WO2009069672A1 - スパッタ装置及び成膜方法 - Google Patents

スパッタ装置及び成膜方法 Download PDF

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Publication number
WO2009069672A1
WO2009069672A1 PCT/JP2008/071474 JP2008071474W WO2009069672A1 WO 2009069672 A1 WO2009069672 A1 WO 2009069672A1 JP 2008071474 W JP2008071474 W JP 2008071474W WO 2009069672 A1 WO2009069672 A1 WO 2009069672A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
sputtering apparatus
magnetic
applying means
filming method
Prior art date
Application number
PCT/JP2008/071474
Other languages
English (en)
French (fr)
Inventor
Yukio Kikuchi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to KR1020107011295A priority Critical patent/KR101706192B1/ko
Priority to CN2008801173212A priority patent/CN101868561B/zh
Priority to US12/744,528 priority patent/US20100258430A1/en
Priority to JP2009543834A priority patent/JP5301458B2/ja
Publication of WO2009069672A1 publication Critical patent/WO2009069672A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/351—Sputtering by application of a magnetic field, e.g. magnetron sputtering using a magnetic field in close vicinity to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　基板の表面に成膜処理を行うスパッタ装置であって、前記基板が載置されるテーブルと；このテーブルに載置された前記基板の法線に対して中心軸が傾斜するように配置された複数のターゲットと；前記各ターゲットと前記基板との間に、前記基板の周囲を取り囲むように設けられた複数の磁場印加手段と；を備え、これら磁場印加手段は、前記基板の周縁部分の上方に、前記基板の表面と平行な水平磁場成分を有する磁場を発生させる。
PCT/JP2008/071474 2007-11-28 2008-11-26 スパッタ装置及び成膜方法 WO2009069672A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107011295A KR101706192B1 (ko) 2007-11-28 2008-11-26 스퍼터 장치 및 성막방법
CN2008801173212A CN101868561B (zh) 2007-11-28 2008-11-26 溅射装置以及成膜方法
US12/744,528 US20100258430A1 (en) 2007-11-28 2008-11-26 Sputtering apparatus and film forming method
JP2009543834A JP5301458B2 (ja) 2007-11-28 2008-11-26 スパッタ装置及び成膜方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-307817 2007-11-28
JP2007307817 2007-11-28

Publications (1)

Publication Number Publication Date
WO2009069672A1 true WO2009069672A1 (ja) 2009-06-04

Family

ID=40678565

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071474 WO2009069672A1 (ja) 2007-11-28 2008-11-26 スパッタ装置及び成膜方法

Country Status (6)

Country Link
US (1) US20100258430A1 (ja)
JP (1) JP5301458B2 (ja)
KR (1) KR101706192B1 (ja)
CN (1) CN101868561B (ja)
TW (1) TWI391513B (ja)
WO (1) WO2009069672A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471878A (zh) * 2009-07-17 2012-05-23 株式会社爱发科 成膜装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120000317A (ko) * 2010-06-25 2012-01-02 고려대학교 산학협력단 전자 물질막 형성 장치
KR101786868B1 (ko) * 2010-12-28 2017-10-18 캐논 아네르바 가부시키가이샤 제조방법
US20120285819A1 (en) * 2011-05-09 2012-11-15 Intermolecular, Inc. Combinatorial and Full Substrate Sputter Deposition Tool and Method
US20130146451A1 (en) * 2011-12-07 2013-06-13 Intermolecular, Inc. Magnetic Confinement and Directionally Driven Ionized Sputtered Films For Combinatorial Processing
CN103849843B (zh) * 2014-01-17 2016-05-18 中国科学院上海技术物理研究所 一种具有五靶头的磁控共溅射设备
KR102450392B1 (ko) * 2015-11-26 2022-10-04 삼성디스플레이 주식회사 스퍼터링 장치
CN109972104B (zh) * 2019-03-05 2020-01-10 北京科技大学 一种弥补Co靶材质量缺陷的方法
CN110438462A (zh) * 2019-07-24 2019-11-12 中山大学 一种改善氧化物半导体成膜质量的磁控溅射装置
CN111155067A (zh) * 2020-02-19 2020-05-15 三河市衡岳真空设备有限公司 一种磁控溅射设备
CN115981101B (zh) * 2023-03-17 2023-06-16 湖北江城芯片中试服务有限公司 半导体结构的制造方法及半导体结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338912A (ja) * 2000-05-29 2001-12-07 Tokyo Electron Ltd プラズマ処理装置および処理方法
JP2006080116A (ja) * 2004-09-07 2006-03-23 Canon Anelva Corp 磁気抵抗効果素子およびその製造方法
WO2006077837A1 (ja) * 2005-01-19 2006-07-27 Ulvac, Inc. スパッタ装置および成膜方法

Family Cites Families (12)

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US5178739A (en) * 1990-10-31 1993-01-12 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
JP2555004B2 (ja) * 1993-12-30 1996-11-20 アネルバ株式会社 スパッタリング装置
JPH0835064A (ja) * 1994-07-20 1996-02-06 Matsushita Electric Ind Co Ltd スパッタリング装置
JPH111770A (ja) * 1997-06-06 1999-01-06 Anelva Corp スパッタリング装置及びスパッタリング方法
US6254745B1 (en) * 1999-02-19 2001-07-03 Tokyo Electron Limited Ionized physical vapor deposition method and apparatus with magnetic bucket and concentric plasma and material source
JP2000313958A (ja) 1999-04-28 2000-11-14 Canon Inc 薄膜形成装置及び薄膜形成方法
US6899795B1 (en) * 2000-01-18 2005-05-31 Unaxis Balzers Aktiengesellschaft Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers
JP2001319314A (ja) * 2000-02-29 2001-11-16 Hitachi Ltd 磁気記録媒体とその製法およびそれを用いた磁気記録装置
US20020144903A1 (en) * 2001-02-09 2002-10-10 Plasmion Corporation Focused magnetron sputtering system
US20040112544A1 (en) * 2002-12-16 2004-06-17 Hongwen Yan Magnetic mirror for preventing wafer edge damage during dry etching
JPWO2006049022A1 (ja) * 2004-11-04 2008-05-29 旭硝子株式会社 イオンビームスパッタリング装置およびｅｕｖリソグラフィ用反射型マスクブランクの多層膜の成膜方法
DE102006028977B4 (de) * 2006-06-23 2012-04-12 Qimonda Ag Sputterdepositions-Vorrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338912A (ja) * 2000-05-29 2001-12-07 Tokyo Electron Ltd プラズマ処理装置および処理方法
JP2006080116A (ja) * 2004-09-07 2006-03-23 Canon Anelva Corp 磁気抵抗効果素子およびその製造方法
WO2006077837A1 (ja) * 2005-01-19 2006-07-27 Ulvac, Inc. スパッタ装置および成膜方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471878A (zh) * 2009-07-17 2012-05-23 株式会社爱发科 成膜装置
US9005413B2 (en) 2009-07-17 2015-04-14 Ulvac, Inc. Film formation apparatus

Also Published As

Publication number Publication date
JPWO2009069672A1 (ja) 2011-04-14
JP5301458B2 (ja) 2013-09-25
TWI391513B (zh) 2013-04-01
KR101706192B1 (ko) 2017-02-13
CN101868561A (zh) 2010-10-20
KR20100094473A (ko) 2010-08-26
US20100258430A1 (en) 2010-10-14
CN101868561B (zh) 2013-01-30
TW200940734A (en) 2009-10-01

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