JP5406508B2 - 横型sbd半導体装置 - Google Patents
横型sbd半導体装置 Download PDFInfo
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- JP5406508B2 JP5406508B2 JP2008286093A JP2008286093A JP5406508B2 JP 5406508 B2 JP5406508 B2 JP 5406508B2 JP 2008286093 A JP2008286093 A JP 2008286093A JP 2008286093 A JP2008286093 A JP 2008286093A JP 5406508 B2 JP5406508 B2 JP 5406508B2
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- 239000004065 semiconductor Substances 0.000 title claims description 185
- 230000005533 two-dimensional electron gas Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910021478 group 5 element Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 15
- 229910002601 GaN Inorganic materials 0.000 description 12
- 238000005468 ion implantation Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 nitride compound Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Description
Transistor、以下「HEMT」と記す)構造を有する横型SBD半導体装置(横型ショットキーバリアダイオード半導体装置)に関する。
Claims (3)
- 基板と、
前記基板の上に設けられた第1の半導体層と、
前記第1の半導体層の上に設けられ、前記第1の半導体層より大きなエネルギーバンドギャップを有し、前記第1の半導体層との界面に2次元電子ガスを誘起する第2の半導体層と、
前記第2の半導体層の上に設けられ、前記第2の半導体層とショットキー接触を有するアノード電極と、
前記第2の半導体層の上に、前記アノード電極と絶縁して設けられ、前記第2の半導体層とオーミック接触を有するカソード電極と、
前記第2の半導体層にあって、前記アノード電極と前記第2の半導体層の接合面の直下の中央部領域に設けられ、前記アノード電極と前記第2の半導体層の接合面の直下の中央部領域に分布する前記2次元電子ガスを消失させる第1の半導体領域と、
前記第2の半導体層にあって、前記アノード電極と前記第2の半導体層の接合面の直下の外周部領域に設けられ、前記2次元電子ガスを誘起し、前記アノード電極と前記カソード電極の間に電流を生じる第2の半導体領域と、
を有することを特徴とする横型SBD半導体装置。 - 前記半導体領域が、少なくとも前記第2の半導体層に形成されたプラズマ処理領域、前記第2の半導体層の凹部表面を有するリセス領域、又は、イオン注入領域のいずれかを含むことを特徴とする請求項1記載の横型SBD半導体装置。
- 前記第1の半導体層及び前記第2の半導体層が、ホウ素(B)、アルミニウム(Al)、ガリウム(Ga)及びインジウム(In)からなる群のうちの少なくとも1つからなるIII族元素と、窒素(N)、リン(P)、砒素(As)、アンチモン(Sb)からなる群のうちの少なくとも窒素を含むV族元素とにより構成されることを特徴とする請求項1又は2記載の横型SBD半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008286093A JP5406508B2 (ja) | 2008-11-07 | 2008-11-07 | 横型sbd半導体装置 |
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JP2008286093A JP5406508B2 (ja) | 2008-11-07 | 2008-11-07 | 横型sbd半導体装置 |
Publications (2)
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JP2010114285A JP2010114285A (ja) | 2010-05-20 |
JP5406508B2 true JP5406508B2 (ja) | 2014-02-05 |
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JP2008286093A Expired - Fee Related JP5406508B2 (ja) | 2008-11-07 | 2008-11-07 | 横型sbd半導体装置 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5209018B2 (ja) * | 2010-09-30 | 2013-06-12 | 株式会社東芝 | 窒化物半導体装置 |
JP6050563B2 (ja) * | 2011-02-25 | 2016-12-21 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
JP5765171B2 (ja) * | 2011-09-29 | 2015-08-19 | 富士通株式会社 | 化合物半導体装置の製造方法 |
KR101261928B1 (ko) | 2011-11-07 | 2013-05-08 | 현대자동차주식회사 | 실리콘 카바이드 쇼트키 베리어 다이오드의 제조방법 |
WO2014061051A1 (ja) * | 2012-10-15 | 2014-04-24 | 三菱電機株式会社 | ショットキーバリアダイオードおよびそれを用いた電子装置 |
CN103904134B (zh) * | 2014-03-25 | 2017-01-11 | 中国科学院半导体研究所 | 基于GaN基异质结构的二极管结构及制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4379305B2 (ja) * | 2004-11-09 | 2009-12-09 | サンケン電気株式会社 | 半導体装置 |
JP5217157B2 (ja) * | 2006-12-04 | 2013-06-19 | 日本電気株式会社 | 電界効果トランジスタおよびその製造方法 |
JP2008244419A (ja) * | 2007-02-27 | 2008-10-09 | Sanken Electric Co Ltd | 高電子移動度トランジスタ及びその製造方法 |
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