JP5030624B2 - Rotary electrode device - Google Patents

Rotary electrode device Download PDF

Info

Publication number
JP5030624B2
JP5030624B2 JP2007063102A JP2007063102A JP5030624B2 JP 5030624 B2 JP5030624 B2 JP 5030624B2 JP 2007063102 A JP2007063102 A JP 2007063102A JP 2007063102 A JP2007063102 A JP 2007063102A JP 5030624 B2 JP5030624 B2 JP 5030624B2
Authority
JP
Japan
Prior art keywords
electrode
chip
type electronic
electronic component
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007063102A
Other languages
Japanese (ja)
Other versions
JP2008224418A (en
Inventor
規与仁 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Humo Laboratory Ltd
Original Assignee
Humo Laboratory Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Humo Laboratory Ltd filed Critical Humo Laboratory Ltd
Priority to JP2007063102A priority Critical patent/JP5030624B2/en
Priority to TW096111893A priority patent/TWI404934B/en
Priority to CN2007101010481A priority patent/CN101266272B/en
Priority to KR1020070041203A priority patent/KR101345697B1/en
Publication of JP2008224418A publication Critical patent/JP2008224418A/en
Application granted granted Critical
Publication of JP5030624B2 publication Critical patent/JP5030624B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Description

本発明は、チップ形電子部品の電気特性を検査する装置等において、チップ形電子部品の端面電極に接触させて電気特性を検査するための電極子の形状等に改良を施した回転式電極子装置に関する。   The present invention relates to a rotary electrode having an improved shape or the like for an electrode for inspecting electrical characteristics by contacting an end face electrode of the chip-type electronic component in an apparatus for inspecting electrical characteristics of the chip-type electronic component Relates to the device.

従来、チップ形電子部品の電気特性を検査する装置において、チップ形電子部品の端面電極に接触させて電気特性を検査するための電極子の形状は、ローラ形の電極子が一般的に使用されている。
特開２００６−１９４８３１号公報 2. Description of the Related Art Conventionally, in an apparatus for inspecting electrical characteristics of a chip-type electronic component, a roller-type electrode is generally used as an electrode for inspecting electrical characteristics by contacting an end face electrode of the chip-type electronic component. ing.
JP 2006-194831 A

従来、セラミックコンデンサに代表されるチップ形電子部品を連続して大量に検査する装置ではローラ形電極子が用いられている。この一般的に使用されているローラ形電極子の使用にあたり、チップ形電子部品の電気特性を検査する装置によって次々に送られてくるチップ形電子部品の端面電極にローラ形の電極子が接触する時あるいは接触が解除される時に、チップ形電子部品の端面電極の表面に擦った跡が付いて外観不良となってしまうという問題があった。   2. Description of the Related Art Conventionally, a roller-type electrode is used in an apparatus that continuously inspects a large amount of chip-type electronic components represented by a ceramic capacitor. In using the roller-type electrode that is generally used, the roller-type electrode contacts the end surface electrode of the chip-type electronic component that is successively sent by the device for inspecting the electrical characteristics of the chip-type electronic component. When the contact is released or when the contact is released, there is a problem that the surface of the end face electrode of the chip-type electronic component is rubbed and the appearance is deteriorated.

前記の問題点を図７，８および９を参照して説明をする。
図７は、一般的に使用されているローラ形電極子ユニット２０の外形図であり、図８は、図７中に示すＢ−Ｂ断面を矢印方向に見た装置の断面図である。
図７および８により、ローラ形電極子ユニット２０の機構を説明する。
チップ形電子部品の端面電極と接触する検査用の電極子２３の形状は円筒形のローラとなっている。電極子２３の中心部には回転用軸２４が挿入されていて、電極子２３は回転用軸２４を回転軸として軽い回転力で回転できるようになっている。さらに、電極子２３は回転用軸２４を介して電極子ホルダ２５に取り付けられていて、電極子ホルダ２５は揺動支点２６を介して絶縁材製のケース２１に組み込まれている。そして、電極子ホルダ２５は揺動支点２６を支点としてばね２７によって復帰力を持った揺動運動ができる構造となっている。また、前記揺動運動を阻害しない柔らかな素材の接続ケーブル２８の両端は電極子ホルダ２５と接続端子２２に、半田付けされて電気的に結線されている。 The above problem will be described with reference to FIGS.
FIG. 7 is an outline view of a roller-type electrode unit 20 that is generally used, and FIG. 8 is a cross-sectional view of the apparatus when the BB cross section shown in FIG. 7 is viewed in the direction of the arrow.
The mechanism of the roller electrode unit 20 will be described with reference to FIGS.
The shape of the electrode 23 for inspection which comes into contact with the end face electrode of the chip-type electronic component is a cylindrical roller. A rotation shaft 24 is inserted into the center of the electrode 23, and the electrode 23 can be rotated with a light rotational force with the rotation shaft 24 as a rotation axis. Further, the electrode element 23 is attached to an electrode element holder 25 via a rotating shaft 24, and the electrode element holder 25 is incorporated into a case 21 made of an insulating material via a swing fulcrum 26. The electrode holder 25 has a structure capable of swinging with a return force by a spring 27 with the swinging fulcrum 26 as a fulcrum. Further, both ends of the connection cable 28 made of a soft material that does not hinder the swinging motion are soldered and electrically connected to the electrode holder 25 and the connection terminal 22.

前述の一般的に使用されているローラ形電極子ユニット２０を、後述の図１および２に示す装置の角穴４２の符号ｈ〜ｎの各位置に設置する。
ロータ４１の角穴４２内に収容されているチップ形電子部品４０（図９参照）は、電極子２３を確実にチップ形電子部品４０の電極に接触させるためにロータ４１の表面から０．３ｍｍ〜０．４ｍｍ突出するようにしてある。
ローラ形電極子ユニット２０を電極子２３がチップ形電子部品４０の端面電極に接触する時にその当たりを軽減させるために前記接触を維持できる限界の位置に設置したとしても、チップ形電子部品４０の端面電極に電極子２３が接触する時あるいは接触が解除される時に、チップ形電子部品４０の端面電極の表面に擦った跡が付いて外観不良となってしまうという問題がある。 The roller electrode unit 20 which is generally used as described above is installed at each of the positions h to n of the square hole 42 of the apparatus shown in FIGS.
The chip-type electronic component 40 (see FIG. 9) accommodated in the square hole 42 of the rotor 41 is 0.3 mm from the surface of the rotor 41 in order to ensure that the electrode element 23 contacts the electrode of the chip-type electronic component 40. It protrudes by ~ 0.4 mm.
Even if the roller-type electrode unit 20 is installed at a limit position where the contact can be maintained in order to reduce the contact when the electrode 23 comes into contact with the end face electrode of the chip-type electronic component 40, the chip-type electronic component 40 There is a problem in that when the electrode 23 comes into contact with the end face electrode or when the contact is released, the surface of the end face electrode of the chip-type electronic component 40 is rubbed, resulting in poor appearance.

この問題点発生の状況を図９により説明する。図９の（ａ）は、ロータ４１の角穴４２に収容されたチップ形電子部品４０がロータ４１の間欠搬送によって送られてきて、電極子２３に接触し始めから少し送られた状態を示している。電極子２３はチップ形電子部品４０の端面電極に接触する前では回転が止まっている状態であり、接触すると端面電極との摩擦抵抗により電極子２３は回転を始める。ロータ４１の角穴４２の寸法はチップ形電子部品４０の外形寸法よりも０．１ｍｍ〜０．２ｍｍ程度大きく加工されているので、前記の摩擦によりチップ形電子部品４０は図に示すように角穴４２の中で姿勢が傾いてしまう。この時の姿勢変化の過程でチップ形電子部品４０の端面電極の表面には外観不良となる擦り跡が発生する。   The situation of occurrence of this problem will be described with reference to FIG. FIG. 9A shows a state in which the chip-type electronic component 40 accommodated in the square hole 42 of the rotor 41 is sent by intermittent conveyance of the rotor 41 and is sent a little from the beginning of contact with the electrode 23. ing. The electrode 23 is in a state where the rotation is stopped before contacting the end face electrode of the chip-type electronic component 40. When the contact is made, the electrode 23 starts rotating due to frictional resistance with the end face electrode. Since the size of the square hole 42 of the rotor 41 is about 0.1 mm to 0.2 mm larger than the outer size of the chip-type electronic component 40, the chip-type electronic component 40 is square as shown in the figure by the friction. The posture is inclined in the hole 42. In the course of the posture change at this time, a rubbing mark that causes an appearance defect is generated on the surface of the end face electrode of the chip-type electronic component 40.

図９の（ｂ）は、同図（ａ）の状態からロータ４１がさらに動いて間欠搬送の動作が停止した状態を示す図である。図に示すようにチップ形電子部品４０は角穴４２の左端に寄った位置で停止している。
図９の（ｃ）は、同図（ｂ）の状態からロータ４１の間欠搬送の動作が開始してチップ形電子部品４０が電極子２３との接触から解放されるまでの状態を示している。接触が解放される直前までは、電極子２３はチップ形電子部品４０の移動に伴って端面電極表面を回転していくので問題は発生しない。しかし、接触が解放される直前には、電極子２３の回転によりチップ形電子部品４０は蹴られる形になるために（ｃ）に示されている姿勢図に示すようにチップ形電子部品４０は角穴４２の中で姿勢が傾いてしまう。
これらの接触または離脱の態様が原因でチップ形電子部品４０の端面電極の表面には外観不良となる擦り跡が発生してしまう。
本発明の目的は、前記の問題点を解決し、より確実な接触状態を形成するとともに、チップ形電子部品の端面電極の表面に外観不良となるような跡を残さない回転式電極子装置を提供することにある。 FIG. 9B is a diagram showing a state where the rotor 41 further moves from the state of FIG. As shown in the figure, the chip-type electronic component 40 stops at a position near the left end of the square hole 42.
FIG. 9C shows a state from the state shown in FIG. 9B until the chip 41 electronic component 40 is released from contact with the electrode element 23 after the operation of intermittent conveyance of the rotor 41 is started. . Until the contact is released, the electrode 23 rotates on the surface of the end face electrode as the chip-type electronic component 40 moves, so that no problem occurs. However, immediately before the contact is released, the chip-type electronic component 40 is kicked by the rotation of the electrode 23, so that the chip-type electronic component 40 is in the posture shown in FIG. The posture is inclined in the square hole 42.
Due to these contact or separation modes, the surface of the end surface electrode of the chip-type electronic component 40 has a rubbing mark that causes an appearance defect.
SUMMARY OF THE INVENTION An object of the present invention is to provide a rotary electrode device that solves the above-mentioned problems, forms a more reliable contact state, and does not leave a mark that causes an appearance defect on the surface of an end face electrode of a chip-type electronic component. It is to provide.

前記問題を解決するために、本発明による請求項１，２記載の発明を実施の形態と関連して説明する。
本発明による請求項１記載の回転式電極子装置は、
搬送体の穴にチップ形電子部品の端面電極を突出するように収容して搬送中に、前記端面電極に接触させられる電極子をもつ回転式電極子装置であって、
円筒形電極子（４）と、
前記円筒形電極子（４）の回転中心軸を前記チップ形電子部品（４０）の移動方向に略直交する方向とし、前記円筒形電極子（４）が前記チップ形電子部品（４０）方向に付勢されるように支持する支持手段と、
前記円筒形電極子（４）の回転速度が前記チップ形電子部品（４０）の端面電極が前記円筒形電極子（４）に接触する時の速度と同じ速度に維持する従動手段と、
を具備し、
前記従動手段は、前記円筒形電極子（４）の外周に設けられ、前記搬送体に接触従動回転する弾性体のリング（６）を含むことを特徴とする。なお前記付勢力は、ばね（９）で付与される。 In order to solve the problem, the inventions according to claims 1 and 2 according to the present invention will be described in relation to the embodiments.
The rotary electrode device according to claim 1 according to the present invention comprises:
A rotary electrode device having an electrode that is brought into contact with the end face electrode during transport by accommodating the end face electrode of the chip-type electronic component so as to protrude into the hole of the transport body ,
A circular cylindrical Denkyokuko (4),
The center axis of rotation of the cylindrical electrode element (4) is set to a direction substantially orthogonal to the moving direction of the chip-type electronic component (40), and the cylindrical electrode element (4) is directed to the chip-type electronic component (40) direction. A support means for supporting to be biased ;
A driven means for rotating speed before Symbol cylindrical Denkyokuko (4) is maintained at the same speed as the speed at which the end face electrodes of the chip-type electronic part (40) is in contact with said cylindrical Denkyokuko (4),
Equipped with,
The driven means includes an elastic ring (6) provided on the outer periphery of the cylindrical electrode (4) and rotating in contact with the carrier. The urging force is applied by a spring (9).

本発明による請求項２記載の回転式電極子装置は、請求項１記載の回転式電極子装置において、
前記搬送体は、チップ形電子部品特性検査分類装置のベルトあるいは回転円盤（ロータ４１）であり、
前記円筒形電極子（４）の外周に装着された弾性体のリング（６）は、前記チップ形電子部品（４０）を収容して搬送するためのベルトあるいは回転円盤（ロータ４１）に接触従動回転することを特徴とする。 The rotary electrode device according to claim 2 according to the present invention is the rotary electrode device according to claim 1 ,
The carrier is a belt or a rotating disk (rotor 41) of a chip-type electronic component characteristic inspection and classification device,
The elastic ring (6) mounted on the outer periphery of the cylindrical electrode (4) is in contact with a belt or rotating disk (rotor 41) for accommodating and transporting the chip-type electronic component (40). It is characterized by rotating.

本発明による回転式電極子装置は、前述のように構成されているから、電極の接触をより確実にし、チップ形電子部品の端面電極の表面に外観不良となるような跡を残さない電極子装置とすることができる。   Since the rotary electrode device according to the present invention is configured as described above, the electrode device further ensures the contact of the electrodes and does not leave a trace that causes the appearance defect on the surface of the end surface electrode of the chip-type electronic component. It can be a device.

以下図面等を参照して本発明による回転式電極子装置の実施の形態を説明する。
図１は、本発明による回転式電極子装置の実施例で使用するチップ形電子部品の電気特性を検査する装置におけるチップ形電子部品搬送用の円盤状のロータを示す平面図、図２は図１中に示すＸ−Ｘ断面を矢印方向に見た装置の断面図である。 Embodiments of a rotary electrode device according to the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a disk-shaped rotor for conveying chip-type electronic components in an apparatus for inspecting electrical characteristics of chip-type electronic components used in an embodiment of a rotary electrode device according to the present invention, and FIG. It is sectional drawing of the apparatus which looked at the XX cross section shown in 1 in the arrow direction.

チップ形電子部品の搬送用として円盤状のロータ４１を用いている。ロータ４１には、同一円上に円を２４等分した位置に２４個の角穴４２を設けている。図中には、機能説明用として角穴４２の各位置に符号ａ〜ｘを付記してある。
角穴４２の符号ａの位置で、チップ形電子部品が一個づつ角穴４２に、供給手段（図示せず）によって供給される。この供給がスムーズに行われるように、角穴４２の寸法はチップ形電子部品の外形寸法よりも０．１ｍｍ〜０．２ｍｍ程度大きく加工されている。
角穴４２の符号ｈ〜ｎの各位置には、本発明の検査用電極子が設置されていて、チップ形電子部品の電気特性を検査する。さらに、角穴４２の符号ｏ〜ｗの各位置には、前記電気特性の検査結果に基づきチップ形電子部品を指定の収納箱に分類するための機能部品（図中では省略）が設置されている。ロータ４１は、ボス５３を介してモータ５４に固定されている。モータ５４は、制御指令によりロータ４１を角穴４２の一個分だけ送る間欠搬送を行う。ロータ４１の下面には、ベース板５５に固定された部品搬送用の基準台５０が設置されている。ロータ４１の角穴４２に入ったチップ形電子部品は、部品搬送用の基準台５０の表面を滑りながらロータ４１によって搬送されていく。部品搬送用の基準台５０の角穴４２の位置を示す符号ｈ〜ｎの位置には、チップ形電子部品の電気特性を検査するための下部電極子５１（図２参照）が絶縁ブッシュ５２を介して設置されている。 A disk-shaped rotor 41 is used for conveying chip-type electronic components. The rotor 41 is provided with 24 square holes 42 at positions obtained by dividing the circle into 24 equal parts on the same circle. In the drawing, symbols a to x are added to each position of the square hole 42 for function explanation.
Chip-type electronic components are supplied to the square holes 42 one by one by a supply means (not shown) at the position of the symbol a of the square holes 42. In order to perform this supply smoothly, the size of the square hole 42 is processed to be about 0.1 mm to 0.2 mm larger than the external size of the chip-type electronic component.
An inspection electrode of the present invention is installed at each position of the square holes 42 with reference numerals h to n to inspect the electrical characteristics of the chip-type electronic component. Furthermore, functional parts (not shown in the figure) for classifying the chip-type electronic parts into designated storage boxes based on the inspection results of the electrical characteristics are installed at positions o to w of the square holes 42. Yes. The rotor 41 is fixed to the motor 54 via the boss 53. The motor 54 performs intermittent conveyance for sending the rotor 41 by one square hole 42 in accordance with a control command. On the lower surface of the rotor 41, a reference table 50 for parts conveyance fixed to the base plate 55 is installed. The chip-type electronic component that has entered the square hole 42 of the rotor 41 is conveyed by the rotor 41 while sliding on the surface of the reference table 50 for component conveyance. A lower electrode 51 (see FIG. 2) for inspecting electrical characteristics of the chip-type electronic component has an insulating bush 52 at a position indicated by symbols h to n indicating the position of the square hole 42 of the reference table 50 for component conveyance. Installed.

本発明の請求項１、２および３に対応した回転式電極子装置の実施例を図３，４，５および６を参照して説明する。
図３は、回転式電極子ユニット１の全体図であり、図中に示すＡ−Ａ断面を矢印方向に見た図を図４に示す。図５は、電極子４の部分を詳細に拡大した断面図を示し、電極子４にチップ形電子部品４０を接触させる位置を示している。図３，４および５により回転式電極子ユニット１の機構を説明する。 Embodiments of the rotary electrode device corresponding to claims 1, 2 and 3 of the present invention will be described with reference to FIGS.
FIG. 3 is an overall view of the rotary electrode unit 1, and FIG. 4 shows a view of the AA cross section shown in the figure in the direction of the arrow. FIG. 5 shows a cross-sectional view in which a portion of the electrode 4 is enlarged in detail, and shows a position where the chip-type electronic component 40 is brought into contact with the electrode 4. The mechanism of the rotary electrode unit 1 will be described with reference to FIGS.

図３に示すように、電極子４は円筒形状となっており、該円筒中心部には回転用軸５が挿入されていて、電極子４は回転用軸５を回転中心として自由に回転できるようになっている。なおこの回転中心軸方向は、チップ形電子部品４０の移動方向に直交する方向である。さらに図５に示すように電極子４には溝加工がなされていて、前記溝には弾性体リング６が装着されていて、弾性体リング６の外径は電極子４の外径よりも１．４ｍｍ大きい。また、弾性体リング６の材質は柔らかいものが好ましい。弾性体リング６に回転力を加えることにより、電極子４は自由に回転することができる構造になっている。回転用軸５は電極子ホルダ７にねじ止め固定されている。また、図５では電極子４のどの箇所にチップ形電子部品４０を接触させるかを示している。   As shown in FIG. 3, the electrode 4 has a cylindrical shape, and a rotation shaft 5 is inserted in the center of the cylinder, and the electrode 4 can freely rotate about the rotation shaft 5 as a rotation center. It is like that. Note that this rotation center axis direction is a direction orthogonal to the moving direction of the chip-type electronic component 40. Further, as shown in FIG. 5, the electrode element 4 is grooved, and an elastic ring 6 is attached to the groove. The outer diameter of the elastic ring 6 is 1 than the outer diameter of the electrode element 4. .4mm larger. The material of the elastic ring 6 is preferably soft. By applying a rotational force to the elastic ring 6, the electrode 4 has a structure that can freely rotate. The rotating shaft 5 is fixed to the electrode holder 7 with screws. FIG. 5 shows to which part of the electrode 4 the chip-type electronic component 40 is brought into contact.

さらに、図４に示すように、電極子ホルダ７は揺動支点８を介して絶縁材製のケース２に組み込まれている。電極子ホルダ７は揺動支点８を支点としてばね９によって復元力を持った揺動運動ができる構造となっている。また、前記揺動運動を阻害しない柔らかな素材の接続ケーブル１０の両端は電極子ホルダ７と接続端子３に半田付けされていて電気的に結線された構造となっている。   Further, as shown in FIG. 4, the electrode holder 7 is incorporated in the case 2 made of an insulating material via the swing fulcrum 8. The electrode holder 7 has a structure capable of swinging motion with a restoring force by a spring 9 with the swinging fulcrum 8 as a fulcrum. Further, both ends of the connection cable 10 made of a soft material that does not hinder the swinging motion are soldered to the electrode holder 7 and the connection terminal 3 so as to be electrically connected.

次に、本発明の回転式電極子ユニット１の電極子４にチップ形電子部品４０が接触していく状態を図６で説明する。
回転式電極子ユニット１は弾性体リング６が０．５ｍｍ〜０．６ｍｍ変形するようにロータ４１の表面に押し当てられて設置されている。このように設置すると、前述のように弾性体リング６の外径は電極子４の外径よりも１．４ｍｍ大きいので、電極子４とロータ４１の表面との間隙は０．１ｍｍ〜０．２ｍｍである。また、ロータ４１の角穴４２に収容されているチップ形電子部品４０はロータ４１の表面より０．３ｍｍ〜０．４ｍｍ突出している。このような関係寸法にあるので、ロータ４１の角穴４２に収容されているチップ形電子部品４０がロータ４１の間欠搬送によって送られてきて電極子４の直下に来て電極子４を押し上げた状態であっても、弾性体リング６は０．２ｍｍ〜０．５ｍｍ変形してロータ４１の表面に押し当てられている。以上の状態を実現させるためには、ばね９は弾性体リング６が０．６ｍｍの変形を受けた時に発生する反発力よりも大きいばね圧を持ったものであることが必要である。
以上の説明で明らかなように、弾性体リング６はロータ４１の表面に押し当てられた状態を常に維持しているので、電極子４はロータ４１の間欠搬送の回転と常に同期した回転が実現される。すなわち、検査用の電極子４の回転速度は、検査装置によって次々に送られてくるチップ形電子部品４０の端面電極が検査用の電極子４に接触する時の速度と同じ速度である。 Next, a state where the chip-type electronic component 40 is in contact with the electrode 4 of the rotary electrode unit 1 of the present invention will be described with reference to FIG.
The rotary electrode unit 1 is placed against the surface of the rotor 41 so that the elastic ring 6 is deformed by 0.5 mm to 0.6 mm. Since the outer diameter of the elastic ring 6 is 1.4 mm larger than the outer diameter of the electrode element 4 as described above, the gap between the electrode element 4 and the surface of the rotor 41 is 0.1 mm to 0.00 mm. 2 mm. The chip-type electronic component 40 accommodated in the square hole 42 of the rotor 41 protrudes from the surface of the rotor 41 by 0.3 mm to 0.4 mm. Because of such relational dimensions, the chip-type electronic component 40 accommodated in the square hole 42 of the rotor 41 is sent by intermittent conveyance of the rotor 41 and comes directly under the electrode 4 to push up the electrode 4. Even in this state, the elastic ring 6 is deformed by 0.2 mm to 0.5 mm and pressed against the surface of the rotor 41. In order to realize the above state, the spring 9 needs to have a spring pressure larger than the repulsive force generated when the elastic ring 6 is deformed by 0.6 mm.
As is apparent from the above description, since the elastic ring 6 is always kept pressed against the surface of the rotor 41, the electrode 4 is rotated in synchronization with the intermittent conveyance rotation of the rotor 41. Is done. That is, the rotation speed of the inspection electrode 4 is the same as the speed at which the end face electrodes of the chip-type electronic components 40 that are successively sent by the inspection apparatus come into contact with the inspection electrode 4.

図６の（ａ）は、ロータ４１の角穴４２に収容されたチップ形電子部品４０がロータ４１の間欠搬送によって送られてきて、電極子４に接触し始めた状態を示す図である。
図６（ｂ）は、同図（ａ）の状態からロータ４１がさらに動いて間欠搬送の動作が停止した状態を示す図である。
図６（ｃ）は、同図（ｂ）の状態からロータ４１の間欠搬送の動作が開始してチップ形電子部品４０が電極子４との接触から解放されるまでの状態にある図である。
（ａ）の状態から（ｂ）の状態におよび（ｂ）の状態から（ｃ）の状態にチップ形電子部品４０がロータ４１の間欠搬送によって移動していく速度と同じ速度で電極子４は回転しているので、チップ形電子部品４０の姿勢はロータ４１の角穴４２内で安定した状態で電極子４に接触していく。従って、チップ形電子部品４０の端面電極の表面には外観不良となる擦り跡が残らない効果を発揮することができる。 FIG. 6A is a diagram showing a state in which the chip-type electronic component 40 accommodated in the square hole 42 of the rotor 41 is sent by intermittent conveyance of the rotor 41 and starts to contact the electrode 4.
FIG. 6B is a diagram showing a state where the rotor 41 further moves from the state of FIG.
FIG. 6C is a diagram showing a state from the state of FIG. 6B until the intermittent conveyance operation of the rotor 41 is started and the chip-type electronic component 40 is released from contact with the electrode 4. .
The electrode 4 is moved from the state (a) to the state (b) and from the state (b) to the state (c) at the same speed as the chip-type electronic component 40 is moved by the intermittent conveyance of the rotor 41. Since it is rotating, the posture of the chip-type electronic component 40 comes into contact with the electrode 4 in a stable state within the square hole 42 of the rotor 41. Therefore, it is possible to exert an effect that no rubbing marks that cause poor appearance remain on the surface of the end face electrode of the chip-type electronic component 40.

前述の実施例１では、チップ形電子部品４０を間欠搬送する方法として円盤状のロータ４１を使用したが、本実施例ではロータに替えてベルトを使用する。
実施例１と同様に、本発明の回転式電極子ユニット１の弾性体リング６をベルトの表面に押し当てることにより、実施例１での説明と同じ理由によってチップ形電子部品４０の端面電極の表面には外観不良となる擦り跡が残らない効果を発揮することができる。 In the first embodiment, the disk-shaped rotor 41 is used as a method for intermittently conveying the chip-type electronic component 40. However, in this embodiment, a belt is used instead of the rotor.
Similar to the first embodiment, the elastic ring 6 of the rotary electrode unit 1 of the present invention is pressed against the surface of the belt, so that the end surface electrode of the chip-type electronic component 40 is formed for the same reason as described in the first embodiment. An effect of leaving no rubbing marks that cause poor appearance on the surface can be exhibited.

本発明による回転式電極子装置は、チップ形電子部品の製造および検査の分野で広く利用できる。   The rotary electrode device according to the present invention can be widely used in the field of manufacture and inspection of chip-type electronic components.

本発明による回転式電極子装置の実施例で使用する電気特性を検査する装置における検査の対象とするチップ形電子部品搬送用の円盤状のロータを示す図である。It is a figure which shows the disk-shaped rotor for chip-type electronic component conveyance used as the test object in the apparatus which test | inspects the electrical property used in the Example of the rotary electrode apparatus by this invention. 図１の図中に示すＸ−Ｘ断面を矢印方向に見た装置の断面図である。It is sectional drawing of the apparatus which looked at the XX cross section shown in the figure of FIG. 1 in the arrow direction. 本発明の実施例１の回転式電極子ユニットを示す全体図である。It is a general view which shows the rotary electrode unit of Example 1 of this invention. 図３の図中に示すＡ−Ａ断面図である。It is AA sectional drawing shown in the figure of FIG. 図３に示す電極子４の部分を詳細に拡大した断面図である。It is sectional drawing which expanded the part of the electrode element 4 shown in FIG. 3 in detail. 本発明の回転式電極子装置にチップ形電子部品が接触していく状態の説明図である。It is explanatory drawing of the state which a chip-type electronic component contacts the rotary electrode device of this invention. 一般的に使用されているローラ形電極子ユニットを示す全体図である。It is a general view which shows the roller-type electrode unit generally used. 図７の図中に示すＢ−Ｂ断面図である。It is BB sectional drawing shown in the figure of FIG. 一般的に使用されているローラ形電極子にチップ形電子部品が接触していく状態の説明図である。It is explanatory drawing of the state which a chip-type electronic component contacts the roller-type electrode generally used.

符号の説明Explanation of symbols

１ 回転式電極子ユニット（装置）
２，２１ ケース
３，２２ 接続端子
４，２３ 電極子
５，２４ 回転用軸
６ 弾性体リング
７，２５ 電極子ホルダ
８，２６ 揺動支点
９，２７ ばね
１０，２８ 接続ケーブル
２０ ローラ形電極子ユニット
４０ チップ形電子部品
４１ ロータ（搬送手段の一部）
４２ 角穴
５０ 基準台
５１ 下部電極子
５２ 絶縁ブッシュ
５３ ボス
５４ モータ
５５ ベース板 1 Rotary electrode unit (device)
2, 21 Case 3, 22 Connection terminal 4, 23 Electrode 5, 24 Rotating shaft 6 Elastic ring 7, 25 Electrode holder 8, 26 Oscillating fulcrum 9, 27 Spring 10, 28 Connection cable 20 Roller electrode Unit 40 Chip-type electronic component 41 Rotor (part of transport means)
42 Square Hole 50 Reference Base 51 Lower Electrode 52 Insulating Bush 53 Boss 54 Motor 55 Base Plate

Claims (2)

搬送体の穴にチップ形電子部品の端面電極を突出するように収容して搬送中に、前記端面電極に接触させられる電極子をもつ回転式電極子装置であって、
円筒形電極子と、
前記円筒形電極子の回転中心軸を前記チップ形電子部品の移動方向に略直交する方向とし、前記円筒形電極子が前記チップ形電子部品方向に付勢されるように支持する支持手段と、
前記円筒形電極子の回転速度が前記チップ形電子部品の端面電極が前記円筒形電極子に接触する時の速度と同じ速度に維持する従動手段と、
を具備し、
前記従動手段は、前記円筒形電極子の外周に設けられ、前記搬送体に接触従動回転する弾性体のリングを含むことを特徴とする回転式電極子装置。 A rotary electrode device having an electrode that is brought into contact with the end face electrode during transport by accommodating the end face electrode of the chip-type electronic component so as to protrude into the hole of the transport body,
A cylindrical electrode;
A support means for supporting a rotation center axis of the cylindrical electrode element in a direction substantially perpendicular to a moving direction of the chip-type electronic component, and supporting the cylindrical electrode element so as to be biased toward the chip-type electronic component;
Driven means for maintaining the rotational speed of the cylindrical electrode at the same speed as that when the end face electrode of the chip-type electronic component contacts the cylindrical electrode;
Comprising
The rotary electrode device according to claim 1, wherein the follower includes an elastic ring that is provided on an outer periphery of the cylindrical electrode and rotates in contact with the carrier. 請求項１記載の回転式電極子装置において、
前記搬送体は、チップ形電子部品特性検査分類装置のベルトあるいは回転円盤であり、
前記円筒形電極子の外周に装着された弾性体のリングは、前記チップ形電子部品を収容して搬送するためのベルトあるいは回転円盤に接触従動回転することを特徴とする回転式電極子装置。 The rotary electrode device according to claim 1 , wherein
The carrier is a belt or a rotating disk of a chip-type electronic component characteristic inspection and classification device,
The rotary electrode device according to claim 1, wherein an elastic ring attached to an outer periphery of the cylindrical electrode rotates in contact with a belt or a rotating disk for receiving and transporting the chip-type electronic component.
JP2007063102A 2007-03-13 2007-03-13 Rotary electrode device Active JP5030624B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007063102A JP5030624B2 (en) 2007-03-13 2007-03-13 Rotary electrode device
TW096111893A TWI404934B (en) 2007-03-13 2007-04-03 Rotary electrode subassembly
CN2007101010481A CN101266272B (en) 2007-03-13 2007-04-26 Rotary electrode head device
KR1020070041203A KR101345697B1 (en) 2007-03-13 2007-04-27 Rotary Electrode Member Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007063102A JP5030624B2 (en) 2007-03-13 2007-03-13 Rotary electrode device

Publications (2)

Publication Number Publication Date
JP2008224418A JP2008224418A (en) 2008-09-25
JP5030624B2 true JP5030624B2 (en) 2012-09-19

Family

ID=39843225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007063102A Active JP5030624B2 (en) 2007-03-13 2007-03-13 Rotary electrode device

Country Status (4)

Country Link
JP (1) JP5030624B2 (en)
KR (1) KR101345697B1 (en)
CN (1) CN101266272B (en)
TW (1) TWI404934B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101451499B1 (en) * 2013-02-07 2014-10-17 삼성전기주식회사 Electronic part inspection apparatus
JP6459882B2 (en) * 2015-10-06 2019-01-30 株式会社村田製作所 Energizer
JP6727651B2 (en) * 2016-09-30 2020-07-22 株式会社ヒューモラボラトリー Continuous inspection method for electrical characteristics of chip electronic components
JP6679552B2 (en) 2017-10-02 2020-04-15 株式会社ヒューモラボラトリー Inspection and sorting method for chip electronic components
KR102247261B1 (en) * 2020-12-15 2021-04-30 김상길 Contact roller having improved wear resistance and lubricity, probe assembly and inspection device for electronic part including the same
TWI800405B (en) * 2022-06-14 2023-04-21 國巨股份有限公司 Test probe and fixing device thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118672A (en) * 1986-11-06 1988-05-23 Murata Mfg Co Ltd Electric characteristic measuring instrument for chip-shaped electronic parts
EP1085327B1 (en) * 1999-09-15 2006-06-07 Capres A/S Multi-point probe
US6194979B1 (en) * 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
KR100350513B1 (en) * 2000-04-03 2002-08-28 박태욱 Probe apparatus testing an electrode of Plasma Display Panel
CN100353171C (en) * 2004-12-23 2007-12-05 中国科学院半导体研究所 Sample holder in use for measuring spectrum of photoluminescence of electrical modulation
JP2006194831A (en) * 2005-01-17 2006-07-27 Humo Laboratory Ltd Inspection classification device of chip type electronic component characteristic
JP2006214727A (en) * 2005-02-01 2006-08-17 Fuchigami Micro:Kk Contact probe card
CN100445709C (en) * 2005-03-07 2008-12-24 大赢数控设备(深圳)有限公司 Automatic device of LED testing table

Also Published As

Publication number Publication date
KR20080084517A (en) 2008-09-19
KR101345697B1 (en) 2013-12-30
TW200837354A (en) 2008-09-16
JP2008224418A (en) 2008-09-25
CN101266272B (en) 2012-11-07
CN101266272A (en) 2008-09-17
TWI404934B (en) 2013-08-11

Similar Documents

Publication Publication Date Title
JP5030624B2 (en) Rotary electrode device
JP2006194831A (en) Inspection classification device of chip type electronic component characteristic
WO2013035399A1 (en) Contact terminal
JP2006341340A (en) Clamp device
JP5264049B2 (en) Work transfer device and work inspection device
JP2013167601A (en) Inspection device using contact probe
JPH10255815A (en) Winder of wound body for battery
TW201905417A (en) Sensor head for crystal oscillating film thickness monitor
JP2004100735A (en) Adjusting mechanism of clearance between cam follower and cam surface in conjugate cam
JPH1026656A (en) Inspection device for substrate
JPH06335779A (en) Seam welding equipment
JP6059931B2 (en) Cutting equipment
JPH0351766A (en) Conductive contact element
JPH01254510A (en) Apparatus for taping chip part
JP3553798B2 (en) Solenoid device for magnetic recording / reproducing device
CN114701267B (en) Position adjusting device
JP2580514Y2 (en) Bearing roller rotating device for eddy current inspection
KR20010019108A (en) Apparatus for testing smart card
JPS63118672A (en) Electric characteristic measuring instrument for chip-shaped electronic parts
US2447806A (en) Cam operated circuit breaker
JPH11337429A (en) Apparatus and method for inspection of rotating operation-type electronic component
JP3869085B2 (en) Electronic component feeder
JP3054881B2 (en) Stamping machine
SU1091233A1 (en) Contact apparatus
JP2583352B2 (en) Contact jig for IC test

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100209

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120203

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120417

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120604

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120619

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120626

R150 Certificate of patent or registration of utility model

Ref document number: 5030624

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150706

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250