JP5030624B2 - 回転式電極子装置 - Google Patents
回転式電極子装置 Download PDFInfo
- Publication number
- JP5030624B2 JP5030624B2 JP2007063102A JP2007063102A JP5030624B2 JP 5030624 B2 JP5030624 B2 JP 5030624B2 JP 2007063102 A JP2007063102 A JP 2007063102A JP 2007063102 A JP2007063102 A JP 2007063102A JP 5030624 B2 JP5030624 B2 JP 5030624B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- chip
- type electronic
- electronic component
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007063102A JP5030624B2 (ja) | 2007-03-13 | 2007-03-13 | 回転式電極子装置 |
TW096111893A TWI404934B (zh) | 2007-03-13 | 2007-04-03 | Rotary electrode subassembly |
CN2007101010481A CN101266272B (zh) | 2007-03-13 | 2007-04-26 | 旋转式电极头装置 |
KR1020070041203A KR101345697B1 (ko) | 2007-03-13 | 2007-04-27 | 회전식 전극부재장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007063102A JP5030624B2 (ja) | 2007-03-13 | 2007-03-13 | 回転式電極子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008224418A JP2008224418A (ja) | 2008-09-25 |
JP5030624B2 true JP5030624B2 (ja) | 2012-09-19 |
Family
ID=39843225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007063102A Active JP5030624B2 (ja) | 2007-03-13 | 2007-03-13 | 回転式電極子装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5030624B2 (zh) |
KR (1) | KR101345697B1 (zh) |
CN (1) | CN101266272B (zh) |
TW (1) | TWI404934B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101451499B1 (ko) * | 2013-02-07 | 2014-10-17 | 삼성전기주식회사 | 전자부품 검사장치 |
JP6459882B2 (ja) * | 2015-10-06 | 2019-01-30 | 株式会社村田製作所 | 通電装置 |
JP6727651B2 (ja) * | 2016-09-30 | 2020-07-22 | 株式会社ヒューモラボラトリー | チップ電子部品の電気特性の連続的な検査方法 |
JP6679552B2 (ja) | 2017-10-02 | 2020-04-15 | 株式会社ヒューモラボラトリー | チップ電子部品の検査選別方法 |
KR102247261B1 (ko) * | 2020-12-15 | 2021-04-30 | 김상길 | 내마모성 및 윤활성능이 개선된 전자부품 검사용 회전접촉롤러, 이를 포함하는 프로브 조립체 및 전자부품 검사장치 |
TWI800405B (zh) * | 2022-06-14 | 2023-04-21 | 國巨股份有限公司 | 測試探針與測試探針固定裝置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63118672A (ja) * | 1986-11-06 | 1988-05-23 | Murata Mfg Co Ltd | チツプ状電子部品の電気特性測定装置 |
EP1085327B1 (en) * | 1999-09-15 | 2006-06-07 | Capres A/S | Multi-point probe |
US6194979B1 (en) * | 1999-03-18 | 2001-02-27 | Cts Corporation | Ball grid array R-C network with high density |
KR100350513B1 (ko) * | 2000-04-03 | 2002-08-28 | 박태욱 | 피디피 전극 검사 프로브장치 |
CN100353171C (zh) * | 2004-12-23 | 2007-12-05 | 中国科学院半导体研究所 | 用于电调制光致发光光谱测量的样品架 |
JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
JP2006214727A (ja) * | 2005-02-01 | 2006-08-17 | Fuchigami Micro:Kk | コンタクトプローブカード |
CN100445709C (zh) * | 2005-03-07 | 2008-12-24 | 大赢数控设备(深圳)有限公司 | 发光二极管测试机台的自动化装置 |
-
2007
- 2007-03-13 JP JP2007063102A patent/JP5030624B2/ja active Active
- 2007-04-03 TW TW096111893A patent/TWI404934B/zh active
- 2007-04-26 CN CN2007101010481A patent/CN101266272B/zh active Active
- 2007-04-27 KR KR1020070041203A patent/KR101345697B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW200837354A (en) | 2008-09-16 |
KR101345697B1 (ko) | 2013-12-30 |
KR20080084517A (ko) | 2008-09-19 |
CN101266272B (zh) | 2012-11-07 |
CN101266272A (zh) | 2008-09-17 |
JP2008224418A (ja) | 2008-09-25 |
TWI404934B (zh) | 2013-08-11 |
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