JP4937581B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP4937581B2
JP4937581B2 JP2005370587A JP2005370587A JP4937581B2 JP 4937581 B2 JP4937581 B2 JP 4937581B2 JP 2005370587 A JP2005370587 A JP 2005370587A JP 2005370587 A JP2005370587 A JP 2005370587A JP 4937581 B2 JP4937581 B2 JP 4937581B2
Authority
JP
Japan
Prior art keywords
wiring board
electronic device
main surface
semiconductor memory
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005370587A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007173606A5 (enExample
JP2007173606A (ja
Inventor
稔 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2005370587A priority Critical patent/JP4937581B2/ja
Publication of JP2007173606A publication Critical patent/JP2007173606A/ja
Publication of JP2007173606A5 publication Critical patent/JP2007173606A5/ja
Application granted granted Critical
Publication of JP4937581B2 publication Critical patent/JP4937581B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2005370587A 2005-12-22 2005-12-22 電子装置 Expired - Fee Related JP4937581B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005370587A JP4937581B2 (ja) 2005-12-22 2005-12-22 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005370587A JP4937581B2 (ja) 2005-12-22 2005-12-22 電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011207291A Division JP2012023390A (ja) 2011-09-22 2011-09-22 電子装置

Publications (3)

Publication Number Publication Date
JP2007173606A JP2007173606A (ja) 2007-07-05
JP2007173606A5 JP2007173606A5 (enExample) 2009-02-12
JP4937581B2 true JP4937581B2 (ja) 2012-05-23

Family

ID=38299738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005370587A Expired - Fee Related JP4937581B2 (ja) 2005-12-22 2005-12-22 電子装置

Country Status (1)

Country Link
JP (1) JP4937581B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023390A (ja) * 2011-09-22 2012-02-02 Renesas Electronics Corp 電子装置
MX390912B (es) * 2016-08-05 2025-03-21 Nissan Motor Condensador de semiconductores.
JP6969847B2 (ja) * 2018-04-25 2021-11-24 京セラ株式会社 配線基板
JP7128098B2 (ja) * 2018-11-27 2022-08-30 京セラ株式会社 配線基板
JP2022067888A (ja) * 2020-10-21 2022-05-09 国立研究開発法人産業技術総合研究所 個体識別子の付与方法および個体識別子を有する対象物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0211338A (ja) * 1988-06-30 1990-01-16 Toshiba Corp ワイヤドットプリンタ
JPH02148756A (ja) * 1988-11-29 1990-06-07 Mitsubishi Electric Corp 集積回路のパッケージ
JP3123338B2 (ja) * 1993-04-05 2001-01-09 松下電器産業株式会社 集積回路装置
JPH07142624A (ja) * 1993-11-17 1995-06-02 Nec Corp 半導体装置
JP3417095B2 (ja) * 1994-11-21 2003-06-16 富士通株式会社 半導体装置
JP3644662B2 (ja) * 1997-10-29 2005-05-11 株式会社ルネサステクノロジ 半導体モジュール
JP2000077820A (ja) * 1998-09-02 2000-03-14 Mitsubishi Electric Corp 実装基板
JP2000243894A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体モジュール及びその製造方法
JP3798597B2 (ja) * 1999-11-30 2006-07-19 富士通株式会社 半導体装置
JP4562881B2 (ja) * 2000-08-18 2010-10-13 イビデン株式会社 半導体モジュールの製造方法
JP2002305286A (ja) * 2001-02-01 2002-10-18 Mitsubishi Electric Corp 半導体モジュールおよび電子部品
JP2004064604A (ja) * 2002-07-31 2004-02-26 Kyocera Corp 送受信制御装置
JP3819901B2 (ja) * 2003-12-25 2006-09-13 松下電器産業株式会社 半導体装置及びそれを用いた電子機器
JP2005302815A (ja) * 2004-04-07 2005-10-27 Toshiba Corp 積層型半導体パッケージおよびその製造方法

Also Published As

Publication number Publication date
JP2007173606A (ja) 2007-07-05

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