TW200526900A - LED and LED mounting structure - Google Patents

LED and LED mounting structure Download PDF

Info

Publication number
TW200526900A
TW200526900A TW093141784A TW93141784A TW200526900A TW 200526900 A TW200526900 A TW 200526900A TW 093141784 A TW093141784 A TW 093141784A TW 93141784 A TW93141784 A TW 93141784A TW 200526900 A TW200526900 A TW 200526900A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
base
frame
cathode
Prior art date
Application number
TW093141784A
Other languages
English (en)
Chinese (zh)
Other versions
TWI339716B (enExample
Inventor
Kenji Yoneda
Shigeki Masumura
Hideaki Kashihara
Original Assignee
Ccs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ccs Inc filed Critical Ccs Inc
Publication of TW200526900A publication Critical patent/TW200526900A/zh
Application granted granted Critical
Publication of TWI339716B publication Critical patent/TWI339716B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW093141784A 2004-01-30 2004-12-31 LED and LED mounting structure TW200526900A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004022755 2004-01-30

Publications (2)

Publication Number Publication Date
TW200526900A true TW200526900A (en) 2005-08-16
TWI339716B TWI339716B (enExample) 2011-04-01

Family

ID=34823846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093141784A TW200526900A (en) 2004-01-30 2004-12-31 LED and LED mounting structure

Country Status (9)

Country Link
US (1) US7589356B2 (enExample)
EP (1) EP1710845A4 (enExample)
JP (1) JP4928784B2 (enExample)
KR (1) KR101139181B1 (enExample)
CN (1) CN100454589C (enExample)
CA (1) CA2553576C (enExample)
MY (1) MY144709A (enExample)
TW (1) TW200526900A (enExample)
WO (1) WO2005074044A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100133580A1 (en) * 2008-01-02 2010-06-03 Everlight Electronics Co., Ltd. Light emitting diode package structure and conductive structure and manufacturing method thereof
US7978286B2 (en) * 2008-06-24 2011-07-12 Toshiba Mobile Display Co., Ltd. Illumination unit and liquid crystal display device
JP2010182803A (ja) * 2009-02-04 2010-08-19 Seiwa Electric Mfg Co Ltd 発光装置
US20110089448A1 (en) * 2009-10-20 2011-04-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Single Encapsulant For A Plurality Of Light Sources
CN102082221A (zh) * 2009-11-27 2011-06-01 亿光电子工业股份有限公司 发光二极管封装结构及其传导结构、制作方法
CN101859864A (zh) * 2010-05-26 2010-10-13 邓旭恒 大功率直插式发光二极管
US12255193B2 (en) * 2019-06-05 2025-03-18 Industry-University Cooperation Foundation Hanyang University Erica Campus Method for transferring micro LED

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077633A (en) * 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier
JPH0459168A (ja) * 1990-06-27 1992-02-26 Nissan Motor Co Ltd 鋳造装置
JP2583809Y2 (ja) * 1990-09-27 1998-10-27 三洋電機株式会社 発光ダイオードランプ
JP2975893B2 (ja) 1996-07-08 1999-11-10 シーシーエス株式会社 照明装置の製造方法
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
TW406442B (en) * 1998-07-09 2000-09-21 Sumitomo Electric Industries White colored LED and intermediate colored LED
JP3348843B2 (ja) 1999-02-25 2002-11-20 日亜化学工業株式会社 発光ダイオード及びそれを用いたドットマトリックスディスプレイ
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP3833019B2 (ja) 1999-08-31 2006-10-11 日亜化学工業株式会社 発光ダイオード
JP3640598B2 (ja) * 2000-06-21 2005-04-20 清川 晋 発光ダイオード及びその製造方法
JP2002252372A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 発光ダイオード
JP4055373B2 (ja) * 2001-05-31 2008-03-05 日亜化学工業株式会社 発光装置の製造方法
JP3726720B2 (ja) * 2001-07-05 2005-12-14 ソニー株式会社 投受光デバイス構造
JP2003188418A (ja) 2001-12-17 2003-07-04 Seiwa Electric Mfg Co Ltd Ｌｅｄランプ
JP2005513815A (ja) 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ

Also Published As

Publication number Publication date
CA2553576C (en) 2014-02-11
JP4928784B2 (ja) 2012-05-09
TWI339716B (enExample) 2011-04-01
CN100454589C (zh) 2009-01-21
JPWO2005074044A1 (ja) 2008-01-10
EP1710845A1 (en) 2006-10-11
MY144709A (en) 2011-10-31
CA2553576A1 (en) 2005-08-11
US7589356B2 (en) 2009-09-15
HK1097956A1 (en) 2007-07-06
WO2005074044A1 (ja) 2005-08-11
KR20070006731A (ko) 2007-01-11
EP1710845A4 (en) 2012-07-04
KR101139181B1 (ko) 2012-04-26
US20070158671A1 (en) 2007-07-12
CN1906774A (zh) 2007-01-31

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees