JP4916546B2 - 多結晶シリコンのテクスチャ表面形成用酸腐食溶液およびその使用方法 - Google Patents
多結晶シリコンのテクスチャ表面形成用酸腐食溶液およびその使用方法 Download PDFInfo
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- JP4916546B2 JP4916546B2 JP2009500687A JP2009500687A JP4916546B2 JP 4916546 B2 JP4916546 B2 JP 4916546B2 JP 2009500687 A JP2009500687 A JP 2009500687A JP 2009500687 A JP2009500687 A JP 2009500687A JP 4916546 B2 JP4916546 B2 JP 4916546B2
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- polycrystalline silicon
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims description 36
- 230000007797 corrosion Effects 0.000 title claims description 29
- 238000005260 corrosion Methods 0.000 title claims description 29
- 239000002253 acid Substances 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 26
- 239000007800 oxidant agent Substances 0.000 claims description 13
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical group [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical group [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 5
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N nitrate group Chemical group [N+](=O)([O-])[O-] NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- 235000010344 sodium nitrate Nutrition 0.000 claims description 4
- 239000004317 sodium nitrate Substances 0.000 claims description 4
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical compound [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 claims description 3
- 235000010288 sodium nitrite Nutrition 0.000 claims description 3
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 2
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 235000010289 potassium nitrite Nutrition 0.000 claims description 2
- 239000004304 potassium nitrite Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Silicon Compounds (AREA)
Description
20mol/L濃度のフッ化水素酸溶液の中に5molの硝酸カリウム(KNO3)を添加し、均質に混合した後、その溶液の温度を20℃に制御するとともに、スライスされた125*125の多結晶シリコンウェーハを入れ、10分間腐食を行った。次いで、該多結晶シリコンウェーハを太陽電池に製造した。該太陽電池の変換効率、曲線因子、開放電圧および電流はそれぞれ14.49%、0.765、598mV、4.95Aである。腐食された多結晶シリコンの表面状態を図1に示す。
20mol/L濃度のフッ化水素酸1Lの中に2.34molの亜硝酸アンモニウム(NH4NO2)を添加し、均質に混合した後、その溶液の温度を−10℃に制御するとともに、125*125の多結晶シリコンウェーハを入れ、20分間腐食を行った。次いで、該多結晶シリコンウェーハを太陽電池に製造した。該太陽電池の変換効率、曲線因子、開放電圧および電流はそれぞれ15.38%、0.768、611mV、5.12Aである。腐食された多結晶シリコンの表面状態を図2に示す。
20mol/L濃度のフッ化水素酸1Lの中に1.17molの硝酸ナトリウム(NaNO3)を添加し、均質に混合した後、その溶液の温度を10℃に制御するとともに、さらに0.15molの亜硝酸ナトリウム(NaNO2)を加えた。125*125の多結晶シリコンウェーハを入れ、20分間腐食を行った。次いで、該多結晶シリコンウェーハを太陽電池に製造した。該太陽電池の変換効率、曲線因子、開放電圧および電流はそれぞれ15.03%、0.771、608mV、5.01Aである。腐食された多結晶シリコンの表面状態を図3に示す。
Claims (7)
- 酸化剤とフッ化水素酸溶液とを混合してなる酸腐食溶液であって、
前記酸化剤が硝酸塩または亜硝酸塩であることを特徴とする多結晶シリコンのテクスチャ表面形成用酸腐食溶液。 - 前記硝酸塩が硝酸ナトリウム、硝酸カリウムまたは硝酸アンモニウムであり、
前記亜硝酸塩が亜硝酸ナトリウム、亜硝酸カリウムまたは亜硝酸アンモニウムである、請求項1に記載の多結晶シリコンのテクスチャ表面形成用酸腐食溶液。 - 前記酸化剤の濃度は0.1〜10mol/Lであり、
前記フッ化水素酸の濃度は10〜25mol/Lである、請求項1に記載の多結晶シリコンのテクスチャ表面形成用酸腐食溶液。 - 前記酸化剤の濃度は0.3〜5mol/Lであり、
前記フッ化水素酸の濃度は15〜22mol/Lである、請求項1に記載の多結晶シリコンのテクスチャ表面形成用酸腐食溶液。 - スライスされた多結晶シリコンウェーハを酸腐食溶液に入れ腐食反応を行う際、その反応時間は30秒間〜20分間であり、酸腐食溶液の温度は−10℃〜25℃である、請求項1、2または3のいずれか1項に記載の酸腐食溶液を使用する、多結晶シリコンのテクスチャ表面の形成方法。
- 反応温度が0℃〜15℃であることを特徴とする請求項5に記載の多結晶シリコンのテクスチャ表面の形成方法。
- 前記反応時間が1分間〜10分間である、請求項5に記載の多結晶シリコンのテクスチャ表面の形成方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610065676.4 | 2006-03-21 | ||
CNB2006100656764A CN100467670C (zh) | 2006-03-21 | 2006-03-21 | 一种用于制备多晶硅绒面的酸腐蚀溶液及其使用方法 |
PCT/CN2006/001078 WO2007107053A1 (fr) | 2006-03-21 | 2006-05-24 | Solution de corrosion acide utilisee dans la preparation de velours a base de polysilicium et procede d'application associe |
Publications (2)
Publication Number | Publication Date |
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JP2009530834A JP2009530834A (ja) | 2009-08-27 |
JP4916546B2 true JP4916546B2 (ja) | 2012-04-11 |
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JP2009500687A Expired - Fee Related JP4916546B2 (ja) | 2006-03-21 | 2006-05-24 | 多結晶シリコンのテクスチャ表面形成用酸腐食溶液およびその使用方法 |
Country Status (8)
Country | Link |
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US (1) | US8298438B2 (ja) |
EP (1) | EP2006892A4 (ja) |
JP (1) | JP4916546B2 (ja) |
KR (1) | KR101028000B1 (ja) |
CN (1) | CN100467670C (ja) |
AU (1) | AU2006340678B2 (ja) |
RU (1) | RU2400862C2 (ja) |
WO (1) | WO2007107053A1 (ja) |
Families Citing this family (24)
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GB0601319D0 (en) | 2006-01-23 | 2006-03-01 | Imp Innovations Ltd | A method of fabricating pillars composed of silicon-based material |
GB0709165D0 (en) | 2007-05-11 | 2007-06-20 | Nexeon Ltd | A silicon anode for a rechargeable battery |
GB0713898D0 (en) | 2007-07-17 | 2007-08-29 | Nexeon Ltd | A method of fabricating structured particles composed of silcon or a silicon-based material and their use in lithium rechargeable batteries |
US20090236317A1 (en) * | 2008-03-21 | 2009-09-24 | Midwest Research Institute | Anti-reflection etching of silicon surfaces catalyzed with ionic metal solutions |
GB2464158B (en) | 2008-10-10 | 2011-04-20 | Nexeon Ltd | A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries |
GB2464157B (en) | 2008-10-10 | 2010-09-01 | Nexeon Ltd | A method of fabricating structured particles composed of silicon or a silicon-based material |
GB2470056B (en) | 2009-05-07 | 2013-09-11 | Nexeon Ltd | A method of making silicon anode material for rechargeable cells |
US9853292B2 (en) | 2009-05-11 | 2017-12-26 | Nexeon Limited | Electrode composition for a secondary battery cell |
GB2470190B (en) | 2009-05-11 | 2011-07-13 | Nexeon Ltd | A binder for lithium ion rechargeable battery cells |
JP5304477B2 (ja) * | 2009-06-23 | 2013-10-02 | 信越半導体株式会社 | シリコンウェーハのエッチング方法 |
GB201005979D0 (en) | 2010-04-09 | 2010-05-26 | Nexeon Ltd | A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries |
GB201009519D0 (en) | 2010-06-07 | 2010-07-21 | Nexeon Ltd | An additive for lithium ion rechargeable battery cells |
GB201014707D0 (en) | 2010-09-03 | 2010-10-20 | Nexeon Ltd | Electroactive material |
GB201014706D0 (en) | 2010-09-03 | 2010-10-20 | Nexeon Ltd | Porous electroactive material |
EP2618382B1 (en) * | 2010-09-14 | 2021-05-05 | Shin-Etsu Chemical Co., Ltd. | Solar cell and manufacturing method thereof |
CN102181936A (zh) * | 2010-10-26 | 2011-09-14 | 江阴浚鑫科技有限公司 | 一种制作多晶硅绒面的方法及腐蚀液 |
CN102479868B (zh) * | 2010-11-25 | 2014-04-02 | 浙江贝盛光伏股份有限公司 | 快速调节多晶制绒减薄量的方法 |
CN102330154B (zh) * | 2011-07-27 | 2012-08-01 | 常州时创能源科技有限公司 | 一种用于多晶硅片制绒的酸性制绒液及其使用方法 |
CN102330091B (zh) * | 2011-07-27 | 2012-07-04 | 常州时创能源科技有限公司 | 一种多晶硅片酸性制绒液的添加剂及使用方法 |
JP2013084835A (ja) * | 2011-10-12 | 2013-05-09 | Hikari Kobayashi | シリコンウェハの表面処理方法及び半導体装置の製造方法並びに太陽電池 |
WO2018035122A1 (en) | 2016-08-16 | 2018-02-22 | Intuitive Surgical Operations, Inc. | Augmented accuracy using large diameter shape fiber |
CN108330545A (zh) * | 2018-01-24 | 2018-07-27 | 浙江向日葵光能科技股份有限公司 | 一种用于金刚线切割多晶硅片制绒的添加剂及方法 |
CN110592681A (zh) * | 2019-09-30 | 2019-12-20 | 四川英发太阳能科技有限公司 | 一种提升返工片效率良率的制绒工艺 |
CN111607399A (zh) * | 2020-04-29 | 2020-09-01 | 苏州美法光电科技有限公司 | 一种用于硅片晶圆再生技术的表层腐蚀液制备方法 |
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- 2006-03-21 CN CNB2006100656764A patent/CN100467670C/zh active Active
- 2006-05-24 KR KR1020087025607A patent/KR101028000B1/ko not_active IP Right Cessation
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- 2006-05-24 AU AU2006340678A patent/AU2006340678B2/en not_active Ceased
- 2006-05-24 RU RU2008138748/28A patent/RU2400862C2/ru not_active IP Right Cessation
- 2006-05-24 WO PCT/CN2006/001078 patent/WO2007107053A1/zh active Application Filing
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JP2000160367A (ja) * | 1998-11-24 | 2000-06-13 | Daikin Ind Ltd | エッチレートが高速化されたエッチング液 |
JP2005136081A (ja) * | 2003-10-29 | 2005-05-26 | Sharp Corp | 太陽電池の製造方法 |
JP2005183505A (ja) * | 2003-12-17 | 2005-07-07 | Kansai Tlo Kk | 多孔質層付きシリコン基板を製造する方法 |
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AU2006340678A1 (en) | 2007-09-27 |
CN1821446A (zh) | 2006-08-23 |
KR101028000B1 (ko) | 2011-04-13 |
US20100224593A1 (en) | 2010-09-09 |
EP2006892A1 (en) | 2008-12-24 |
JP2009530834A (ja) | 2009-08-27 |
CN100467670C (zh) | 2009-03-11 |
KR20090005016A (ko) | 2009-01-12 |
RU2400862C2 (ru) | 2010-09-27 |
RU2008138748A (ru) | 2010-04-27 |
WO2007107053A1 (fr) | 2007-09-27 |
AU2006340678B2 (en) | 2010-12-16 |
EP2006892A4 (en) | 2012-02-29 |
US8298438B2 (en) | 2012-10-30 |
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