JP4957503B2 - 光モジュールおよび光モジュールの製造方法 - Google Patents
光モジュールおよび光モジュールの製造方法 Download PDFInfo
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- JP4957503B2 JP4957503B2 JP2007268924A JP2007268924A JP4957503B2 JP 4957503 B2 JP4957503 B2 JP 4957503B2 JP 2007268924 A JP2007268924 A JP 2007268924A JP 2007268924 A JP2007268924 A JP 2007268924A JP 4957503 B2 JP4957503 B2 JP 4957503B2
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- JP
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- Prior art keywords
- optical
- optical fiber
- ferrule
- flexible circuit
- circuit body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims description 139
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000013307 optical fiber Substances 0.000 claims description 76
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 230000013011 mating Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Description
12 光フェルール
13 短尺光ファイバ
14 フレキシブル回路体
15 電子部品
16 受発光素子
20 光ファイバ保持孔
21 突起(位置決め手段)
22 ガイドピン孔
25 ガイドピン
27 光ファイバ挿通孔
28 位置決め孔(位置決め手段)
Claims (2)
- 光ファイバ保持孔を有すると共に光接続される他端面に光接続用のガイドピンを保持するためのガイドピン孔を有する樹脂製の光フェルールと、
前記光フェルールの一端面にインサート成形により一体結合され、当該光フェルールの一端面から突出した光接続可能な短尺光ファイバを挿通させる光ファイバ挿通孔を有するフレキシブル回路体と、
前記フレキシブル回路体上の電気回路に接続された光素子と、を備え、
前記短尺光ファイバは、前記光フェルールの一端面から突出した端面が前記光素子と対面すると共に、前記光フェルールの他端面に同一の研磨面を有するように前記光ファイバ保持孔に保持されている光モジュールを製造する光モジュールの製造方法であって、
金型内に光ファイバ挿通孔を有するフレキシブル回路体を位置決めして、ファイバ保持孔とガイドピン孔を有する光フェルールをインサート成形する工程と、
前記フレキシブル回路体上の電気回路に光素子を接続する工程と、
前記ファイバ保持孔に光接続可能な短尺光ファイバを挿入して、前記光フェルールの一端面から突出した当該短尺光ファイバの端面を前記光ファイバ挿通孔に挿通させて前記光素子と対面するように固定する工程と、
前記光フェルールの他端面と同一の研磨面を有するように前記短尺光ファイバを研磨する工程と、を含むことを特徴とする光モジュールの製造方法。 - 前記光フェルールは、突起が設けられ、
前記突起は前記フレキシブル回路体に設けられた位置決め孔と係合されていることを特徴とする請求項1に記載した光モジュールの製造方法。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007268924A JP4957503B2 (ja) | 2007-10-16 | 2007-10-16 | 光モジュールおよび光モジュールの製造方法 |
| US12/247,648 US7665905B2 (en) | 2007-10-16 | 2008-10-08 | Optical module and method for making the same |
| CN200810170248.7A CN101414032B (zh) | 2007-10-16 | 2008-10-16 | 光学模块及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007268924A JP4957503B2 (ja) | 2007-10-16 | 2007-10-16 | 光モジュールおよび光モジュールの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009098343A JP2009098343A (ja) | 2009-05-07 |
| JP4957503B2 true JP4957503B2 (ja) | 2012-06-20 |
Family
ID=40534294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007268924A Active JP4957503B2 (ja) | 2007-10-16 | 2007-10-16 | 光モジュールおよび光モジュールの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7665905B2 (ja) |
| JP (1) | JP4957503B2 (ja) |
| CN (1) | CN101414032B (ja) |
Families Citing this family (29)
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| KR20100133944A (ko) * | 2008-03-26 | 2010-12-22 | 스미토모 덴키 고교 가부시키가이샤 | 광전 변환 모듈 및 그 조립 방법 및, 그것을 이용한 광전 대응 정보 처리 기기 |
| TW201136077A (en) * | 2010-04-01 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Device and method for manufacturing optical couple connetor |
| JP5530332B2 (ja) * | 2010-10-27 | 2014-06-25 | 日本航空電子工業株式会社 | 光モジュール |
| JP2012208146A (ja) * | 2011-03-29 | 2012-10-25 | Sumitomo Electric Ind Ltd | 光学モジュールの製造方法 |
| JP5608125B2 (ja) | 2011-03-29 | 2014-10-15 | 日東電工株式会社 | 光電気混載基板およびその製法 |
| JP2013098292A (ja) | 2011-10-31 | 2013-05-20 | Yamaichi Electronics Co Ltd | 光モジュール |
| US9323014B2 (en) * | 2012-05-28 | 2016-04-26 | Mellanox Technologies Ltd. | High-speed optical module with flexible printed circuit board |
| KR101327989B1 (ko) * | 2012-06-07 | 2013-11-13 | 주식회사 옵토웰 | 광송수신 모듈 제조방법 |
| US9039302B2 (en) | 2012-06-15 | 2015-05-26 | Tyco Electronics Corporation | Interposer |
| US8821040B2 (en) * | 2012-06-15 | 2014-09-02 | Tyco Electronics Corporation | Interposer |
| JP5737254B2 (ja) * | 2012-09-26 | 2015-06-17 | 日立金属株式会社 | 光通信モジュール |
| TWI560481B (en) * | 2012-10-29 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Photoelectric converting module |
| JP6001415B2 (ja) * | 2012-10-31 | 2016-10-05 | 京セラ株式会社 | 光装置用基板および光装置 |
| JP6300442B2 (ja) | 2013-01-18 | 2018-03-28 | オリンパス株式会社 | 光伝送モジュールおよび撮像装置 |
| DE102013101267B4 (de) * | 2013-02-08 | 2020-01-16 | HARTING Electronics GmbH | Gerätebuchse |
| US9804348B2 (en) | 2013-07-04 | 2017-10-31 | Mellanox Technologies, Ltd. | Silicon photonics connector |
| US9682500B2 (en) * | 2013-09-30 | 2017-06-20 | Apple Inc. | Insert molded parts and methods for forming the same |
| WO2017042028A1 (de) * | 2015-09-08 | 2017-03-16 | Continental Automotive Gmbh | Verfahren zur herstellung einer elektrooptischen schnittstelle, elektrooptische schnittstelle und steuergerät |
| CN111736278A (zh) * | 2016-04-28 | 2020-10-02 | 苏州旭创科技有限公司 | 光模块 |
| US10608357B2 (en) | 2017-09-25 | 2020-03-31 | Molex, Llc | Electrical connection device |
| CN109560408B (zh) * | 2017-09-25 | 2020-08-25 | 美国莫列斯有限公司 | 电连接装置 |
| US12474529B2 (en) * | 2019-06-24 | 2025-11-18 | Te Connectivity Solutions Gmbh | Interposer |
| US12204149B2 (en) | 2019-06-24 | 2025-01-21 | Te Connectivity Solutions Gmbh | Interposer with feedback |
| EP3901677A1 (en) * | 2020-04-21 | 2021-10-27 | Koninklijke Philips N.V. | Optical transmission of signals to or from an electronic element |
| CN113970815B (zh) * | 2020-07-22 | 2022-11-08 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| US12360323B2 (en) | 2022-10-18 | 2025-07-15 | Mellanox Technologies, Ltd | Mechanical thermal interface for improved heat dissipation in network transceivers |
| US12242116B2 (en) * | 2023-07-10 | 2025-03-04 | Twinstar Technologies Co. Ltd. | Optical fiber connector device and method |
| WO2025070310A1 (ja) * | 2023-09-29 | 2025-04-03 | 慶應義塾 | 一括成型マルチ光伝送シートアセンブリの製造方法 |
| WO2025070309A1 (ja) * | 2023-09-29 | 2025-04-03 | 慶應義塾 | 一括成型マルチ光伝送シートアセンブリの製造方法 |
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-
2007
- 2007-10-16 JP JP2007268924A patent/JP4957503B2/ja active Active
-
2008
- 2008-10-08 US US12/247,648 patent/US7665905B2/en not_active Expired - Fee Related
- 2008-10-16 CN CN200810170248.7A patent/CN101414032B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101414032B (zh) | 2015-05-13 |
| US20090097802A1 (en) | 2009-04-16 |
| CN101414032A (zh) | 2009-04-22 |
| US7665905B2 (en) | 2010-02-23 |
| JP2009098343A (ja) | 2009-05-07 |
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