JP4961515B1 - 分割スパッタリングターゲット及びその製造方法 - Google Patents
分割スパッタリングターゲット及びその製造方法 Download PDFInfo
- Publication number
- JP4961515B1 JP4961515B1 JP2012503153A JP2012503153A JP4961515B1 JP 4961515 B1 JP4961515 B1 JP 4961515B1 JP 2012503153 A JP2012503153 A JP 2012503153A JP 2012503153 A JP2012503153 A JP 2012503153A JP 4961515 B1 JP4961515 B1 JP 4961515B1
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- target
- point solder
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000002844 melting Methods 0.000 claims abstract description 55
- 230000008018 melting Effects 0.000 claims abstract description 55
- 239000004065 semiconductor Substances 0.000 claims abstract description 36
- 238000005304 joining Methods 0.000 claims abstract description 16
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 18
- 239000010409 thin film Substances 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 7
- 239000000470 constituent Substances 0.000 abstract description 6
- 239000010949 copper Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 5
- 229910007541 Zn O Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000003779 heat-resistant material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000011218 segmentation Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910019092 Mg-O Inorganic materials 0.000 description 2
- 229910019395 Mg—O Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910014472 Ca—O Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910003077 Ti−O Inorganic materials 0.000 description 1
- 229910009378 Zn Ca Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
【選択図】図2
Description
20 ターゲット部材
30 間隙
50 低融点ハンダ
Claims (6)
- バッキングプレート上に、酸化物半導体からなるターゲット部材を、低融点ハンダにより複数接合して形成された分割スパッタリングターゲットにおいて、
接合されたターゲット部材の間に形成された間隙に、バッキングプレート表面を覆う低融点ハンダが存在しており、
低融点ハンダの間隙内の厚みは、ターゲット部材間に形成された間隙深さの10%〜70%であることを特徴とする分割スパッタリングターゲット。 - 低融点ハンダは、接合の際の低融点ハンダを間隙に残存させたものである請求項1に記載の分割スパッタリングターゲット。
- 酸化物半導体は、In、Zn、Gaのいずれか一種以上を含む酸化物からなる請求項1または請求項2に記載の分割スパッタリングターゲット。
- 酸化物半導体は、Sn、Ti、Ba、Ca、Zn、Mg、Ge、Y、La、Al、Si、Gaのいずれか一種以上を含む酸化物からなる請求項1または請求項2に記載の分割スパッタリングターゲット。
- 酸化物半導体は、Cu、Al、Ga、Inのいずれか一種以上を含む酸化物からなる請求項1または請求項2に記載の分割スパッタリングターゲット。
- バッキングプレート上に、酸化物半導体からなるターゲット部材を、低融点ハンダにより複数接合して形成される分割スパッタリングターゲットの製造方法において、
バッキングプレート上に、ターゲット部材を低融点ハンダにより複数接合し、
接合されたターゲット部材間に形成された間隙にある低融点ハンダを所定量の間隙深さとなるように除去することを特徴とする分割スパッタリングターゲットの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012503153A JP4961515B1 (ja) | 2010-11-08 | 2011-07-13 | 分割スパッタリングターゲット及びその製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010249781 | 2010-11-08 | ||
JP2010249781 | 2010-11-08 | ||
JP2012503153A JP4961515B1 (ja) | 2010-11-08 | 2011-07-13 | 分割スパッタリングターゲット及びその製造方法 |
PCT/JP2011/065952 WO2012063525A1 (ja) | 2010-11-08 | 2011-07-13 | 分割スパッタリングターゲット及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4961515B1 true JP4961515B1 (ja) | 2012-06-27 |
JPWO2012063525A1 JPWO2012063525A1 (ja) | 2014-05-12 |
Family
ID=46050684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012503153A Active JP4961515B1 (ja) | 2010-11-08 | 2011-07-13 | 分割スパッタリングターゲット及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4961515B1 (ja) |
KR (1) | KR101178822B1 (ja) |
CN (1) | CN102686767B (ja) |
TW (1) | TWI388681B (ja) |
WO (1) | WO2012063525A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016176147A (ja) * | 2014-10-07 | 2016-10-06 | Jx金属株式会社 | 円筒型スパッタリングターゲット |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5759425B2 (ja) * | 2012-07-20 | 2015-08-05 | 株式会社神戸製鋼所 | 薄膜トランジスタの半導体層用薄膜の形成に用いられるターゲット組立体の品質評価方法 |
KR20140129770A (ko) | 2013-04-30 | 2014-11-07 | 삼성디스플레이 주식회사 | 플라즈마 코팅 시스템용 타블렛, 이의 제조 방법, 및 이를 이용한 박막의 제조 방법 |
JP6273735B2 (ja) * | 2013-09-20 | 2018-02-07 | 東ソー株式会社 | 円筒形スパッタリングターゲットとその製造方法 |
CN105483625B (zh) * | 2014-10-07 | 2018-01-02 | Jx金属株式会社 | 溅射靶 |
CN105908137B (zh) * | 2015-02-24 | 2020-12-15 | Jx金属株式会社 | 溅射靶 |
JP6960989B2 (ja) * | 2017-03-31 | 2021-11-05 | 三井金属鉱業株式会社 | 分割スパッタリングターゲット |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230768A (ja) * | 1988-03-08 | 1989-09-14 | Asahi Glass Co Ltd | スパッター用ターゲットユニットの製造方法および透明電導膜の製造方法 |
JPH08144052A (ja) * | 1994-11-22 | 1996-06-04 | Tosoh Corp | Itoスパッタリングターゲット |
JP2000144400A (ja) * | 1998-06-08 | 2000-05-26 | Tosoh Corp | スパッタリングターゲットおよびその製造方法 |
-
2011
- 2011-07-13 WO PCT/JP2011/065952 patent/WO2012063525A1/ja active Application Filing
- 2011-07-13 CN CN201180005297.5A patent/CN102686767B/zh active Active
- 2011-07-13 KR KR1020127016053A patent/KR101178822B1/ko active IP Right Grant
- 2011-07-13 JP JP2012503153A patent/JP4961515B1/ja active Active
- 2011-07-28 TW TW100126732A patent/TWI388681B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230768A (ja) * | 1988-03-08 | 1989-09-14 | Asahi Glass Co Ltd | スパッター用ターゲットユニットの製造方法および透明電導膜の製造方法 |
JPH08144052A (ja) * | 1994-11-22 | 1996-06-04 | Tosoh Corp | Itoスパッタリングターゲット |
JP2000144400A (ja) * | 1998-06-08 | 2000-05-26 | Tosoh Corp | スパッタリングターゲットおよびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016176147A (ja) * | 2014-10-07 | 2016-10-06 | Jx金属株式会社 | 円筒型スパッタリングターゲット |
Also Published As
Publication number | Publication date |
---|---|
CN102686767B (zh) | 2014-05-28 |
KR101178822B1 (ko) | 2012-09-03 |
JPWO2012063525A1 (ja) | 2014-05-12 |
TW201237199A (en) | 2012-09-16 |
KR20120087992A (ko) | 2012-08-07 |
CN102686767A (zh) | 2012-09-19 |
WO2012063525A1 (ja) | 2012-05-18 |
TWI388681B (zh) | 2013-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4961515B1 (ja) | 分割スパッタリングターゲット及びその製造方法 | |
CN102712997B (zh) | 分割溅镀靶及其制造方法 | |
KR102475939B1 (ko) | 신규 가닛 화합물, 그것을 함유하는 소결체 및 스퍼터링 타깃 | |
JP4961513B1 (ja) | 分割スパッタリングターゲット及びその製造方法 | |
KR101804660B1 (ko) | 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재 | |
KR20150135530A (ko) | Li 함유 산화물 타겟 접합체 | |
JP2012180555A (ja) | インジウムターゲット及びその製造方法 | |
JP6273735B2 (ja) | 円筒形スパッタリングターゲットとその製造方法 | |
TW201200611A (en) | ITO sputtering target and the manufacturing method thereof | |
TWI754426B (zh) | 氧化物燒結體、濺鍍靶及氧化物半導體膜 | |
TWI778964B (zh) | 氧化物燒結體及濺鍍靶材 | |
CN110741106A (zh) | 氧化物烧结体及溅射靶 | |
TWI660056B (zh) | Ito濺鍍靶材及其製造方法 | |
KR102218814B1 (ko) | 소결체, 스퍼터링 타깃 및 소결체의 제조 방법 | |
JP2008218592A (ja) | 薄膜バリスタおよびその製造方法 | |
TW202108795A (zh) | 分割濺鍍靶 | |
CN107522407B (zh) | 一种防静电低温共烧陶瓷材料及其制备方法和应用 | |
CN107254669A (zh) | 烧结体和非晶膜 | |
JP2821182B2 (ja) | 電子部品の製造方法 | |
WO2014128976A1 (ja) | スパッタリングターゲットおよびその製造方法 | |
KR20160040533A (ko) | 스퍼터링 타깃 및 그 제조 방법 | |
CN110024090A (zh) | 配线结构和其制造方法、溅射靶材以及抗氧化方法 | |
CN103177871B (zh) | 一种具有复合基板的薄膜电容器 | |
JP2015089967A (ja) | スパッタリングターゲット材およびその製造方法 | |
JP2017179595A (ja) | スパッタリングターゲット材およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120309 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120326 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150330 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4961515 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |