JP4959872B2 - バイポーラトランジスタ - Google Patents
バイポーラトランジスタ Download PDFInfo
- Publication number
- JP4959872B2 JP4959872B2 JP2000614486A JP2000614486A JP4959872B2 JP 4959872 B2 JP4959872 B2 JP 4959872B2 JP 2000614486 A JP2000614486 A JP 2000614486A JP 2000614486 A JP2000614486 A JP 2000614486A JP 4959872 B2 JP4959872 B2 JP 4959872B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base
- bipolar transistor
- emitter
- transistor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000006798 recombination Effects 0.000 claims description 19
- 238000005215 recombination Methods 0.000 claims description 19
- 239000002800 charge carrier Substances 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 10
- 230000001629 suppression Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002019 doping agent Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 230000002457 bidirectional effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005527 interface trap Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003949 trap density measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/177—Base regions of bipolar transistors, e.g. BJTs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/80—Heterojunction BJTs
- H10D10/821—Vertical heterojunction BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Bipolar Transistors (AREA)
- Amplifiers (AREA)
- Electronic Switches (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9901410-2 | 1999-04-21 | ||
| SE9901410A SE9901410D0 (sv) | 1999-04-21 | 1999-04-21 | Abipolar transistor |
| PCT/SE2000/000698 WO2000065636A2 (en) | 1999-04-21 | 2000-04-12 | A bipolar transistor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002543585A JP2002543585A (ja) | 2002-12-17 |
| JP2002543585A5 JP2002543585A5 (enExample) | 2007-05-24 |
| JP4959872B2 true JP4959872B2 (ja) | 2012-06-27 |
Family
ID=20415286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000614486A Expired - Lifetime JP4959872B2 (ja) | 1999-04-21 | 2000-04-12 | バイポーラトランジスタ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6313488B1 (enExample) |
| EP (1) | EP1186049B1 (enExample) |
| JP (1) | JP4959872B2 (enExample) |
| AT (1) | ATE501526T1 (enExample) |
| DE (1) | DE60045708D1 (enExample) |
| SE (1) | SE9901410D0 (enExample) |
| WO (1) | WO2000065636A2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332565A (ja) * | 2000-05-25 | 2001-11-30 | Nec Corp | 負性微分抵抗素子およびその製造方法 |
| US7132701B1 (en) | 2001-07-27 | 2006-11-07 | Fairchild Semiconductor Corporation | Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods |
| US6870204B2 (en) | 2001-11-21 | 2005-03-22 | Astralux, Inc. | Heterojunction bipolar transistor containing at least one silicon carbide layer |
| JP2004200391A (ja) * | 2002-12-18 | 2004-07-15 | Hitachi Ltd | 半導体装置 |
| EP1583154B1 (en) * | 2003-01-06 | 2011-12-28 | Nippon Telegraph And Telephone Corporation | P-type nitride semiconductor structure and bipolar transistor |
| JP2004247545A (ja) * | 2003-02-14 | 2004-09-02 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
| JP4777699B2 (ja) | 2005-06-13 | 2011-09-21 | 本田技研工業株式会社 | バイポーラ型半導体装置およびその製造方法 |
| US7868335B1 (en) * | 2008-08-18 | 2011-01-11 | Hrl Laboratories, Llc | Modulation doped super-lattice sub-collector for high-performance HBTs and BJTs |
| US9799731B2 (en) | 2013-06-24 | 2017-10-24 | Ideal Power, Inc. | Multi-level inverters using sequenced drive of double-base bidirectional bipolar transistors |
| US9029909B2 (en) | 2013-06-24 | 2015-05-12 | Ideal Power Inc. | Systems, circuits, devices, and methods with bidirectional bipolar transistors |
| US9742385B2 (en) | 2013-06-24 | 2017-08-22 | Ideal Power, Inc. | Bidirectional semiconductor switch with passive turnoff |
| US9236458B2 (en) * | 2013-07-11 | 2016-01-12 | Infineon Technologies Ag | Bipolar transistor and a method for manufacturing a bipolar transistor |
| US9355853B2 (en) | 2013-12-11 | 2016-05-31 | Ideal Power Inc. | Systems and methods for bidirectional device fabrication |
| US11637016B2 (en) | 2013-12-11 | 2023-04-25 | Ideal Power Inc. | Systems and methods for bidirectional device fabrication |
| JP6659685B2 (ja) | 2014-11-06 | 2020-03-04 | アイディール パワー インコーポレイテッド | ダブルベースバイポーラジャンクショントランジスタの最適化された動作を有する回路、方法、及びシステム、並びに、可変電圧自己同期整流器回路、方法、及びシステム、並びに、ダブルベースコンタクト双方向バイポーラジャンクショントランジスタ回路による動作ポイント最適化、方法、及びシステム。 |
| CN105977287B (zh) * | 2016-07-25 | 2018-11-09 | 电子科技大学 | 一种碳化硅双极结型晶体管 |
| CN111081543A (zh) * | 2019-12-26 | 2020-04-28 | 深圳第三代半导体研究院 | 一种基于二维材料/氮化镓的双极型三极管及其制备方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985742A (en) * | 1989-07-07 | 1991-01-15 | University Of Colorado Foundation, Inc. | High temperature semiconductor devices having at least one gallium nitride layer |
| JPH05275441A (ja) * | 1992-03-24 | 1993-10-22 | Sumitomo Electric Ind Ltd | 半導体装置及びその製造方法 |
| US5624853A (en) * | 1992-03-24 | 1997-04-29 | Sumitomo Electric Industries, Ltd. | Method for forming heterojunction bipolar transistors |
| US5641975A (en) * | 1995-11-09 | 1997-06-24 | Northrop Grumman Corporation | Aluminum gallium nitride based heterojunction bipolar transistor |
| WO1997036317A2 (en) * | 1996-03-27 | 1997-10-02 | Abb Research Limited | A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR LAYERS OF SiC BY THE USE OF AN IMPLANTING STEP AND A DEVICE PRODUCED THEREBY |
| JPH09293880A (ja) * | 1995-12-29 | 1997-11-11 | Texas Instr Inc <Ti> | 低容量電力用vfetの方法及びデバイス |
| WO1998049731A1 (en) * | 1997-04-30 | 1998-11-05 | Cree Research, Inc. | Silicon carbide field conrolled bipolar switch |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4945394A (en) * | 1987-10-26 | 1990-07-31 | North Carolina State University | Bipolar junction transistor on silicon carbide |
| US5319220A (en) * | 1988-01-20 | 1994-06-07 | Sharp Kabushiki Kaisha | Silicon carbide semiconductor device |
| US5847414A (en) * | 1995-10-30 | 1998-12-08 | Abb Research Limited | Semiconductor device having a hetero-junction between SiC and a Group 3B-nitride |
| SE9600199D0 (sv) * | 1996-01-19 | 1996-01-19 | Abb Research Ltd | A semiconductor device with a low resistance ohmic contact between a metal layer and a SiC-layer |
-
1999
- 1999-04-21 SE SE9901410A patent/SE9901410D0/xx unknown
- 1999-06-15 US US09/333,296 patent/US6313488B1/en not_active Expired - Lifetime
-
2000
- 2000-04-12 DE DE60045708T patent/DE60045708D1/de not_active Expired - Lifetime
- 2000-04-12 WO PCT/SE2000/000698 patent/WO2000065636A2/en not_active Ceased
- 2000-04-12 EP EP00928024A patent/EP1186049B1/en not_active Expired - Lifetime
- 2000-04-12 JP JP2000614486A patent/JP4959872B2/ja not_active Expired - Lifetime
- 2000-04-12 AT AT00928024T patent/ATE501526T1/de not_active IP Right Cessation
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985742A (en) * | 1989-07-07 | 1991-01-15 | University Of Colorado Foundation, Inc. | High temperature semiconductor devices having at least one gallium nitride layer |
| JPH05275441A (ja) * | 1992-03-24 | 1993-10-22 | Sumitomo Electric Ind Ltd | 半導体装置及びその製造方法 |
| US5624853A (en) * | 1992-03-24 | 1997-04-29 | Sumitomo Electric Industries, Ltd. | Method for forming heterojunction bipolar transistors |
| US5641975A (en) * | 1995-11-09 | 1997-06-24 | Northrop Grumman Corporation | Aluminum gallium nitride based heterojunction bipolar transistor |
| JPH09293880A (ja) * | 1995-12-29 | 1997-11-11 | Texas Instr Inc <Ti> | 低容量電力用vfetの方法及びデバイス |
| WO1997036317A2 (en) * | 1996-03-27 | 1997-10-02 | Abb Research Limited | A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR LAYERS OF SiC BY THE USE OF AN IMPLANTING STEP AND A DEVICE PRODUCED THEREBY |
| WO1998049731A1 (en) * | 1997-04-30 | 1998-11-05 | Cree Research, Inc. | Silicon carbide field conrolled bipolar switch |
| JP2001522533A (ja) * | 1997-04-30 | 2001-11-13 | クリー インコーポレイテッド | シリコン・カーバイド・フィールド制御型バイポーラ・スイッチ |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1186049B1 (en) | 2011-03-09 |
| WO2000065636A2 (en) | 2000-11-02 |
| SE9901410D0 (sv) | 1999-04-21 |
| DE60045708D1 (de) | 2011-04-21 |
| ATE501526T1 (de) | 2011-03-15 |
| WO2000065636A8 (en) | 2001-07-12 |
| US6313488B1 (en) | 2001-11-06 |
| WO2000065636A3 (en) | 2001-01-25 |
| JP2002543585A (ja) | 2002-12-17 |
| EP1186049A2 (en) | 2002-03-13 |
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