CN100454589C - Led及led的安装构造 - Google Patents

Led及led的安装构造 Download PDF

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Publication number
CN100454589C
CN100454589C CNB2004800411338A CN200480041133A CN100454589C CN 100454589 C CN100454589 C CN 100454589C CN B2004800411338 A CNB2004800411338 A CN B2004800411338A CN 200480041133 A CN200480041133 A CN 200480041133A CN 100454589 C CN100454589 C CN 100454589C
Authority
CN
China
Prior art keywords
led
mentioned
housing
anode
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004800411338A
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English (en)
Chinese (zh)
Other versions
CN1906774A (zh
Inventor
米田贤治
增村茂树
柏原秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CCS Inc
Original Assignee
CCS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CCS Inc filed Critical CCS Inc
Publication of CN1906774A publication Critical patent/CN1906774A/zh
Application granted granted Critical
Publication of CN100454589C publication Critical patent/CN100454589C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CNB2004800411338A 2004-01-30 2004-12-22 Led及led的安装构造 Expired - Fee Related CN100454589C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP022755/2004 2004-01-30
JP2004022755 2004-01-30

Publications (2)

Publication Number Publication Date
CN1906774A CN1906774A (zh) 2007-01-31
CN100454589C true CN100454589C (zh) 2009-01-21

Family

ID=34823846

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800411338A Expired - Fee Related CN100454589C (zh) 2004-01-30 2004-12-22 Led及led的安装构造

Country Status (9)

Country Link
US (1) US7589356B2 (enExample)
EP (1) EP1710845A4 (enExample)
JP (1) JP4928784B2 (enExample)
KR (1) KR101139181B1 (enExample)
CN (1) CN100454589C (enExample)
CA (1) CA2553576C (enExample)
MY (1) MY144709A (enExample)
TW (1) TW200526900A (enExample)
WO (1) WO2005074044A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100133580A1 (en) * 2008-01-02 2010-06-03 Everlight Electronics Co., Ltd. Light emitting diode package structure and conductive structure and manufacturing method thereof
US7978286B2 (en) * 2008-06-24 2011-07-12 Toshiba Mobile Display Co., Ltd. Illumination unit and liquid crystal display device
JP2010182803A (ja) * 2009-02-04 2010-08-19 Seiwa Electric Mfg Co Ltd 発光装置
US20110089448A1 (en) * 2009-10-20 2011-04-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Single Encapsulant For A Plurality Of Light Sources
CN102082221A (zh) * 2009-11-27 2011-06-01 亿光电子工业股份有限公司 发光二极管封装结构及其传导结构、制作方法
CN101859864A (zh) * 2010-05-26 2010-10-13 邓旭恒 大功率直插式发光二极管
US12255193B2 (en) * 2019-06-05 2025-03-18 Industry-University Cooperation Foundation Hanyang University Erica Campus Method for transferring micro LED

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459168U (enExample) * 1990-09-27 1992-05-21
JP2000312033A (ja) * 1999-02-25 2000-11-07 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたドットマトリックスディスプレイ
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP2001077427A (ja) * 1999-08-31 2001-03-23 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いた表示装置
JP2002009348A (ja) * 2000-06-21 2002-01-11 Susumu Kiyokawa 発光ダイオード及びその製造方法
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
JP2003188418A (ja) * 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077633A (en) * 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier
JPH0459168A (ja) * 1990-06-27 1992-02-26 Nissan Motor Co Ltd 鋳造装置
JP2975893B2 (ja) 1996-07-08 1999-11-10 シーシーエス株式会社 照明装置の製造方法
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
TW406442B (en) * 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3726720B2 (ja) * 2001-07-05 2005-12-14 ソニー株式会社 投受光デバイス構造
JP2005513815A (ja) 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459168U (enExample) * 1990-09-27 1992-05-21
JP2000312033A (ja) * 1999-02-25 2000-11-07 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたドットマトリックスディスプレイ
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP2001077427A (ja) * 1999-08-31 2001-03-23 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いた表示装置
JP2002009348A (ja) * 2000-06-21 2002-01-11 Susumu Kiyokawa 発光ダイオード及びその製造方法
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
JP2003188418A (ja) * 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ

Also Published As

Publication number Publication date
CA2553576C (en) 2014-02-11
JP4928784B2 (ja) 2012-05-09
TW200526900A (en) 2005-08-16
TWI339716B (enExample) 2011-04-01
JPWO2005074044A1 (ja) 2008-01-10
EP1710845A1 (en) 2006-10-11
MY144709A (en) 2011-10-31
CA2553576A1 (en) 2005-08-11
US7589356B2 (en) 2009-09-15
HK1097956A1 (en) 2007-07-06
WO2005074044A1 (ja) 2005-08-11
KR20070006731A (ko) 2007-01-11
EP1710845A4 (en) 2012-07-04
KR101139181B1 (ko) 2012-04-26
US20070158671A1 (en) 2007-07-12
CN1906774A (zh) 2007-01-31

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