JP4928784B2 - Ｌｅｄ及びｌｅｄの取付構造 - Google Patents

Ｌｅｄ及びｌｅｄの取付構造 Download PDF

Info

Publication number
JP4928784B2
JP4928784B2 JP2005517388A JP2005517388A JP4928784B2 JP 4928784 B2 JP4928784 B2 JP 4928784B2 JP 2005517388 A JP2005517388 A JP 2005517388A JP 2005517388 A JP2005517388 A JP 2005517388A JP 4928784 B2 JP4928784 B2 JP 4928784B2
Authority
JP
Japan
Prior art keywords
led
cathode
anode
pattern
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005517388A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2005074044A1 (ja
Inventor
賢治 米田
茂樹 増村
秀明 柏原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
CCS Inc
Original Assignee
Mitsubishi Chemical Corp
CCS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp, CCS Inc filed Critical Mitsubishi Chemical Corp
Priority to JP2005517388A priority Critical patent/JP4928784B2/ja
Publication of JPWO2005074044A1 publication Critical patent/JPWO2005074044A1/ja
Application granted granted Critical
Publication of JP4928784B2 publication Critical patent/JP4928784B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2005517388A 2004-01-30 2004-12-22 Ｌｅｄ及びｌｅｄの取付構造 Expired - Lifetime JP4928784B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005517388A JP4928784B2 (ja) 2004-01-30 2004-12-22 Ｌｅｄ及びｌｅｄの取付構造

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004022755 2004-01-30
JP2004022755 2004-01-30
PCT/JP2004/019213 WO2005074044A1 (ja) 2004-01-30 2004-12-22 Led及びledの取付構造
JP2005517388A JP4928784B2 (ja) 2004-01-30 2004-12-22 Ｌｅｄ及びｌｅｄの取付構造

Publications (2)

Publication Number Publication Date
JPWO2005074044A1 JPWO2005074044A1 (ja) 2008-01-10
JP4928784B2 true JP4928784B2 (ja) 2012-05-09

Family

ID=34823846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005517388A Expired - Lifetime JP4928784B2 (ja) 2004-01-30 2004-12-22 Ｌｅｄ及びｌｅｄの取付構造

Country Status (9)

Country Link
US (1) US7589356B2 (enExample)
EP (1) EP1710845A4 (enExample)
JP (1) JP4928784B2 (enExample)
KR (1) KR101139181B1 (enExample)
CN (1) CN100454589C (enExample)
CA (1) CA2553576C (enExample)
MY (1) MY144709A (enExample)
TW (1) TW200526900A (enExample)
WO (1) WO2005074044A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100133580A1 (en) * 2008-01-02 2010-06-03 Everlight Electronics Co., Ltd. Light emitting diode package structure and conductive structure and manufacturing method thereof
US7978286B2 (en) * 2008-06-24 2011-07-12 Toshiba Mobile Display Co., Ltd. Illumination unit and liquid crystal display device
JP2010182803A (ja) * 2009-02-04 2010-08-19 Seiwa Electric Mfg Co Ltd 発光装置
US20110089448A1 (en) * 2009-10-20 2011-04-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Single Encapsulant For A Plurality Of Light Sources
CN102082221A (zh) * 2009-11-27 2011-06-01 亿光电子工业股份有限公司 发光二极管封装结构及其传导结构、制作方法
CN101859864A (zh) * 2010-05-26 2010-10-13 邓旭恒 大功率直插式发光二极管
US12255193B2 (en) * 2019-06-05 2025-03-18 Industry-University Cooperation Foundation Hanyang University Erica Campus Method for transferring micro LED

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077633A (en) * 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier
JPH0459168A (ja) * 1990-06-27 1992-02-26 Nissan Motor Co Ltd 鋳造装置
JP2583809Y2 (ja) * 1990-09-27 1998-10-27 三洋電機株式会社 発光ダイオードランプ
JP2975893B2 (ja) 1996-07-08 1999-11-10 シーシーエス株式会社 照明装置の製造方法
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
TW406442B (en) * 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3348843B2 (ja) 1999-02-25 2002-11-20 日亜化学工業株式会社 発光ダイオード及びそれを用いたドットマトリックスディスプレイ
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP3833019B2 (ja) 1999-08-31 2006-10-11 日亜化学工業株式会社 発光ダイオード
JP3640598B2 (ja) * 2000-06-21 2005-04-20 清川 晋 発光ダイオード及びその製造方法
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP4055373B2 (ja) * 2001-05-31 2008-03-05 日亜化学工業株式会社 発光装置の製造方法
JP3726720B2 (ja) * 2001-07-05 2005-12-14 ソニー株式会社 投受光デバイス構造
JP2003188418A (ja) 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ
JP2005513815A (ja) 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ

Also Published As

Publication number Publication date
CA2553576C (en) 2014-02-11
TW200526900A (en) 2005-08-16
TWI339716B (enExample) 2011-04-01
CN100454589C (zh) 2009-01-21
JPWO2005074044A1 (ja) 2008-01-10
EP1710845A1 (en) 2006-10-11
MY144709A (en) 2011-10-31
CA2553576A1 (en) 2005-08-11
US7589356B2 (en) 2009-09-15
HK1097956A1 (en) 2007-07-06
WO2005074044A1 (ja) 2005-08-11
KR20070006731A (ko) 2007-01-11
EP1710845A4 (en) 2012-07-04
KR101139181B1 (ko) 2012-04-26
US20070158671A1 (en) 2007-07-12
CN1906774A (zh) 2007-01-31

Similar Documents

Publication Publication Date Title
TWI476347B (zh) 照明裝置（三）
US9349930B2 (en) LED module and lighting assembly
JP2012532441A (ja) 発光ダイオードパッケージ
US20100117100A1 (en) Light-emitting module and illumination device
KR100898817B1 (ko) 열 방출이 가능한 발광 다이오드 전구
KR20180035206A (ko) 발광 다이오드 모듈 및 조명 장치
KR20100117451A (ko) 방열홀을 가지는 인쇄회로기판 및 이를 이용한 ｌｅｄ 조명
KR101055074B1 (ko) 발광 장치
JPWO2005074044A1 (ja) Ｌｅｄ及びｌｅｄの取付構造
KR20090086989A (ko) 반도체 발광모듈
JP2013069530A (ja) Ｌｅｄ照明装置
TW201131105A (en) LED illumination device and illuminating apparatus employing the same
JP2011119278A (ja) Ｌｅｄ点灯装置
JP2007012856A (ja) Ｌｅｄ装置及びｌｅｄ装置用筐体
JP2009231148A (ja) 照明装置
KR100936223B1 (ko) 발광 다이오드 램프
JP2009147258A (ja) Ｌｅｄパッケージおよび発光モジュール
JP2009212126A (ja) 照明装置
KR102148846B1 (ko) 인쇄회로기판 조립체 및 이를 포함하는 발광장치
KR101963738B1 (ko) 고방열 형상 제어기술이 적용된 구리 유닛을 구비하는 엘이디 조명 장치
KR100823276B1 (ko) 발광 디바이스 모듈
KR101175754B1 (ko) 발광 장치
JP7062918B2 (ja) 照明装置
JP2012009631A (ja) 発光装置及び照明装置
US20260076016A1 (en) Light emitting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071115

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20100825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20100825

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101005

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20101111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110201

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110401

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120207

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120213

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150217

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4928784

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term