KR101139181B1 - Ｌｅｄ 및 ｌｅｄ의 장착 구조 - Google Patents

Ｌｅｄ 및 ｌｅｄ의 장착 구조 Download PDF

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Publication number
KR101139181B1
KR101139181B1 KR1020067015374A KR20067015374A KR101139181B1 KR 101139181 B1 KR101139181 B1 KR 101139181B1 KR 1020067015374 A KR1020067015374 A KR 1020067015374A KR 20067015374 A KR20067015374 A KR 20067015374A KR 101139181 B1 KR101139181 B1 KR 101139181B1
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KR
South Korea
Prior art keywords
led
case
cathode
anode
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067015374A
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English (en)
Korean (ko)
Other versions
KR20070006731A (ko
Inventor
겐지 요네다
시게키 마스무라
히데아키 가시하라
Original Assignee
미쓰비시 가가꾸 가부시키가이샤
씨씨에스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 가가꾸 가부시키가이샤, 씨씨에스 가부시키가이샤 filed Critical 미쓰비시 가가꾸 가부시키가이샤
Publication of KR20070006731A publication Critical patent/KR20070006731A/ko
Application granted granted Critical
Publication of KR101139181B1 publication Critical patent/KR101139181B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR1020067015374A 2004-01-30 2004-12-22 Ｌｅｄ 및 ｌｅｄ의 장착 구조 Expired - Fee Related KR101139181B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00022755 2004-01-30
JP2004022755 2004-01-30
PCT/JP2004/019213 WO2005074044A1 (ja) 2004-01-30 2004-12-22 Led及びledの取付構造

Publications (2)

Publication Number Publication Date
KR20070006731A KR20070006731A (ko) 2007-01-11
KR101139181B1 true KR101139181B1 (ko) 2012-04-26

Family

ID=34823846

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067015374A Expired - Fee Related KR101139181B1 (ko) 2004-01-30 2004-12-22 Ｌｅｄ 및 ｌｅｄ의 장착 구조

Country Status (9)

Country Link
US (1) US7589356B2 (enExample)
EP (1) EP1710845A4 (enExample)
JP (1) JP4928784B2 (enExample)
KR (1) KR101139181B1 (enExample)
CN (1) CN100454589C (enExample)
CA (1) CA2553576C (enExample)
MY (1) MY144709A (enExample)
TW (1) TW200526900A (enExample)
WO (1) WO2005074044A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100133580A1 (en) * 2008-01-02 2010-06-03 Everlight Electronics Co., Ltd. Light emitting diode package structure and conductive structure and manufacturing method thereof
US7978286B2 (en) * 2008-06-24 2011-07-12 Toshiba Mobile Display Co., Ltd. Illumination unit and liquid crystal display device
JP2010182803A (ja) * 2009-02-04 2010-08-19 Seiwa Electric Mfg Co Ltd 発光装置
US20110089448A1 (en) * 2009-10-20 2011-04-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Single Encapsulant For A Plurality Of Light Sources
CN102082221A (zh) * 2009-11-27 2011-06-01 亿光电子工业股份有限公司 发光二极管封装结构及其传导结构、制作方法
CN101859864A (zh) * 2010-05-26 2010-10-13 邓旭恒 大功率直插式发光二极管
US12255193B2 (en) * 2019-06-05 2025-03-18 Industry-University Cooperation Foundation Hanyang University Erica Campus Method for transferring micro LED

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
US20030038290A1 (en) * 2001-07-05 2003-02-27 Hidekuni Aizawa Light emitting and receiving device structure
JP2003188418A (ja) * 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077633A (en) * 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier
JPH0459168A (ja) * 1990-06-27 1992-02-26 Nissan Motor Co Ltd 鋳造装置
JP2583809Y2 (ja) * 1990-09-27 1998-10-27 三洋電機株式会社 発光ダイオードランプ
JP2975893B2 (ja) 1996-07-08 1999-11-10 シーシーエス株式会社 照明装置の製造方法
TW406442B (en) * 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3348843B2 (ja) 1999-02-25 2002-11-20 日亜化学工業株式会社 発光ダイオード及びそれを用いたドットマトリックスディスプレイ
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP3833019B2 (ja) 1999-08-31 2006-10-11 日亜化学工業株式会社 発光ダイオード
JP3640598B2 (ja) * 2000-06-21 2005-04-20 清川 晋 発光ダイオード及びその製造方法
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP4055373B2 (ja) * 2001-05-31 2008-03-05 日亜化学工業株式会社 発光装置の製造方法
JP2005513815A (ja) 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
US20030038290A1 (en) * 2001-07-05 2003-02-27 Hidekuni Aizawa Light emitting and receiving device structure
JP2003188418A (ja) * 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ

Also Published As

Publication number Publication date
CA2553576C (en) 2014-02-11
JP4928784B2 (ja) 2012-05-09
TW200526900A (en) 2005-08-16
TWI339716B (enExample) 2011-04-01
CN100454589C (zh) 2009-01-21
JPWO2005074044A1 (ja) 2008-01-10
EP1710845A1 (en) 2006-10-11
MY144709A (en) 2011-10-31
CA2553576A1 (en) 2005-08-11
US7589356B2 (en) 2009-09-15
HK1097956A1 (en) 2007-07-06
WO2005074044A1 (ja) 2005-08-11
KR20070006731A (ko) 2007-01-11
EP1710845A4 (en) 2012-07-04
US20070158671A1 (en) 2007-07-12
CN1906774A (zh) 2007-01-31

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