WO2008102592A1 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
WO2008102592A1
WO2008102592A1 PCT/JP2008/050787 JP2008050787W WO2008102592A1 WO 2008102592 A1 WO2008102592 A1 WO 2008102592A1 JP 2008050787 W JP2008050787 W JP 2008050787W WO 2008102592 A1 WO2008102592 A1 WO 2008102592A1
Authority
WO
WIPO (PCT)
Prior art keywords
tcps
receiving
holding
mounting
punching
Prior art date
Application number
PCT/JP2008/050787
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Keigou Hirose
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN200880001513.7A priority Critical patent/CN101578933B/zh
Priority to JP2009500110A priority patent/JP5046253B2/ja
Priority to KR1020097013869A priority patent/KR101166058B1/ko
Publication of WO2008102592A1 publication Critical patent/WO2008102592A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
PCT/JP2008/050787 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法 WO2008102592A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880001513.7A CN101578933B (zh) 2007-02-22 2008-01-22 电子零件的安装装置及安装方法
JP2009500110A JP5046253B2 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法
KR1020097013869A KR101166058B1 (ko) 2007-02-22 2008-01-22 전자 부품의 실장 장치 및 실장 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-042332 2007-02-22
JP2007042332 2007-02-22

Publications (1)

Publication Number Publication Date
WO2008102592A1 true WO2008102592A1 (ja) 2008-08-28

Family

ID=39709871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050787 WO2008102592A1 (ja) 2007-02-22 2008-01-22 電子部品の実装装置及び実装方法

Country Status (4)

Country Link
JP (1) JP5046253B2 (zh)
CN (1) CN101578933B (zh)
TW (1) TWI451819B (zh)
WO (1) WO2008102592A1 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035582A1 (ja) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
WO2010035583A1 (ja) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2010080875A (ja) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp 打ち抜き装置、電子部品の実装装置及び実装方法
JP2010272754A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 部品実装装置及びその方法
WO2011016307A1 (ja) * 2009-08-07 2011-02-10 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2018074090A (ja) * 2016-11-04 2018-05-10 パナソニックＩｐマネジメント株式会社 部品搭載装置
EP3715887A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715886A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120110841A1 (en) * 2009-07-09 2012-05-10 Panasonic Corporation Component mounting apparatus and method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (ja) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2002093859A (ja) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp 部品実装装置およびその装置で用いられる部品受渡方法
JP2002305398A (ja) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp 部品実装装置および部品実装方法
JP2002314294A (ja) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp 部品実装装置およびその方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929937B2 (ja) * 1994-04-20 1999-08-03 松下電器産業株式会社 電子部品実装装置及び電子部品の実装方法
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
JP3176580B2 (ja) * 1998-04-09 2001-06-18 太陽誘電株式会社 電子部品の実装方法及び実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (ja) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2002093859A (ja) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp 部品実装装置およびその装置で用いられる部品受渡方法
JP2002305398A (ja) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp 部品実装装置および部品実装方法
JP2002314294A (ja) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp 部品実装装置およびその方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223896B1 (ko) * 2008-09-29 2013-01-17 시바우라 메카트로닉스 가부시끼가이샤 전자 부품 실장 장치 및 실장 방법
WO2010035582A1 (ja) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2010080875A (ja) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp 打ち抜き装置、電子部品の実装装置及び実装方法
JP2010080874A (ja) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2010080876A (ja) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
WO2010035583A1 (ja) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
CN102165858A (zh) * 2008-09-29 2011-08-24 芝浦机械电子株式会社 电子部件的安装装置及安装方法
TWI462664B (zh) * 2008-09-29 2014-11-21 Shibaura Mechatronics Corp Installation and installation method of electronic parts (1)
JP2010272754A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 部品実装装置及びその方法
WO2011016307A1 (ja) * 2009-08-07 2011-02-10 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
CN102473652A (zh) * 2009-08-07 2012-05-23 芝浦机械电子株式会社 电子部件的安装装置及安装方法
JP2018074090A (ja) * 2016-11-04 2018-05-10 パナソニックＩｐマネジメント株式会社 部品搭載装置
EP3715887A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715886A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device

Also Published As

Publication number Publication date
CN101578933B (zh) 2012-02-22
JP5046253B2 (ja) 2012-10-10
TW200845840A (en) 2008-11-16
CN101578933A (zh) 2009-11-11
JPWO2008102592A1 (ja) 2010-05-27
TWI451819B (zh) 2014-09-01

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