JP4896260B2 - 裏面支持構造付きウエハ収納容器 - Google Patents
裏面支持構造付きウエハ収納容器 Download PDFInfo
- Publication number
- JP4896260B2 JP4896260B2 JP2010500523A JP2010500523A JP4896260B2 JP 4896260 B2 JP4896260 B2 JP 4896260B2 JP 2010500523 A JP2010500523 A JP 2010500523A JP 2010500523 A JP2010500523 A JP 2010500523A JP 4896260 B2 JP4896260 B2 JP 4896260B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- shelf
- storage container
- support
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003860 storage Methods 0.000 title claims description 186
- 235000012431 wafers Nutrition 0.000 claims description 771
- 238000003825 pressing Methods 0.000 claims description 22
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 230000033228 biological regulation Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 201
- 230000002093 peripheral effect Effects 0.000 description 35
- 230000003014 reinforcing effect Effects 0.000 description 35
- 239000002245 particle Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 16
- -1 polybutylene terephthalate Polymers 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 230000001815 facial effect Effects 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- 230000002146 bilateral effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001154 acute effect Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002801 charged material Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010500523A JP4896260B2 (ja) | 2008-02-27 | 2008-07-18 | 裏面支持構造付きウエハ収納容器 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008046176 | 2008-02-27 | ||
JP2008046176 | 2008-02-27 | ||
PCT/JP2008/062999 WO2009107254A1 (fr) | 2008-02-27 | 2008-07-18 | Conteneur de stockage de tranches avec structure de support arrière |
JP2010500523A JP4896260B2 (ja) | 2008-02-27 | 2008-07-18 | 裏面支持構造付きウエハ収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009107254A1 JPWO2009107254A1 (ja) | 2011-06-30 |
JP4896260B2 true JP4896260B2 (ja) | 2012-03-14 |
Family
ID=41015664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010500523A Active JP4896260B2 (ja) | 2008-02-27 | 2008-07-18 | 裏面支持構造付きウエハ収納容器 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4896260B2 (fr) |
TW (1) | TWI519456B (fr) |
WO (1) | WO2009107254A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220102175A1 (en) * | 2020-09-30 | 2022-03-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor substrate boat and methods of using the same |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5449974B2 (ja) * | 2009-10-16 | 2014-03-19 | ゴールド工業株式会社 | 精密基板収納容器 |
JP2011108715A (ja) * | 2009-11-13 | 2011-06-02 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP5473691B2 (ja) * | 2010-03-16 | 2014-04-16 | 株式会社ディスコ | 収容カセット |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP5459787B2 (ja) * | 2010-06-17 | 2014-04-02 | 信越ポリマー株式会社 | 基板収納容器 |
KR101738219B1 (ko) * | 2011-11-08 | 2017-05-19 | 미라이얼 가부시키가이샤 | 웨이퍼 수납용기 |
JP6190726B2 (ja) * | 2014-01-17 | 2017-08-30 | 信越ポリマー株式会社 | 基板収納容器 |
WO2015118775A1 (fr) * | 2014-02-07 | 2015-08-13 | 村田機械株式会社 | Dispositif d'injection de gaz et élément auxiliaire |
CN105083739B (zh) * | 2014-05-23 | 2019-06-18 | 宁波市北仑区大矸德鑫精密模具制造厂 | 一种用于模具的防尘帽 |
JP2016119408A (ja) * | 2014-12-22 | 2016-06-30 | ミライアル株式会社 | 基板収納容器 |
KR101637498B1 (ko) | 2015-03-24 | 2016-07-07 | 피코앤테라(주) | 웨이퍼 수납용기 |
CN107431036B (zh) * | 2015-04-10 | 2021-09-28 | 信越聚合物株式会社 | 基板收纳容器 |
EP3291289B1 (fr) * | 2016-08-30 | 2022-08-03 | Brooks Automation (Germany) GmbH | Compartiment de réticule et plaque de diffuseur |
KR102677319B1 (ko) * | 2017-02-27 | 2024-06-24 | 미라이얼 가부시키가이샤 | 기판 수납 용기 |
JP6653788B1 (ja) * | 2018-06-12 | 2020-02-26 | ミライアル株式会社 | 基板収納容器 |
JP2021049126A (ja) * | 2019-09-25 | 2021-04-01 | くら寿司株式会社 | 飲食物収容皿組み付け具 |
KR102342156B1 (ko) * | 2020-04-16 | 2021-12-22 | 주식회사 글린트머티리얼즈 | 미끄럼 방지 패드를 포함한 반도체 웨이퍼 이송용 캐리어 |
JP7388712B2 (ja) | 2020-07-22 | 2023-11-29 | 信越ポリマー株式会社 | 収納容器の製造方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62295429A (ja) * | 1986-02-20 | 1987-12-22 | Mitsui Toatsu Chem Inc | ウエハ−キヤリヤ− |
JPH06204195A (ja) * | 1993-01-06 | 1994-07-22 | Tokuyama Ceramics Kk | ウエハ洗浄装置用ウエハボート |
JPH07161805A (ja) * | 1993-12-02 | 1995-06-23 | Mitsubishi Electric Corp | 半導体ウェハ収納ケースおよびその搬送装置,投入・払出し装置 |
JPH08222622A (ja) * | 1995-02-10 | 1996-08-30 | Hitachi Electron Eng Co Ltd | ウェハキャリア |
WO1998056676A1 (fr) * | 1997-06-13 | 1998-12-17 | Kakizaki Manufacturing Co., Ltd. | Recipient en feuille mince pourvu d'un couvercle |
WO1999052140A1 (fr) * | 1998-04-06 | 1999-10-14 | Dainichi Shoji K. K. | Recipient |
JP2000040736A (ja) * | 1998-07-23 | 2000-02-08 | Seiko Epson Corp | ウェハ収納装置 |
JP2003197728A (ja) * | 2001-12-27 | 2003-07-11 | Aitec:Kk | 基板収納カセット |
JP2004095942A (ja) * | 2002-09-02 | 2004-03-25 | Kokusai Electric Semiconductor Service Inc | ウェーハカセット |
JP2004247598A (ja) * | 2003-02-14 | 2004-09-02 | Kyocera Corp | 基板載置治具 |
JP2008034879A (ja) * | 2007-10-15 | 2008-02-14 | Miraial Kk | 薄板支持容器 |
-
2008
- 2008-07-18 JP JP2010500523A patent/JP4896260B2/ja active Active
- 2008-07-18 WO PCT/JP2008/062999 patent/WO2009107254A1/fr active Application Filing
-
2009
- 2009-02-20 TW TW098105481A patent/TWI519456B/zh active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62295429A (ja) * | 1986-02-20 | 1987-12-22 | Mitsui Toatsu Chem Inc | ウエハ−キヤリヤ− |
JPH06204195A (ja) * | 1993-01-06 | 1994-07-22 | Tokuyama Ceramics Kk | ウエハ洗浄装置用ウエハボート |
JPH07161805A (ja) * | 1993-12-02 | 1995-06-23 | Mitsubishi Electric Corp | 半導体ウェハ収納ケースおよびその搬送装置,投入・払出し装置 |
JPH08222622A (ja) * | 1995-02-10 | 1996-08-30 | Hitachi Electron Eng Co Ltd | ウェハキャリア |
WO1998056676A1 (fr) * | 1997-06-13 | 1998-12-17 | Kakizaki Manufacturing Co., Ltd. | Recipient en feuille mince pourvu d'un couvercle |
WO1999052140A1 (fr) * | 1998-04-06 | 1999-10-14 | Dainichi Shoji K. K. | Recipient |
JP2000040736A (ja) * | 1998-07-23 | 2000-02-08 | Seiko Epson Corp | ウェハ収納装置 |
JP2003197728A (ja) * | 2001-12-27 | 2003-07-11 | Aitec:Kk | 基板収納カセット |
JP2004095942A (ja) * | 2002-09-02 | 2004-03-25 | Kokusai Electric Semiconductor Service Inc | ウェーハカセット |
JP2004247598A (ja) * | 2003-02-14 | 2004-09-02 | Kyocera Corp | 基板載置治具 |
JP2008034879A (ja) * | 2007-10-15 | 2008-02-14 | Miraial Kk | 薄板支持容器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220102175A1 (en) * | 2020-09-30 | 2022-03-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor substrate boat and methods of using the same |
Also Published As
Publication number | Publication date |
---|---|
TWI519456B (zh) | 2016-02-01 |
TW200946418A (en) | 2009-11-16 |
JPWO2009107254A1 (ja) | 2011-06-30 |
WO2009107254A1 (fr) | 2009-09-03 |
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