JP4914012B2 - 構造体の製造方法 - Google Patents

構造体の製造方法 Download PDF

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Publication number
JP4914012B2
JP4914012B2 JP2005036791A JP2005036791A JP4914012B2 JP 4914012 B2 JP4914012 B2 JP 4914012B2 JP 2005036791 A JP2005036791 A JP 2005036791A JP 2005036791 A JP2005036791 A JP 2005036791A JP 4914012 B2 JP4914012 B2 JP 4914012B2
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Japan
Prior art keywords
resin
catalyst
plating
electroless plating
metal
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Expired - Fee Related
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JP2005036791A
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English (en)
Japanese (ja)
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JP2006219752A5 (enExample
JP2006219752A (ja
Inventor
高士 中村
透 田
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Canon Inc
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Canon Inc
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Priority to JP2005036791A priority Critical patent/JP4914012B2/ja
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Publication of JP2006219752A5 publication Critical patent/JP2006219752A5/ja
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  • Chemically Coating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2005036791A 2005-02-14 2005-02-14 構造体の製造方法 Expired - Fee Related JP4914012B2 (ja)

Priority Applications (1)

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JP2005036791A JP4914012B2 (ja) 2005-02-14 2005-02-14 構造体の製造方法

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JP2005036791A JP4914012B2 (ja) 2005-02-14 2005-02-14 構造体の製造方法

Publications (3)

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JP2006219752A JP2006219752A (ja) 2006-08-24
JP2006219752A5 JP2006219752A5 (enExample) 2008-02-14
JP4914012B2 true JP4914012B2 (ja) 2012-04-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018214202A1 (zh) * 2017-05-23 2018-11-29 深圳市华星光电技术有限公司 纳米线栅结构的制作方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100889482B1 (ko) * 2007-12-10 2009-03-19 한국전자통신연구원 나노 임프린트 공정을 이용한 촉매의 패턴형성방법
TWI466604B (zh) * 2008-12-08 2014-12-21 Unimicron Technology Corp 線路板及其製程
CN101808462B (zh) * 2009-02-13 2012-05-30 欣兴电子股份有限公司 线路板及其制造方法
JP2011134840A (ja) * 2009-12-24 2011-07-07 Toshiba Corp インプリント材及び処理方法
KR20170117394A (ko) * 2015-02-16 2017-10-23 인텔 코포레이션 마이크로전자 빌드-업 층들 및 그 형성 방법들
JP7630227B2 (ja) * 2019-10-24 2025-02-17 Ｔｏｐｐａｎホールディングス株式会社 パターン膜及び物品
KR102686710B1 (ko) * 2021-11-29 2024-07-19 와이엠티 주식회사 표면조도가 낮은 금속박을 이용한 기판의 회로패턴 형성방법
US12460301B2 (en) 2022-03-15 2025-11-04 The Boeing Company Catalyst solution for electroless plating devoid of an amine

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JPS57101683A (en) * 1980-12-17 1982-06-24 Tanaka Kikinzoku Kogyo Kk Preparation of electroforming mold
JPS6318093A (ja) * 1986-07-09 1988-01-25 Hokoku Jushi Kogyo Kk 電鋳金型の製造方法
JPS63210293A (ja) * 1987-02-24 1988-08-31 Hokoku Jushi Kogyo Kk 電鋳金型の製造方法
JPH02153087A (ja) * 1988-12-05 1990-06-12 Hitachi Chem Co Ltd 電鋳型の製作方法
JPH03126887A (ja) * 1989-10-12 1991-05-30 Ikegami Kaken Kogyo Kk 電鋳加工による成形型の製造方法
JPH0590209A (ja) * 1991-09-27 1993-04-09 Seiko Epson Corp 配線パターンの構造および配線パターンの形成方法
JP2970147B2 (ja) * 1991-12-09 1999-11-02 凸版印刷株式会社 フレネルレンズ電鋳用母型及びこれを用いた金型の製造方法
JPH0864933A (ja) * 1994-08-24 1996-03-08 Hitachi Cable Ltd 射出成形回路基板の製造方法
JPH10183361A (ja) * 1996-12-20 1998-07-14 Hitachi Ltd 立体成形回路部品とその製造方法
JPH10277699A (ja) * 1997-04-03 1998-10-20 Nikon Corp 金型および金型製造方法、ならびに、母型形成方法、電鋳品製造方法
JP3343522B2 (ja) * 1998-09-17 2002-11-11 ポリプラスチックス株式会社 プラスチック成形品の製造方法
JP2002374055A (ja) * 2001-06-14 2002-12-26 Toray Eng Co Ltd 金属回路パターン形成方法
JP2003073844A (ja) * 2001-09-05 2003-03-12 Hitachi Cable Ltd 無電解めっき方法
JP4266310B2 (ja) * 2003-01-31 2009-05-20 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法
JP2004270021A (ja) * 2003-03-11 2004-09-30 Ritsumeikan 微細金属構造体の製造方法
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
JP4317375B2 (ja) * 2003-03-20 2009-08-19 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018214202A1 (zh) * 2017-05-23 2018-11-29 深圳市华星光电技术有限公司 纳米线栅结构的制作方法
US10710350B2 (en) 2017-05-23 2020-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Nanometer wire grid structure fabrication method

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JP2006219752A (ja) 2006-08-24

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