JP5046253B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP5046253B2
JP5046253B2 JP2009500110A JP2009500110A JP5046253B2 JP 5046253 B2 JP5046253 B2 JP 5046253B2 JP 2009500110 A JP2009500110 A JP 2009500110A JP 2009500110 A JP2009500110 A JP 2009500110A JP 5046253 B2 JP5046253 B2 JP 5046253B2
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Japan
Prior art keywords
substrate
electronic component
mounting
holding
holding head
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Active
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JP2009500110A
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English (en)
Japanese (ja)
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JPWO2008102592A1 (ja
Inventor
圭剛 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009500110A priority Critical patent/JP5046253B2/ja
Publication of JPWO2008102592A1 publication Critical patent/JPWO2008102592A1/ja
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Publication of JP5046253B2 publication Critical patent/JP5046253B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
JP2009500110A 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法 Active JP5046253B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009500110A JP5046253B2 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007042332 2007-02-22
JP2007042332 2007-02-22
PCT/JP2008/050787 WO2008102592A1 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法
JP2009500110A JP5046253B2 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
JPWO2008102592A1 JPWO2008102592A1 (ja) 2010-05-27
JP5046253B2 true JP5046253B2 (ja) 2012-10-10

Family

ID=39709871

Family Applications (1)

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JP2009500110A Active JP5046253B2 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法

Country Status (4)

Country Link
JP (1) JP5046253B2 (zh)
CN (1) CN101578933B (zh)
TW (1) TWI451819B (zh)
WO (1) WO2008102592A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317615B2 (ja) * 2008-09-29 2013-10-16 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5173708B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5173709B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2010272754A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 部品実装装置及びその方法
US20120110841A1 (en) * 2009-07-09 2012-05-10 Panasonic Corporation Component mounting apparatus and method thereof
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP6767625B2 (ja) * 2016-11-04 2020-10-14 パナソニックＩｐマネジメント株式会社 部品搭載装置
JP7192620B2 (ja) * 2019-03-29 2022-12-20 新東工業株式会社 検査装置
JP7192621B2 (ja) * 2019-03-29 2022-12-20 新東工業株式会社 検査装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (ja) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2002093859A (ja) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp 部品実装装置およびその装置で用いられる部品受渡方法
JP2002305398A (ja) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp 部品実装装置および部品実装方法
JP2002314294A (ja) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp 部品実装装置およびその方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929937B2 (ja) * 1994-04-20 1999-08-03 松下電器産業株式会社 電子部品実装装置及び電子部品の実装方法
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
JP3176580B2 (ja) * 1998-04-09 2001-06-18 太陽誘電株式会社 電子部品の実装方法及び実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (ja) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2002093859A (ja) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp 部品実装装置およびその装置で用いられる部品受渡方法
JP2002305398A (ja) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp 部品実装装置および部品実装方法
JP2002314294A (ja) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp 部品実装装置およびその方法

Also Published As

Publication number Publication date
CN101578933B (zh) 2012-02-22
WO2008102592A1 (ja) 2008-08-28
TW200845840A (en) 2008-11-16
CN101578933A (zh) 2009-11-11
JPWO2008102592A1 (ja) 2010-05-27
TWI451819B (zh) 2014-09-01

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