JP4905069B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

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Publication number
JP4905069B2
JP4905069B2 JP2006304478A JP2006304478A JP4905069B2 JP 4905069 B2 JP4905069 B2 JP 4905069B2 JP 2006304478 A JP2006304478 A JP 2006304478A JP 2006304478 A JP2006304478 A JP 2006304478A JP 4905069 B2 JP4905069 B2 JP 4905069B2
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JP
Japan
Prior art keywords
glass
phosphor
emitting device
light emitting
light
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JP2006304478A
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English (en)
Japanese (ja)
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JP2008124153A5 (enExample
JP2008124153A (ja
Inventor
好伸 末広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2006304478A priority Critical patent/JP4905069B2/ja
Publication of JP2008124153A publication Critical patent/JP2008124153A/ja
Publication of JP2008124153A5 publication Critical patent/JP2008124153A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2006304478A 2006-11-09 2006-11-09 発光装置及びその製造方法 Active JP4905069B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006304478A JP4905069B2 (ja) 2006-11-09 2006-11-09 発光装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006304478A JP4905069B2 (ja) 2006-11-09 2006-11-09 発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008124153A JP2008124153A (ja) 2008-05-29
JP2008124153A5 JP2008124153A5 (enExample) 2009-02-12
JP4905069B2 true JP4905069B2 (ja) 2012-03-28

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ID=39508604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006304478A Active JP4905069B2 (ja) 2006-11-09 2006-11-09 発光装置及びその製造方法

Country Status (1)

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JP (1) JP4905069B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5327042B2 (ja) 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
BRPI1008263A8 (pt) * 2009-05-28 2018-08-14 Koninklijke Philips Electronics Nv Dispositivo de iluminação e método para montagem de um dispositivo de iluminação
JP4686643B2 (ja) * 2009-07-03 2011-05-25 シャープ株式会社 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
WO2011065322A1 (ja) * 2009-11-30 2011-06-03 コニカミノルタオプト株式会社 発光ダイオードユニットの製造方法
WO2011065321A1 (ja) * 2009-11-30 2011-06-03 コニカミノルタオプト株式会社 発光ダイオードユニットの製造方法
JP5710126B2 (ja) * 2010-01-14 2015-04-30 ザイ＆エス株式会社 Ｌｅｄ照明装置
JP2012222005A (ja) * 2011-04-04 2012-11-12 Mitsubishi Chemicals Corp 発光装置、繊維複合体、及び繊維複合体の製造方法
KR101871501B1 (ko) * 2011-07-29 2018-06-27 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
DE102012109905B4 (de) * 2012-10-17 2021-11-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen
CN102945912A (zh) * 2012-12-06 2013-02-27 上海顿格电子贸易有限公司 Led发光元器件支架
JP2016519850A (ja) * 2013-04-08 2016-07-07 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Ｌｅｄモジュールの製造方法
JP6172455B2 (ja) * 2013-10-07 2017-08-02 豊田合成株式会社 発光装置
DE102013114691A1 (de) * 2013-12-20 2015-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug
JP6572540B2 (ja) * 2014-12-26 2019-09-11 日亜化学工業株式会社 パッケージ、発光装置およびその製造方法
JP2018032796A (ja) * 2016-08-25 2018-03-01 京セラ株式会社 発光素子収納用パッケージおよび発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347600A (ja) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Ｌｅｄ実装基板
KR100693969B1 (ko) * 2003-03-10 2007-03-12 도요다 고세이 가부시키가이샤 고체 소자 디바이스 및 그 제조 방법
JP4465989B2 (ja) * 2003-06-18 2010-05-26 旭硝子株式会社 発光ダイオード素子
WO2005020338A1 (ja) * 2003-08-26 2005-03-03 Sumitomo Electric Industries, Ltd. 半導体発光素子搭載部材、それを用いた発光ダイオード構成部材、およびそれを用いた発光ダイオード
JP2006156668A (ja) * 2004-11-29 2006-06-15 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2006196565A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
JP4855869B2 (ja) * 2006-08-25 2012-01-18 日亜化学工業株式会社 発光装置の製造方法

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Publication number Publication date
JP2008124153A (ja) 2008-05-29

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