 (ja) * 2014-04-24 2018-07-04 エイブリック株式会社 過熱検出回路及び半導体装置
CN104132761B (zh) 2014-08-04 2016-01-27 中国矿业大学 多点煤岩体应力实时监测装置及方法
CN105987764A (zh) * 2015-02-04 2016-10-05 核工业北京地质研究院 一种快速测量井下测温探管
CN106468600B (zh) * 2015-08-19 2019-02-12 中芯国际集成电路制造(上海)有限公司 校正电路及装置、温度检测电路及方法、测试方法
JP6149953B1 (ja) * 2016-02-01 2017-06-21 オンキヨー株式会社 保護回路、及び、スイッチング電源
CN106525262A (zh) * 2016-10-13 2017-03-22 安徽万瑞冷电科技有限公司 一种二极管温度变送器及其变送方法
CN106502299B (zh) * 2016-12-20 2017-11-28 华通信安(北京)科技发展有限公司 一种温控调压电路
CN107066016B (zh) * 2017-05-25 2018-08-24 华通信安(北京)科技发展有限公司 一种温控调压电路
US11009404B2 (en) * 2017-09-28 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Capacitor-based temperature-sensing device
CN109375671A (zh) * 2018-10-17 2019-02-22 深圳市华星光电半导体显示技术有限公司 显示器及其感温调控模块
US11125629B2 (en) 2018-12-04 2021-09-21 Nxp Usa, Inc. Temperature detection circuitry
US10429879B1 (en) 2018-12-04 2019-10-01 Nxp Usa, Inc. Bandgap reference voltage circuitry
CN109710015B (zh) * 2018-12-29 2021-03-02 西安紫光国芯半导体有限公司 一种门延时稳定电路及方法
CN110968144B (zh) * 2019-11-25 2022-01-18 上海申矽凌微电子科技有限公司 基于温度传感器电路的模拟输出方法、系统、介质及设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139194B2 (ja) * 1993-02-17 2001-02-26 富士電機株式会社 半導体素子用温度検出回路装置
JPH0714340A (ja) * 1993-06-24 1995-01-17 Sony Corp データカートリッジ
JP4753531B2 (ja) * 2003-02-05 2011-08-24 株式会社リコー 半導体集積回路における温度検出回路
JP4219750B2 (ja) * 2003-06-26 2009-02-04 シャープ株式会社 Ｉｃチップの温度保護回路
US7193543B1 (en) * 2005-09-02 2007-03-20 Standard Microsystems Corporation Conversion clock randomization for EMI immunity in temperature sensors
DE102005045635B4 (de) * 2005-09-23 2007-06-14 Austriamicrosystems Ag Anordnung und Verfahren zur Bereitstellung eines temperaturabhängigen Signals
US7484886B2 (en) * 2006-05-03 2009-02-03 International Business Machines Corporation Bolometric on-chip temperature sensor
JP4836693B2 (ja) * 2006-07-06 2011-12-14 株式会社リコー 温度検出回路、温度検出回路を有する半導体装置及び温度検出方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160078273A (ko) * 2014-12-24 2016-07-04 에스아이아이 세미컨덕터 가부시키가이샤 과열 검출 회로 및 반도체 장치
KR102380617B1 (ko) * 2014-12-24 2022-03-30 에이블릭 가부시키가이샤 과열 검출 회로 및 반도체 장치

Also Published As

Publication number Publication date
CN101514925A (zh) 2009-08-26
CN101514925B (zh) 2014-03-05
US7880528B2 (en) 2011-02-01
US20090206912A1 (en) 2009-08-20
JP2009192507A (ja) 2009-08-27

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