JP4959966B2 - 多層配線基板用層間接続ボンディングシート - Google Patents

多層配線基板用層間接続ボンディングシート Download PDF

Info

Publication number
JP4959966B2
JP4959966B2 JP2005285483A JP2005285483A JP4959966B2 JP 4959966 B2 JP4959966 B2 JP 4959966B2 JP 2005285483 A JP2005285483 A JP 2005285483A JP 2005285483 A JP2005285483 A JP 2005285483A JP 4959966 B2 JP4959966 B2 JP 4959966B2
Authority
JP
Japan
Prior art keywords
wiring board
resin
multilayer wiring
bonding sheet
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005285483A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007096122A (ja
JP2007096122A5 (https=
Inventor
紳月 山田
純 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP2005285483A priority Critical patent/JP4959966B2/ja
Publication of JP2007096122A publication Critical patent/JP2007096122A/ja
Publication of JP2007096122A5 publication Critical patent/JP2007096122A5/ja
Application granted granted Critical
Publication of JP4959966B2 publication Critical patent/JP4959966B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Adhesive Tapes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005285483A 2005-09-29 2005-09-29 多層配線基板用層間接続ボンディングシート Expired - Fee Related JP4959966B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005285483A JP4959966B2 (ja) 2005-09-29 2005-09-29 多層配線基板用層間接続ボンディングシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005285483A JP4959966B2 (ja) 2005-09-29 2005-09-29 多層配線基板用層間接続ボンディングシート

Publications (3)

Publication Number Publication Date
JP2007096122A JP2007096122A (ja) 2007-04-12
JP2007096122A5 JP2007096122A5 (https=) 2007-07-12
JP4959966B2 true JP4959966B2 (ja) 2012-06-27

Family

ID=37981439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005285483A Expired - Fee Related JP4959966B2 (ja) 2005-09-29 2005-09-29 多層配線基板用層間接続ボンディングシート

Country Status (1)

Country Link
JP (1) JP4959966B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4587974B2 (ja) * 2006-02-21 2010-11-24 新日鐵化学株式会社 多層プリント配線板の製造方法
JP6679082B1 (ja) * 2019-04-16 2020-04-15 山下マテリアル株式会社 フレキシブル配線板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2608612B1 (fr) * 1986-12-17 1989-03-31 Rhone Poulenc Chimie Polymeres a groupement imides a partir de bis-imides et d'alkenyloxyanilines
JPH03287680A (ja) * 1990-04-03 1991-12-18 Toagosei Chem Ind Co Ltd 有機厚膜ペースト組成物
EP0501587A1 (en) * 1991-02-28 1992-09-02 Shell Internationale Researchmaatschappij B.V. Bisimide resin processing
JPH08302273A (ja) * 1995-05-12 1996-11-19 Toagosei Co Ltd ワニスおよびその応用
JP2000223836A (ja) * 1999-01-28 2000-08-11 Kyocera Corp 多層配線基板およびその製造方法
JP2000323804A (ja) * 1999-05-07 2000-11-24 Toagosei Co Ltd プリント配線板用銅張り積層板
JP4850356B2 (ja) * 2000-10-23 2012-01-11 イビデン株式会社 層間接続構造および製造方法
JP2002280742A (ja) * 2001-03-16 2002-09-27 Hitachi Chem Co Ltd 多層プリント配線板及びその製造法
JP2003092467A (ja) * 2001-09-19 2003-03-28 Tatsuta Electric Wire & Cable Co Ltd プリント配線基板およびその製法
JP3922977B2 (ja) * 2002-06-19 2007-05-30 三菱樹脂株式会社 半導体装置内蔵多層配線基板
JP2005075866A (ja) * 2003-08-29 2005-03-24 Tomoegawa Paper Co Ltd 半導体装置用接着シート
JP2005260012A (ja) * 2004-03-12 2005-09-22 Sony Chem Corp 両面配線基板及び多層配線基板の製造方法

Also Published As

Publication number Publication date
JP2007096122A (ja) 2007-04-12

Similar Documents

Publication Publication Date Title
CN101785373B (zh) 多层布线基板以及半导体装置
KR101153766B1 (ko) 캐비티부를 갖는 다층 배선 기판
JP2008244091A (ja) 多層配線基板用層間接続ボンディングシート
JP4787195B2 (ja) ビアホール充填用導電性ペースト組成物とそれを用いた多層配線基板
JP2009065008A (ja) 導電性ペースト組成物
US8044304B2 (en) Multilayer printed circuit board
JP4934334B2 (ja) 両面銅張板
JP4996838B2 (ja) 多層配線基板
JP4468081B2 (ja) 多層配線基板用導電性ペースト組成物
JP4468080B2 (ja) 多層配線基板用導電性ペースト組成物
JP4838606B2 (ja) 樹脂付き銅箔
JP2008235833A (ja) 多層配線基板用層間接続ボンディングシート
JP4881193B2 (ja) 導電性ペースト組成物
JP5032205B2 (ja) キャビティー部を有する多層配線基板
JP4959966B2 (ja) 多層配線基板用層間接続ボンディングシート
JP4422555B2 (ja) 多層配線基板用導電性ペースト組成物
JP2009065009A (ja) 多層配線基板
JP4965102B2 (ja) ビアホール充填用導電性ペースト組成物
JP4965286B2 (ja) 多層配線基板
JP4481734B2 (ja) 多層配線基板用導電性ペースト組成物
JP4774215B2 (ja) 多層プリント配線基板
JP4481733B2 (ja) 多層配線基板用導電性ペースト組成物
JP4806279B2 (ja) ガラスクロス含有絶縁基材
JP2008244061A (ja) 多層配線基板用層間接続ボンディングシート
JP2008103427A (ja) 離型フィルム

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070530

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080520

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20101101

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101207

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110202

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110802

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111031

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120221

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120322

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150330

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees