JP4943611B2 - 高屈折率感圧接着剤 - Google Patents
高屈折率感圧接着剤 Download PDFInfo
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- JP4943611B2 JP4943611B2 JP2001533919A JP2001533919A JP4943611B2 JP 4943611 B2 JP4943611 B2 JP 4943611B2 JP 2001533919 A JP2001533919 A JP 2001533919A JP 2001533919 A JP2001533919 A JP 2001533919A JP 4943611 B2 JP4943611 B2 JP 4943611B2
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- Prior art keywords
- monomer
- refractive index
- group
- acrylate
- aromatic
- Prior art date
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- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- JMCVCHBBHPFWBF-UHFFFAOYSA-N n,n-diethyl-2-methylprop-2-enamide Chemical compound CCN(CC)C(=O)C(C)=C JMCVCHBBHPFWBF-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
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- 238000000643 oven drying Methods 0.000 description 1
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- 229950000688 phenothiazine Drugs 0.000 description 1
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- 239000002985 plastic film Substances 0.000 description 1
- 229920006112 polar polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
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- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
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- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
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- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- 238000004809 thin layer chromatography Methods 0.000 description 1
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- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1999/025276 WO2001030872A1 (en) | 1999-10-28 | 1999-10-28 | Compositions and articles made therefrom |
| USPCT/US99/25276 | 1999-10-28 | ||
| US99/25276 | 1999-10-28 | ||
| US09/605,500 US6663978B1 (en) | 2000-06-28 | 2000-06-28 | High refractive index pressure-sensitive adhesives |
| US09/605,500 | 2000-06-28 | ||
| PCT/US2000/021817 WO2001030933A1 (en) | 1999-10-28 | 2000-08-10 | High refractive index pressure-sensitive adhesives |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011289641A Division JP2012107246A (ja) | 1999-10-28 | 2011-12-28 | 高屈折率感圧接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003535921A JP2003535921A (ja) | 2003-12-02 |
| JP2003535921A5 JP2003535921A5 (https=) | 2007-09-20 |
| JP4943611B2 true JP4943611B2 (ja) | 2012-05-30 |
Family
ID=26795854
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
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| JP2001533919A Expired - Fee Related JP4943611B2 (ja) | 1999-10-28 | 2000-08-10 | 高屈折率感圧接着剤 |
| JP2011289641A Withdrawn JP2012107246A (ja) | 1999-10-28 | 2011-12-28 | 高屈折率感圧接着剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011289641A Withdrawn JP2012107246A (ja) | 1999-10-28 | 2011-12-28 | 高屈折率感圧接着剤 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1244756B2 (https=) |
| JP (2) | JP4943611B2 (https=) |
| KR (1) | KR100707745B1 (https=) |
| CA (1) | CA2386847A1 (https=) |
| DE (1) | DE60015394T3 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4640740B2 (ja) * | 2000-12-04 | 2011-03-02 | 日東電工株式会社 | 感圧性接着剤組成物、感圧性接着シート及び光学フィルム |
| JP4641628B2 (ja) * | 2001-01-23 | 2011-03-02 | 日本化薬株式会社 | 接着剤組成物、光ディスク用接着剤組成物及びその硬化物。 |
| EP1956064B1 (en) | 2005-11-21 | 2010-10-13 | Soken Chemical & Engineering Co. Ltd., | Adhesive composition for optical film, adhesive sheet, and optical member using such adhesive composition |
| KR100932888B1 (ko) * | 2006-07-21 | 2009-12-21 | 주식회사 엘지화학 | 광학 보상된 아크릴계 점착제 조성물, 이를 포함하는편광판 및 액정표시소자 |
| KR100775440B1 (ko) * | 2006-12-20 | 2007-11-12 | 동우신테크 주식회사 | 리세드로네이트 나트륨 헤미펜타히드레이트의 제조방법 |
| JP5493158B2 (ja) * | 2007-06-19 | 2014-05-14 | サイデン化学株式会社 | 光学用粘着剤組成物および光学機能性フィルム |
| US8378046B2 (en) | 2007-10-19 | 2013-02-19 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
| US8309650B2 (en) | 2007-10-30 | 2012-11-13 | 3M Innovative Properties Company | High refractive index adhesives |
| JP5649274B2 (ja) * | 2007-11-07 | 2015-01-07 | 日本合成化学工業株式会社 | 偏光板用粘着剤及び粘着剤層付き偏光板 |
| JP5362291B2 (ja) * | 2008-08-26 | 2013-12-11 | 日東電工株式会社 | アクリル系粘着剤組成物、アクリル系粘着剤層およびアクリル系粘着テープ又はシート |
| WO2010118421A1 (en) * | 2009-04-10 | 2010-10-14 | Pixeloptics, Inc. | Curable adhesive compositions |
| JP5729973B2 (ja) * | 2010-11-11 | 2015-06-03 | 日本合成化学工業株式会社 | アクリル系粘着剤、光学部材用粘着剤、粘着剤層付き光学部材、画像表示装置 |
| JP5524640B2 (ja) * | 2010-01-26 | 2014-06-18 | 大王製紙株式会社 | 粘着シート |
| JP5318025B2 (ja) * | 2010-04-14 | 2013-10-16 | 日東電工株式会社 | 液晶パネルへの光学フィルム貼着固定用感圧性接着剤組成物及び感圧性接着シート、並びに光学フィルム |
| JP5517716B2 (ja) * | 2010-04-14 | 2014-06-11 | 日東電工株式会社 | 導電性フィルム用感圧性接着剤組成物及び感圧性接着シート、並びに導電性フィルム |
| JP2012021148A (ja) * | 2010-06-16 | 2012-02-02 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤、光学部材用粘着剤、粘着剤層付き光学部材、画像表示装置 |
| US9074040B2 (en) | 2010-12-20 | 2015-07-07 | Mitsui Chemicals, Inc. | Curable adhesive compositions |
| US10202477B2 (en) | 2012-12-28 | 2019-02-12 | 3M Innovative Properties Company | Optically clear hot melt processable high refractive index adhesives |
| JP6216519B2 (ja) * | 2013-03-04 | 2017-10-18 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
| JP6066937B2 (ja) * | 2014-01-28 | 2017-01-25 | 藤森工業株式会社 | 光拡散粘着剤層、及び光拡散粘着フィルム |
| JP2017193595A (ja) * | 2016-04-18 | 2017-10-26 | 日東電工株式会社 | 透明難燃テープおよび難燃性構造体 |
| JP6717884B2 (ja) * | 2018-07-05 | 2020-07-08 | 藤森工業株式会社 | 粘着剤層、及び粘着フィルム |
| JP6644129B2 (ja) * | 2018-12-27 | 2020-02-12 | 藤森工業株式会社 | 粘着剤層、及び粘着フィルム |
| KR20250162956A (ko) * | 2020-03-24 | 2025-11-19 | 닛토덴코 가부시키가이샤 | 점착제 조성물, 점착제 및 점착 시트 |
| JP7690305B2 (ja) * | 2020-03-24 | 2025-06-10 | 日東電工株式会社 | 粘着剤組成物、粘着剤および粘着シート |
| JP7092823B2 (ja) * | 2020-04-07 | 2022-06-28 | 藤森工業株式会社 | 粘着剤層、及び粘着フィルム |
| CN112898475B (zh) * | 2021-01-21 | 2022-01-25 | 西南石油大学 | 一种两亲性沥青质抑制剂及其制备方法 |
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| NL270084A (https=) † | 1960-10-10 | 1900-01-01 | ||
| JPS58186277A (ja) * | 1982-04-26 | 1983-10-31 | Victor Co Of Japan Ltd | デイジタル信号記録方式 |
| JPH0230353B2 (ja) † | 1982-05-11 | 1990-07-05 | Kanzaki Paper Mfg Co Ltd | Kanatsusetsuchakuzaisoseibutsu |
| JPS59111114A (ja) * | 1982-12-16 | 1984-06-27 | Sekisui Chem Co Ltd | 接着層を有する偏光板 |
| DE3321502C2 (de) † | 1983-06-15 | 1985-05-30 | Chemische Werke Hüls AG, 4370 Marl | Polymere Ester der Acrylsäure und Methacrylsäure mit aromatischen Thioetheralkoholen und Verfahren zu ihrer Herstellung |
| JPH01278518A (ja) * | 1988-04-28 | 1989-11-08 | Shinnakamura Kagaku Kogyo Kk | 感圧性接着剤用組成物 |
| JPH02248482A (ja) * | 1989-03-23 | 1990-10-04 | Fujikura Kasei Co Ltd | 光硬化性感圧接着剤組成物 |
| JPH0331309A (ja) * | 1989-06-27 | 1991-02-12 | Matsushita Electric Works Ltd | 高屈折率樹脂作製用組成物 |
| JPH04264178A (ja) * | 1991-02-18 | 1992-09-18 | Nissei Kagaku Kogyosho:Kk | 透明材料用の光硬化型接着剤組成物 |
| JP3498157B2 (ja) † | 1994-06-01 | 2004-02-16 | 綜研化学株式会社 | 液晶素子用感圧接着剤組成物および液晶素子 |
| JP3775760B2 (ja) * | 1995-04-28 | 2006-05-17 | 日本化薬株式会社 | 紫外線硬化型接着剤組成物、硬化物、物品及び接着方法 |
| CN1097080C (zh) * | 1995-06-26 | 2002-12-25 | 美国3M公司 | 光漫射粘合剂 |
| JPH09111189A (ja) * | 1995-10-18 | 1997-04-28 | Sumitomo Seika Chem Co Ltd | 光学接着剤用組成物 |
| JPH09194798A (ja) * | 1996-01-12 | 1997-07-29 | Japan Synthetic Rubber Co Ltd | 粘着性樹脂組成物 |
| JP4516632B2 (ja) * | 1999-04-20 | 2010-08-04 | 日東電工株式会社 | アクリル系感圧性接着剤組成物とその接着シ―ト類 |
| JP4578625B2 (ja) * | 1999-06-10 | 2010-11-10 | 電気化学工業株式会社 | 硬化性樹脂組成物、接着剤組成物、接合体及び接着方法 |
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2000
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- 2000-08-10 JP JP2001533919A patent/JP4943611B2/ja not_active Expired - Fee Related
- 2000-08-10 CA CA002386847A patent/CA2386847A1/en not_active Abandoned
- 2000-08-10 DE DE60015394T patent/DE60015394T3/de not_active Expired - Lifetime
- 2000-08-10 KR KR1020027005385A patent/KR100707745B1/ko not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| DE60015394T2 (de) | 2005-10-27 |
| JP2003535921A (ja) | 2003-12-02 |
| DE60015394T3 (de) | 2009-04-16 |
| KR100707745B1 (ko) | 2007-04-17 |
| DE60015394D1 (de) | 2004-12-02 |
| EP1244756B1 (en) | 2004-10-27 |
| EP1244756B2 (en) | 2008-08-20 |
| EP1244756A1 (en) | 2002-10-02 |
| JP2012107246A (ja) | 2012-06-07 |
| CA2386847A1 (en) | 2001-05-03 |
| KR20020082830A (ko) | 2002-10-31 |
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