JP5008268B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

Info

Publication number
JP5008268B2
JP5008268B2 JP2005095780A JP2005095780A JP5008268B2 JP 5008268 B2 JP5008268 B2 JP 5008268B2 JP 2005095780 A JP2005095780 A JP 2005095780A JP 2005095780 A JP2005095780 A JP 2005095780A JP 5008268 B2 JP5008268 B2 JP 5008268B2
Authority
JP
Japan
Prior art keywords
substrate
unit
processing
processing unit
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005095780A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006190921A (ja
JP2006190921A5 (enExample
Inventor
徹 浅野
幸夫 鳥山
隆志 田口
毅 三橋
幸司 金山
剛 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Semiconductor Solutions Co Ltd
Original Assignee
Screen Semiconductor Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Semiconductor Solutions Co Ltd filed Critical Screen Semiconductor Solutions Co Ltd
Priority to JP2005095780A priority Critical patent/JP5008268B2/ja
Priority to TW094141869A priority patent/TWI278058B/zh
Priority to KR1020050116310A priority patent/KR100684627B1/ko
Priority to US11/294,877 priority patent/US20060147201A1/en
Publication of JP2006190921A publication Critical patent/JP2006190921A/ja
Publication of JP2006190921A5 publication Critical patent/JP2006190921A5/ja
Application granted granted Critical
Publication of JP5008268B2 publication Critical patent/JP5008268B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2005095780A 2004-12-06 2005-03-29 基板処理装置および基板処理方法 Expired - Lifetime JP5008268B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005095780A JP5008268B2 (ja) 2004-12-06 2005-03-29 基板処理装置および基板処理方法
TW094141869A TWI278058B (en) 2004-12-06 2005-11-29 Substrate processing apparatus and substrate processing method
KR1020050116310A KR100684627B1 (ko) 2004-12-06 2005-12-01 기판 처리장치 및 기판 처리방법
US11/294,877 US20060147201A1 (en) 2004-12-06 2005-12-06 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004353117 2004-12-06
JP2004353117 2004-12-06
JP2005095780A JP5008268B2 (ja) 2004-12-06 2005-03-29 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2006190921A JP2006190921A (ja) 2006-07-20
JP2006190921A5 JP2006190921A5 (enExample) 2007-11-08
JP5008268B2 true JP5008268B2 (ja) 2012-08-22

Family

ID=36640545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005095780A Expired - Lifetime JP5008268B2 (ja) 2004-12-06 2005-03-29 基板処理装置および基板処理方法

Country Status (4)

Country Link
US (1) US20060147201A1 (enExample)
JP (1) JP5008268B2 (enExample)
KR (1) KR100684627B1 (enExample)
TW (1) TWI278058B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5008280B2 (ja) 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154007B2 (ja) 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4794232B2 (ja) * 2004-12-06 2011-10-19 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Sokudo 基板処理装置
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Sokudo 基板処理装置
JP5132108B2 (ja) * 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4832201B2 (ja) 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
JP2008060302A (ja) * 2006-08-31 2008-03-13 Sokudo:Kk 基板処理装置
JP2008091508A (ja) * 2006-09-29 2008-04-17 Canon Inc 処理装置
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP2011205004A (ja) 2010-03-26 2011-10-13 Sokudo Co Ltd 基板処理装置および基板処理方法
JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP7195841B2 (ja) 2018-09-21 2022-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102583261B1 (ko) * 2020-10-28 2023-09-27 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260686A (ja) * 1998-03-11 1999-09-24 Toshiba Corp 露光方法
JP3914690B2 (ja) * 1999-06-30 2007-05-16 東京エレクトロン株式会社 基板受け渡し装置及び塗布現像処理システム
JP4342147B2 (ja) * 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
JP4018965B2 (ja) * 2002-10-28 2007-12-05 東京エレクトロン株式会社 基板処理装置
JP4170864B2 (ja) * 2003-02-03 2008-10-22 大日本スクリーン製造株式会社 基板処理装置および基板処理装置における基板搬送方法および基板処理方法
KR20060009356A (ko) * 2003-05-15 2006-01-31 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4397646B2 (ja) * 2003-07-30 2010-01-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2006310724A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
KR100684627B1 (ko) 2007-02-20
TW200627575A (en) 2006-08-01
KR20060063683A (ko) 2006-06-12
US20060147201A1 (en) 2006-07-06
TWI278058B (en) 2007-04-01
JP2006190921A (ja) 2006-07-20

Similar Documents

Publication Publication Date Title
JP5154008B2 (ja) 基板処理装置および基板処理方法
JP4522329B2 (ja) 基板処理装置
JP4926433B2 (ja) 基板処理装置および基板処理方法
JP5154007B2 (ja) 基板処理装置
JP5039468B2 (ja) 基板洗浄装置およびそれを備えた基板処理装置
JP4771816B2 (ja) 基板処理装置
CN100495639C (zh) 基板处理装置
JP2006310724A (ja) 基板処理装置および基板処理方法
JP4832201B2 (ja) 基板処理装置
US20080212049A1 (en) Substrate processing apparatus with high throughput development units
JP5269956B2 (ja) 基板処理装置
JP5008268B2 (ja) 基板処理装置および基板処理方法
JP4761907B2 (ja) 基板処理装置
JP5008280B2 (ja) 基板処理装置および基板処理方法
JP4514657B2 (ja) 基板処理装置
JP5154006B2 (ja) 基板処理装置
JP4794232B2 (ja) 基板処理装置
JP2007214365A (ja) 基板処理装置
JP2007201078A (ja) 基板処理装置
JP5308054B2 (ja) 基板処理装置
JP4753641B2 (ja) 基板処理システム
JP2007012998A (ja) 基板洗浄装置およびそれを備えた基板処理システム
JP4579029B2 (ja) 基板処理装置
JP2007036122A (ja) 基板処理装置
JP2007189139A (ja) 基板処理装置

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20070129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070925

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100706

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100831

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110118

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110413

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20110422

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20110603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120425

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120529

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5008268

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150608

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term